CN211565606U

CN211565606U - Fixing device and detection equipment

Info

Publication number: CN211565606U
Application number: CN201921810601.3U
Authority: CN
Inventors: 范铎; 张鹏斌; 张嵩; 李海卫; 陈鲁
Original assignee: Shenzhen Zhongke Flying Test Technology Co ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2020-09-25
Anticipated expiration: 2029-10-25

Abstract

The utility model discloses a fixing device and check out test set, fixing device includes including: the fixed disc is provided with a disc surface for fixing the object to be supported, and the disc surface comprises a bearing area for bearing the object to be supported; the clamping mechanism comprises a clamping fixing column and at least two positioning columns, wherein the clamping fixing column is used for providing clamping fixing force for the object to be supported, one end of each positioning column is detachably connected to the fixed disk, and the positioning columns are distributed on the disk surface of the fixed disk along the edge of the bearing area; the clamping fixing column is movably arranged on the fixed disc and can move between a first position and a second position; the clamping fixing columns are located on the distribution circumference of the positioning columns at the first position; and at the second position, the clamping and fixing column is positioned at the outer side of the distribution circumference of the positioning column. The device can fix the object to be supported in an edge clamping manner, and can avoid damaging the object to be supported during fixation.

Description

Fixing device and detection equipment

Technical Field

The utility model belongs to the technical field of semiconductor check out test set technique and specifically relates to be used for carrying out fixed device to the wafer in wafer production, testing process. The utility model discloses still relate to and be equipped with wafer fixing device's wafer check out test set.

Background

At present, in the working process of the wafer detection equipment, the wafer needs to be taken out from a wafer box for placing the wafer by a mechanical arm, placed on a wafer fixing device, and then fixed on the wafer fixing device by adopting a vacuum or electrostatic adsorption mode and the like.

For a conventional wafer (the back surface of the wafer can be contacted), the wafer is usually fixed on a wafer fixing device by vacuum adsorption and the like, and for a wafer with special requirements (for example, the front surface and the back surface of the wafer are completely not contacted or are only allowed to contact a small range of the outer diameter of the back surface), the wafer needs to be fixed by a special fixing mode, mainly including two fixing modes of self-friction and Bernoulli.

For the self-friction fixing mode, a local micro area on the back surface of the wafer needs to be contacted during fixing, and the friction force between the rubber material and the wafer is utilized to play a role in fixing the wafer. In addition, rubber aging affects the fixing accuracy and reliability, which is also a problem that must be considered.

For the bernoulli fixing mode, pure bernoulli fixing is developed by using the bernoulli principle, a vacuum generator is not needed, a product is sucked in a cyclone mode in a non-contact mode, and the detection speed is greatly influenced because the movement direction of the wafer is not fixedly restricted. In addition, the stability of the wafer fixing is difficult to guarantee in the mode.

Both of the above-mentioned two fixing methods have limitations in certain specific implementations, which causes a problem of uncertain factors or efficiency reduction in subsequent processing and detection processes of the wafer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fixing device. The device can fix the object to be supported in an edge clamping manner, and the object to be supported can be prevented from being damaged during fixation.

Another object of the present invention is to provide a detection apparatus equipped with the fixing device.

In order to achieve the above object, the present invention provides a fixing device, including:

the fixed disc is provided with a disc surface for fixing the object to be supported, and the disc surface comprises a bearing area for bearing the object to be supported;

the clamping mechanism comprises a clamping fixing column and at least two positioning columns, wherein the clamping fixing column is used for providing clamping fixing force for the object to be supported, one end of each positioning column is detachably connected to the fixed disk, and the positioning columns are distributed on the disk surface of the fixed disk along the edge of the bearing area;

the clamping fixing column is movably arranged on the fixed disc and can move between a first position and a second position; the clamping fixing columns are located on the distribution circumference of the positioning columns at the first position; and at the second position, the clamping and fixing column is positioned at the outer side of the distribution circumference of the positioning column.

Preferably, the method further comprises the following steps: the supporting columns are used for providing supporting force for the object to be supported, the direction of the clamping fixing force is intersected with the direction of the supporting force, and the supporting columns and the positioning columns are distributed in the disc surface of the fixed disc along the circumferential direction.

Preferably, the positioning column can also be used for providing a supporting force for the object to be supported.

