CN108098794B - Mechanical arm, wafer conveying device thereof and wafer detection machine - Google Patents
Mechanical arm, wafer conveying device thereof and wafer detection machine Download PDFInfo
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- CN108098794B CN108098794B CN201810037066.6A CN201810037066A CN108098794B CN 108098794 B CN108098794 B CN 108098794B CN 201810037066 A CN201810037066 A CN 201810037066A CN 108098794 B CN108098794 B CN 108098794B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention provides a mechanical arm, a wafer conveying device and a wafer detection machine, which can bear a wafer more safely and reliably, ensure that the wafer is not easy to fall off in the conveying or overturning process, guarantee the quality of the wafer and reduce the production cost. The mechanical arm comprises a first supporting arm, a second supporting arm, a driving unit and a vacuum unit; the first support arm and the second support arm are arranged oppositely, a first holding part is arranged at one end of the first support arm, and a second holding part is arranged at one end of the second support arm; the driving unit is respectively connected with the first holding part and the second holding part so as to drive the first holding part and the second holding part to move relatively to realize the clamping of the wafer; the vacuum unit comprises adsorption holes arranged on the first supporting arm and the second supporting arm so as to adsorb the edge of the wafer through the adsorption holes in a vacuum mode.
Description
Technical Field
The invention relates to the field of semiconductor equipment manufacturing, in particular to a mechanical arm, a wafer conveying device and a wafer detection machine platform.
Background
In a conventional wafer defect inspection machine, a robot arm is often used to transfer a wafer (wafer), and the wafer is turned over to inspect whether the wafer is abnormal. For this reason, the robot arm needs to have high reliability.
Most of the existing mechanical arms adsorb and fix the wafer through vacuum, and the wafer is turned over by controlling the turning angle. However, the reliability of vacuum adsorption is difficult to be well guaranteed, and if vacuum loss or collision occurs, the wafer is easy to fall off, and wafer fragments, scratches and the like are caused.
Disclosure of Invention
In view of this, the present invention provides a robot arm, a wafer transferring apparatus and a wafer inspecting machine, which can safely and reliably carry a wafer, and ensure that the wafer is not easy to fall off during transferring or turning, so as to ensure the quality of the wafer and reduce the production cost.
According to an aspect of the present invention, a robot arm for carrying a wafer is provided, which includes a first support arm, a second support arm, a driving unit, and a vacuum unit;
the first support arm and the second support arm are arranged oppositely, one end of the first support arm is provided with a first holding part, and one end of the second support arm is provided with a second holding part;
the driving unit is respectively connected with the first holding part and the second holding part so as to drive the first holding part and the second holding part to move relatively to realize the clamping of the wafer;
the vacuum unit comprises adsorption holes arranged on the first supporting arm and the second supporting arm, and the edges of the wafers are subjected to vacuum adsorption through the adsorption holes.
Furthermore, the mechanical arm also comprises a sensing unit and a control unit which are in communication connection;
the sensing unit is arranged on the first supporting arm and the second supporting arm so as to sense the position of the wafer relative to the mechanical arm and provide the sensed position information for the control unit;
the control unit is in communication connection with the driving unit and is used for controlling the rotation states of the first holding part and the second holding part through the driving unit according to the received position information of the wafer relative to the mechanical arm, and/or,
the control unit is in communication connection with the vacuum unit and is used for controlling the vacuum pressure values of the adsorption holes in the first support arm and the second support arm through the vacuum unit according to the received position information of the wafer relative to the mechanical arm.
Further, the sensing unit includes a first sensor and a second sensor; the first sensor is arranged on the first support arm, and the second sensor is arranged on the second support arm;
the first sensor is used for sensing a first position of the wafer relative to the first support arm and providing the sensed first position information to the control unit;
the second sensor is used for sensing a second position of the wafer relative to the second supporting arm and providing the sensed second position information to the control unit;
the control unit is used for obtaining the position information of the wafer relative to the mechanical arm according to the received first position information and the second position information, controlling the rotation states of the first holding part and the second holding part through the driving unit according to the position information, and/or,
the control unit is used for obtaining the position information of the wafer relative to the mechanical arm according to the received first position information and the second position information, and controlling the vacuum pressure values of the adsorption holes in the first supporting arm and the second supporting arm through the vacuum unit according to the position information.
Further, the control unit is further configured to determine whether the wafer is located at a target position according to the received position information of the wafer relative to the robot arm;
when the wafer is located at the target position, the control unit controls the driving unit to drive the first holding part and the second holding part to clamp the wafer, and/or controls the adsorption holes on the first supporting arm and the second supporting arm to adsorb the edge of the wafer in a vacuum manner at a vacuum pressure value different from zero through the vacuum unit.
Furthermore, a connecting line of the first sensor and the second sensor is arranged in the diameter direction of the wafer, and the linear distance between the first sensor and the second sensor is greater than the diameter of the wafer.
Further, the first sensor and/or the second sensor are photoelectric sensors or piezoelectric sensors.
Further, the first sensor is disposed adjacent to the first grip portion, and the second sensor is disposed adjacent to the second grip portion.