Preferably, the one end of reference column is equipped with the locating surface that is used for treating the support and carries out radial positioning, the one end that the reference column was equipped with the locating surface is equipped with first holding surface second holding surface, the one end of support column is equipped with the second holding surface, first holding surface and second holding surface are used for treating the support from treating the support edge and support the second holding surface.

Preferably, the first supporting surface of the positioning column and the second supporting surface of the supporting column are located on the same plane.

Preferably, the first supporting surface of the positioning column and the second supporting surface of the supporting column are inclined surfaces inclined toward the disk surface of the fixed disk, so that the first supporting surface and the second supporting surface only contact with the edge round corner of the object to be supported after the object to be supported is placed.

Preferably, the number of the positioning columns is two, and the moving direction of the clamping fixing column is perpendicular to a connecting line between the two positioning columns; the number of the supporting columns is two, and the two supporting columns are respectively located on two sides of the moving direction of the clamping fixing column.

Preferably, the first supporting surface of the positioning column is an annular step surface formed at the upper end of the positioning column, and the positioning surface is an outer peripheral surface formed at the upper end of the positioning column and perpendicular to the cylindrical boss of the annular step surface.

Preferably, threaded holes corresponding to the positioning columns and the supporting columns are formed in the disc surfaces of the fixing discs, and the connecting ends of the positioning columns and the supporting columns are detachably connected with the threaded holes through external threads respectively.

Preferably, the disc surface of the fixed disc is provided with a taking and placing mechanism avoiding area; the avoiding area of the taking and placing mechanism comprises at least one opening area formed on the disc surface, and the shape of the opening area is matched with the shape of a manipulator for taking and placing the object to be supported.

Preferably, the clamping device further comprises a clamping driving component for driving the clamping fixing column to move, the clamping driving component is arranged on the fixed disc, the clamping fixing column is connected with a clamping force output end of the clamping driving component, and the clamping driving component drives the clamping fixing column to move between a first position and a second position in a reciprocating mode.

Preferably, the device further comprises a feeding piece monitoring device, the feeding piece monitoring device comprises an in-place sensing piece moving together with the clamping fixing column, the fixing disc is provided with an in-place sensor, and the in-place sensing piece moves to a position triggering the in-place sensor in a clamping in-place state.

Preferably, the film feeding device comprises an over-position sensing piece moving together with the clamping fixing column, the fixing disc is provided with an over-position sensor, and the over-position sensing piece moves to a position triggering the over-position sensor in a clamping over-position state.

Preferably, the device further comprises a detection process state monitoring device, wherein the detection process state monitoring device comprises at least one group of correlation sensors arranged on the outer edge of the fixed disk, and correlation paths of the correlation sensors are parallel to the disk surface and are spaced from the disk surface.

Preferably, two sets of correlation sensors are provided, the correlation paths of the two sets of correlation sensors radially intersecting in an upper region of the disk surface.

To achieve the above another object, the present invention provides a detecting device, including:

the fixing device is used for fixing the wafer to be detected;

the detection system is used for detecting the wafer fixed by the fixing device;

a manipulator for placing the wafer on the disk surface of the fixing device before detection and taking the wafer away from the disk surface of the fixing device after detection

The utility model provides a fixing device is equipped with fixture in the quotation of fixed disk, fixture is suitable for the support of treating that the fixed back of mode through edge centre gripping can not contact or the back only allows in the contact of edge part, reference column and centre gripping fixed column provide the centre gripping fixed power for treating the support jointly, make and treat that the support atress is even, avoid damaging and treat the support, its simple structure, convenient operation, operation are stable, help improving fixed stability and detection efficiency, reduce the detection cost.

The utility model also provides a check out test set, because fixing device has above-mentioned technological effect, then the check out test set that is equipped with this fixing device should also have corresponding technological effect.

Drawings

Fig. 1 is a schematic structural view of a fixing device disclosed in an embodiment of the present invention;

FIG. 2 is a schematic view of the fixing apparatus shown in FIG. 1 fixing a wafer by a clamping mechanism;

FIG. 3 is an enlarged view of the contact between the positioning post and the edge of the wafer through the first supporting surface and the positioning surface;

FIG. 4 is a schematic structural diagram of a sheet feeding monitoring device;

FIG. 5 is a schematic diagram of a monitoring device for detecting process conditions;

fig. 6 is a top view of the fixture of fig. 1 after removal of the positioning posts, support posts and clamp fixing posts.

In the figure:

100. wafer fixing disc 101, first vacuum adsorption area 102, second vacuum adsorption area 103, wafer picking and placing mechanism avoiding area 200, positioning column 201, first supporting surface 202, positioning surface 300, supporting column 400, clamping and fixing column 500, wafer (or to-be-detected piece) 600, detection process state monitoring device 601, first group of correlation sensors 602, second group of correlation sensors 700, cylinder assembly 801, over-position sensor 802, on-position sensor 803, feedback device 901, over-position sensor 902, on-position sensor 902

Detailed Description

In order to make the technical field better understand the solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description.

In this document, terms such as "upper, lower, left, right" and the like are established based on positional relationships shown in the drawings, and the corresponding positional relationships may vary depending on the drawings, and therefore, they are not to be construed as absolute limitations on the scope of protection; moreover, relational terms such as "first" and "second," and the like, may be used solely to distinguish one element from another element having the same name, without necessarily requiring or implying any actual such relationship or order between such elements.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of a wafer fixing device according to an embodiment of the present invention; FIG. 2 is a schematic view of the wafer fixing apparatus shown in FIG. 1, which is used to fix a wafer by a wafer clamping mechanism; FIG. 3 is an enlarged view of the contact between the positioning post and the edge of the wafer through the first supporting surface and the positioning surface.

As shown in the drawings, in one embodiment, a fixing device is provided for conveniently transferring and fixing the detection process of the conventional object to be supported and the special object to be supported, and mainly comprises a fixing plate 100, a clamping mechanism arranged on the fixing plate and the like. In this embodiment, the object to be supported may be a wafer, glass, or the like.

The wafer fixing plate 100 is substantially in a shape of a disk with a certain thickness, and a first vacuum suction area 101 is provided at the center of the disk surface for fixing the wafer 500 and two second vacuum suction areas 102 are provided at both sides of the disk surface for fixing the wafer 500, and the wafer 500 can be fixed by vacuum suction.

The wafer clamping mechanism mainly comprises positioning columns 200, supporting columns 300 and clamping fixing columns 400, wherein the disc surface is provided with mounting and positioning areas for the positioning columns 200 and the supporting columns 300 and is used for mounting and fixing the positioning columns 200 and the supporting columns 300, the positioning columns 200 and the supporting columns 300 are distributed on the disc surface of the wafer fixing disc 100 along the circumferential direction, the number of the positioning columns 200 is two, the positioning columns are located on one radial side of the wafer fixing disc 100 (the formed circular arc is smaller than one half of the circumference), the number of the supporting columns 300 is also two, the two supporting columns 300 and one clamping fixing column 400 are located on the other radial side of the wafer fixing disc 100, the moving direction of the clamping fixing columns 400 is perpendicular to a connecting line between the two positioning columns 200, and the two supporting columns. One positioning post 200 and one support post 300 located to the left of the dividing line are distributed bilaterally symmetrically to the other positioning post 200 and the other support post 300 located to the right of the dividing line if they are bounded by a radial center line passing through the clamping fixing post 400.

Threaded holes which are in one-to-one correspondence with the positioning columns 200 and the supporting columns 300 are formed in the disc surface of the wafer fixing disc 100, the positioning columns 200 and the supporting columns 300 are generally cylindrical, external threads are formed in the lower ends of the positioning columns 200 and the supporting columns 300 respectively, the external threads are detachably connected with the threaded holes, and the positioning columns 200 and the supporting columns 300 can be installed on the wafer fixing disc 100 or detached from the wafer fixing disc according to actual needs. Of course, the detachable connection between the positioning posts 200 and the supporting posts 300 and the wafer fixing plate 100 is not limited to a threaded connection, and can also be connected by a clamping connection or the like.

The upper end of the positioning column 200 is provided with a first supporting surface 201 for supporting the wafer from the edge of the back of the wafer in the axial direction, and a positioning surface 202 for positioning the wafer in the radial direction, wherein the first supporting surface 201 is an annular step surface formed at the upper end of the positioning column 200, and the positioning surface 202 is the outer peripheral surface of a cylindrical boss which is formed at the upper end of the positioning column 200 and is perpendicular to the annular step surface (see fig. 3).

The upper end of the supporting column 300 is provided with a second supporting surface for supporting the wafer from the edge of the back of the wafer so as to be matched with the positioning column 200 for use, and since no radial positioning surface is designed, the supporting column 300 supports the wafer 500 at the other side without positioning, when fixing, the wafer 500 (or the piece to be tested) is placed on four supporting surfaces jointly formed by the positioning column 200 and the supporting column 300, and the contact range of each supporting surface and the diameter direction of the back of the wafer 500 can be determined according to the requirements of different wafers or pieces to be tested. In the embodiment, the positioning column 200 and the supporting column 300 jointly support the wafer, so as to improve the stability of the fixing device for supporting the wafer.

The first supporting surface of the positioning column 200 and the second supporting surface of the supporting column 300 are located on the same plane and higher than the surfaces of the first vacuum absorption area 101 and the second vacuum absorption area 102, so as to ensure that the back surface of the wafer 500 does not contact with the surface of the vacuum absorption area when the wafer 500 is fixed by the wafer clamping mechanism.

In the present embodiment, two positioning columns 200 and two supporting columns 300 are used for supporting and positioning, it can be understood that three, four or more positioning columns 200 may be provided to support and position the wafer according to different actual needs, and similarly, three, four or more supporting columns 300 may also be provided to support the wafer 500, and a part of the supporting columns 300 is disposed at one side of the positioning columns 200, as a simpler form, only two positioning columns 200 and one supporting column 300 may also be provided, and if such a structure is adopted, the center line of the wafer fixing disk 100 should be located inside a triangle formed by three connecting lines of the two positioning columns 200 and the one supporting column 300, so as to stably support the wafer 500 and ensure that the wafer 500 does not topple over.

The clamping and fixing columns 400 are radially movably mounted on the wafer fixing disc 100, sliding grooves which provide radial moving spaces for the clamping and fixing columns are formed in the wafer fixing disc 100, the clamping and fixing columns 400 can move between a clamping position and a non-clamping position, the wafer 500 is clamped by the outer peripheral surface of the first position for clamping the wafer and the positioning surface of the positioning columns 200, at the moment, the clamping and fixing columns 400 are located on the distribution circumference of the positioning columns 200, and the arc formed by the clamping and fixing columns 400 and the positioning columns 200 is larger than one-half circumference; at the second position where the wafer is not clamped, the distance between the outer peripheral surface of the clamping fixing column and the positioning surface of the positioning column 200 is increased, and the clamping fixing column 400 is no longer clamped with the wafer 500, and at this time, the clamping fixing column is located outside the distributed circumference of the positioning column 200, is far away from the wafer, and is not in contact with the outer peripheral portion of the wafer.

Specifically, the clamping driving component provides clamping fixing force for the clamping fixing column 400, in this embodiment, the cylinder assembly 700 is adopted as the clamping driving component, the clamping force can be set according to actual conditions for wafers 500 with different thicknesses and warps, the cylinder assembly 700 is installed on the back of the wafer fixing disk 100, the clamping fixing column 400 is connected with the telescopic end of the cylinder assembly 700 and can perform linear reciprocating motion along with the pushing and retracting of the cylinder assembly 700, during operation, the clamping fixing column 400 moves towards the positioning column direction under the driving of the cylinder assembly 700 and pushes the wafer 500 to move towards the positioning column direction, the wafer 500 stops moving after the edge of the wafer 500 contacts with the positioning surface of the positioning column 200, and the clamping fixing column 400 provides stable clamping force so that the position of the wafer is fixed.

In other embodiments, the clamping driving component can also adopt a motor, a spring sheet and the like. If the motor is used as the clamping driving component, the motor can be fixed on the back of the wafer fixing disk 100 and drive the clamping fixing column 400 to do linear reciprocating motion through the gear rack transmission mechanism. If the spring or the elastic sheet is used as the clamping driving component, one end of the spring or the elastic sheet is connected with the wafer fixing disk 100, and the other end of the spring or the elastic sheet is connected with the clamping fixing column 400, so that the clamping fixing column 400 is driven to do linear reciprocating motion through elasticity.

In this embodiment, a wafer pick-and-place mechanism avoiding area 103 is disposed on the disk surface of the wafer fixing disk 100, the wafer pick-and-place mechanism avoiding area 103 is two elongated opening areas formed on the disk surface, the two opening areas are respectively located on two sides of the first vacuum adsorption area 101, the shape of the opening area is matched with the shape of a manipulator for picking and placing wafers, the opening area has a certain width and depth, and a sufficient operation space can be provided for the manipulator for picking and placing wafers.

In addition, the positioning post 200, the supporting post 300 and the clamping and fixing post 400 may be made of plastic, or the portions of the positioning post 200, the supporting post 300 and the clamping and fixing post 400 contacting the wafer 500 may be made of plastic, so as to avoid scratches and damages to the wafer 500.

The surface form and the size of the wafer fixing disk 100 are not limited, and the surface form may be a continuous plane or a plane with various air passages, and the size may be 300mm or other sizes.

It should be specially noted here that, for the wafer 500 whose front side and back side are not contactable, the supporting surfaces of the positioning column 200 and the supporting column 300 may be set to face the disk surface of the wafer fixing disk 100, that is, inclined surfaces inclined downward by a certain angle, and after adopting such a structure, the supporting surface is only in contact with the edge round angle of the wafer 500, that is, by designing different supporting surfaces, the positioning column 200 and the supporting column 300 can support the back side of the wafer 500, and can also support the edge of the wafer 500, thereby satisfying the fixing requirement that the back side is not contacted at all.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a chip mounting monitoring device.

As shown in the figure, on-chip monitoring devices may be further added on the basis of the above embodiments to monitor whether the clamping and fixing of the wafer 500 are normal or not during the wafer fixing process. By arranging the upper wafer detection device, the clamping state of the fixing device 100 on the wafer 500 can be detected in time, and the detection efficiency is improved.

The upper wafer monitoring device is provided with an in-place sensor 902 and an over-position sensor 901 which move together with the clamping and fixing column 400, the wafer fixing disc 100 is provided with an in-place sensor 802 and an over-position sensor 801, the in-place sensor 902 moves to the position triggering the in-place sensor 802 in the clamping and in-place state, and the over-position sensor 901 moves to the position triggering the over-position sensor 801 in the clamping and over-position state.

Specifically, the in-place sensor 902 and the over-position sensor 901 are two sensing pieces with ends bent downwards to form 90 degrees, the two sensing pieces have basically the same structure, and are fixed on the moving part of the cylinder assembly 700 at intervals in the front-back direction of the moving direction of the clamping fixing column 400, when the cylinder assembly 700 drives the clamping fixing column 400 to move, the in-place sensor 902 and the over-position sensor 901 move together, the in-place sensor 802 and the over-position sensor 801 have sensing grooves with upward openings, and the ends bent downwards of the in-place sensor 902 and the over-position sensor 901 correspond to the sensing grooves of the in-place sensor 802 and the over-position sensor 801. When the cylinder assembly 700 is pushed forward, the in-place sensor 902 and the over-position sensor 901 both move forward, when the in-place sensor 902 enters the sensing groove of the in-place sensor 802 and blocks the in-place sensor 802, it indicates that the wafer 500 (or the to-be-detected piece) is clamped and fixed in place, and the next detection action can be performed, and at this time, if the cylinder assembly 700 further moves forward, the over-position sensor 901 enters the sensing groove of the over-position sensor 801 and blocks the over-position sensor 801, which indicates that the wafer 500 (or the to-be-detected piece) fails to be clamped due to some reason, the clamping action needs to be stopped to search for the failure reason, so as to ensure that the wafer 500 (or the to-be-detected piece).

The cylinder assembly 700 is provided with a feedback unit 803, and the feedback unit 803 is a magnetic switch and is used for feeding back whether the cylinder is in place or not to monitor whether the cylinder is in a non-extended state or not, and if the cylinder is in place, the robot can perform wafer loading and unloading operations on the wafer 500 (or the workpiece to be tested).

Referring to fig. 5, fig. 5 is a schematic structural diagram of a monitoring device for detecting a process state.

As shown in the figure, on the basis of the above embodiments, a detection process state monitoring device 600 may be further added to monitor the wafer state in real time during the loading and detection processes.

The monitoring device for detecting the process state is provided with two groups of correlation sensors arranged on the outer edge of the wafer fixing disc 100, and correlation paths of the two groups of correlation sensors are crossed in the radial direction in an area above the upper surface of the wafer.

Specifically, two sensors of the first set of correlation sensors 601 are respectively fixed at opposite edge positions along a radial direction of the wafer fixing disk 100, and two sensors of the second set of correlation sensors 602 are respectively fixed at opposite edge positions along another radial direction of the wafer fixing disk, the two radial directions being in an X shape intersecting with each other. Thus, after the wafer 500 is loaded, the correlation paths of the two sets of correlation sensors radially intersect in the upper region of the wafer upper surface and keep a small distance from the wafer upper surface, when the wafer 500 is stably and reliably fixed on the wafer fixing disk 100, the wafer 500 does not block the correlation paths of the two sets of correlation sensors, when the wafer 500 falls off from the supporting surface of the positioning column 200 or the supporting column 300 due to some reason and tilts, the detection light of the corresponding correlation sensors is blocked, and then a feedback signal is sent out, and the system stops detecting immediately after receiving feedback, so as to further search the falling or tilting reason of the wafer 500 and prevent the wafer 500 from falling off due to clamping failure.

Certainly, a set of correlation sensors is arranged on the outer edge of the wafer fixing disk 100, so that the correlation path of the correlation sensors is parallel to the upper surface of the wafer and a space is reserved between the correlation path and the upper surface of the wafer, and the wafer state can be monitored in real time in the processes of loading and detecting. By changing the positions of the positioning posts 200 and the supporting posts 300, wafers 500 with different diameters can be clamped. Although the drawings in the present embodiment only show the fixing structure of a wafer with a fixed diameter, it can be understood that the positioning and supporting positions can be changed by installing the positioning posts 200 and the mounting holes of the supporting posts 300 corresponding to wafers with different diameters at different positions on the wafer fixing plate 100, so as to support wafers 500 with different sizes.

The above embodiments are merely preferred embodiments of the present invention, and are not limited thereto, and different embodiments can be obtained by performing targeted adjustment according to actual needs. For example, the number of the positioning posts 200, the supporting posts 300 and the clamping fixing posts 400 can be further adjusted, or the positioning posts 200 and the supporting posts 300 can be designed to be non-cylindrical, or various grooves for routing the signal lines of the detection sensors can be formed on the wafer fixing tray 100. This is not illustrated here, since many implementations are possible.

The wafer clamping mechanism is suitable for fixing the wafer with the back not capable of being contacted or the back only allowing to be contacted at the edge part in an edge clamping mode, has the advantages of simple structure, convenience in operation, stability in operation and the like, does not damage the wafer in the fixing process, and is favorable for improving the stability and the detection efficiency of fixing and reducing the detection cost.

When the wafer fixing device is used for fixing the wafer 500 which is not contacted with the back or is allowed to be contacted with the edge part, the positioning column 200 and the supporting column 300 are connected with the wafer fixing disc, the wafer 500 is conveyed to the upper part of the wafer fixing disc 100 through the mechanical arm, the mechanical arm descends to place the wafer 500 on the wafer fixing disc 100 and is supported by the supporting surfaces of the positioning column 200 and the supporting column 300, the control air cylinder assembly 700 pushes forwards to provide clamping force for the clamping fixing column 400, the clamping fixing column 400 is driven to move towards the positioning column, the clamping fixing column 400 and the positioning surface of the positioning column 200 clamp the wafer 500 together, after detection is carried out, the control air cylinder assembly 700 drives the clamping fixing column 400 to move in the opposite direction, clamping on the wafer 500 is released, and the wafer 500 is taken away from.

When the wafer fixing device is used for fixing a wafer 500 with a contactable back, the positioning columns 200 and the supporting columns 300 are detached from the wafer fixing disk 100 (see fig. 6), the wafer 500 is conveyed to the upper side of the wafer fixing disk 100 through the manipulator, the manipulator descends to place the wafer 500 on the wafer fixing disk 100 to be contacted with the upper surfaces of the first vacuum adsorption area 101 and the second vacuum adsorption area 102, the vacuum adsorption areas are controlled to generate adsorption force, the wafer 500 is adsorbed and fixed, after detection is carried out, the vacuum adsorption areas are controlled to stop generating adsorption force, fixing of the wafer 500 is released, and the wafer 500 is taken away from the wafer fixing disk 100 through the manipulator.

Since the robot and the vacuum suction can be realized by using the related general techniques, the description thereof will not be repeated.

The utility model also provides a wafer check out test set, include:

the wafer fixing device is used for fixing the wafer 500 to be detected;

the detection system is used for detecting the wafer 500 fixed by the wafer fixing device;

a robot for placing the wafer 500 on the disk surface of the wafer fixing device before the detection and taking away the wafer 500 from the disk surface of the wafer fixing device after the detection, please refer to the prior art for other structures of the wafer detection equipment, which is not described herein again.

It is right above the utility model provides a fixing device and check out test set have carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the core concepts of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims

1. A fixture, comprising:

the clamping mechanism comprises a clamping fixing column and at least two positioning columns, the clamping fixing column is used for providing clamping fixing force for the object to be supported, and the positioning columns are detachably connected to the fixed disk through one end of each positioning column and distributed on the disk surface of the fixed disk along the edge of the bearing area;

2. The fixture according to claim 1, further comprising: the supporting columns are used for providing supporting force for the object to be supported, the direction of the clamping fixing force is intersected with the direction of the supporting force, and the supporting columns and the positioning columns are distributed in the disc surface of the fixed disc along the circumferential direction.

3. A fastening device as claimed in claim 2, wherein the positioning post is further adapted to provide a supporting force for the object to be supported.

4. The fixing device as claimed in claim 3, wherein one end of the positioning column is provided with a positioning surface for radially positioning the object to be supported, one end of the positioning column provided with the positioning surface is provided with a first supporting surface, one end of the supporting column is provided with a second supporting surface, and the first supporting surface and the second supporting surface are used for supporting the object to be supported from the edge of the object to be supported.

5. A fastening device as claimed in claim 4, wherein the first support surface of the locating stud and the second support surface of the support stud are in the same plane.

6. The fixing device as claimed in claim 4, wherein the first supporting surface of the positioning column and the second supporting surface of the supporting column are inclined surfaces inclined toward the surface of the fixed tray so as to contact only the edge round of the object to be supported after the object to be supported is placed.

7. The fixing device as claimed in claim 4, wherein the number of the positioning posts is two, and the moving direction of the clamping fixing posts is perpendicular to the connecting line between the two positioning posts; the number of the supporting columns is two, and the two supporting columns are respectively located on two sides of the moving direction of the clamping fixing column.

8. The fixing device as claimed in claim 4, wherein the first supporting surface of the positioning post is an annular step surface formed at an upper end of the positioning post, and the positioning surface is an outer circumferential surface of a cylindrical boss formed at the upper end of the positioning post and perpendicular to the annular step surface.

9. The fixing device as claimed in claim 4, wherein the fixed disk is provided with threaded holes corresponding to the positioning columns and the supporting columns, and the connecting ends of the positioning columns and the supporting columns are detachably connected with the threaded holes through external threads respectively.

10. The fixing device as claimed in claim 4, wherein the surface of the fixed plate is provided with an avoiding area of a pick-and-place mechanism; the avoiding area of the taking and placing mechanism comprises at least one opening area formed on the disc surface, and the shape of the opening area is matched with the shape of a manipulator for taking and placing the object to be supported.

11. The fixing device according to claim 4, further comprising a clamping driving component for driving the clamping fixing column to move, wherein the clamping driving component is disposed on the fixing plate, the clamping fixing column is connected to a clamping force output end of the clamping driving component, and the clamping driving component drives the clamping fixing column to move back and forth between the first position and the second position.

12. The fixture of claim 1 further comprising a top plate monitoring device, said top plate monitoring device comprising an in-place sensor that moves with said clamp fixing post, said fixed plate being provided with an in-place sensor, said in-place sensor moving to a position that triggers said in-place sensor in a clamped-in-place condition.

13. The fixture according to claim 1, further comprising a top plate monitoring device, wherein the top plate monitoring device comprises an over position sensor that moves together with the clamping fixing column, the fixing plate is provided with an over position sensor, and in a clamping over position state, the over position sensor moves to a position that triggers the over position sensor.

14. The fixture according to claim 1, further comprising a process condition monitoring device, said process condition monitoring device comprising at least one set of correlation sensors located on an outer edge of said holding pan, said correlation sensors having correlation paths parallel to and spaced from said pan surface.

15. A mounting apparatus in accordance with claim 14 wherein there are two sets of correlation sensors, the correlation paths of the two sets of correlation sensors intersecting radially in the upper region of the disc face.

16. A detection apparatus, comprising:

the fixture according to any of the preceding claims 1 to 15, for holding a wafer to be inspected;

and the manipulator is used for placing the wafer on the disk surface of the fixing device before detection and taking the wafer away from the disk surface of the fixing device after detection.