Furthermore, the mechanical arm further comprises a limiting unit, wherein the limiting unit is arranged between the first supporting arm and the second supporting arm and used for limiting the displacement of the wafer on one side of the wafer. .
Furthermore, the mechanical arm also comprises a sensing unit and a control unit which are in communication connection;
the sensing unit is arranged on the limiting unit to sense the position of the wafer relative to the mechanical arm and provide sensed position information for the control unit;
the control unit is in communication connection with the limiting unit and is used for controlling the working state of the limiting unit according to the received position information of the wafer relative to the mechanical arm.
Further, the sensing unit includes a third sensor, and the third sensor is configured to sense a third position of the wafer relative to the robot arm, and provide the sensed third position information to the control unit;
and when the control unit determines that the wafer is at a target position according to the received third position information, the limiting unit is controlled to stop against the side face of the wafer.
Furthermore, the limiting unit comprises a stopper, and the stopper is provided with an adsorption surface for vacuum adsorption of the edge of the wafer.
Furthermore, the other end of the first support arm is hinged to the other end of the second support arm, and the first support arm and the second support arm can move relatively.
Furthermore, the first holding portion and/or the second holding portion are/is provided with a groove, and the groove is used for accommodating the edge of the wafer.
According to another aspect of the present invention, there is provided a wafer transferring apparatus including the robot arm.
According to another aspect of the present invention, a wafer inspecting machine is provided, which includes the robot.
According to the technical scheme provided by the invention, the mechanical arm for bearing the wafer is provided with the adsorption hole capable of vacuum-adsorbing the edge of the wafer, and the first holding part and the second holding part which can rotate oppositely or reversely, so that in actual use, the edge of the wafer can be vacuum-adsorbed through the adsorption hole, and the wafer can be clamped by means of the two holding parts.
In a preferred embodiment, the robot arm further includes a limiting unit, and the limiting unit is disposed between the first support arm and the second support arm and is configured to limit displacement of the wafer at one side of the wafer, so as to further effectively protect the wafer. More preferably, the limiting unit comprises a stopper, the stopper is provided with an adsorption surface and used for vacuum adsorption of the edge of the wafer, and the safety and reliability of wafer bearing are further improved.
Drawings
FIG. 1 is a schematic view illustrating a robot arm according to an embodiment of the present invention in a wafer releasing state;
fig. 2 is a schematic structural view of the robot shown in fig. 1 when the robot holds a wafer.
In the figure:
the wafer-type robot comprises a mechanical arm-100, a wafer-200, a first supporting arm-10, a second supporting arm-20, a first holding part-11, a second holding part-21, a driving unit-30, a control unit-40, a first holding part-51, a second holding part-52 and a limiting unit-60.
Detailed Description
The robot, the wafer transfer device and the wafer inspection machine according to the present invention will be described in detail with reference to the accompanying drawings and embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
As used in this specification, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
Fig. 1 is a schematic view illustrating a robot according to an embodiment of the present invention in a wafer-releasing state, and fig. 2 is a schematic view illustrating a structure of the robot in fig. 1 in a wafer-clamping state, as shown in fig. 1 and 2, a robot 100 may be used to carry a wafer 200, including but not limited to, the wafer 200 being transferred between process chambers by the robot 100, for example, the wafer 200 being flipped by the robot 100 to detect defects on the surface of the wafer.
The robot arm 100 may include a first support arm 10, a second support arm 20, and a driving unit 30. The first support arm 10 and the second support arm 20 are arranged oppositely, a first holding portion 11 is arranged at one end of the first support arm 10, and a second holding portion 21 is arranged at one end of the second support arm 20. The driving unit 30 is connected to the first holding portion 11 and the second holding portion 21, and is used for driving the first holding portion 11 and the second holding portion 21 to rotate in an opposite direction or in a reverse direction, so as to clamp or release the wafer 200. For example, the first grip 11 of fig. 1 can be rotated downward to the position shown in fig. 2 to fit the edge of the wafer. Similarly, the second holding portion 21 in fig. 1 can be rotated upward to the position shown in fig. 2 to fit the edge of the wafer.
It is understood that when the first holding portion 11 and the second holding portion 21 are rotated toward each other, the robot arm 100 may be used to hold the wafer 200; when the first grip 11 and the second grip 21 rotate away from each other, the robot 100 may release the wafer 200.
Furthermore, in order to improve the safety and reliability of the robot arm 100 for carrying the wafer 200, the robot arm 100 may further include a vacuum unit, and the vacuum unit includes suction holes, specifically, the suction holes are disposed on the first support arm 10 and the second support arm 20, but the number of the suction holes on each support arm is not particularly limited. Thus, the robot arm 100 can vacuum-adsorb the edge of the wafer 200 (which is mainly the edge of the opposite side of the wafer 200) through the adsorption hole of the first support arm 10 and the adsorption hole of the second support arm 20.
In this embodiment, the vacuum unit may include a vacuum pipe communicating with the adsorption hole. Preferably, the inner cavity of each supporting arm forms a vacuum channel, and the structure is simple. And the vacuum channel may be further connected to an external vacuum generator. For the convenience of detection and adsorption, the adsorption holes are preferably arranged on the surface of the support arm facing the reverse side of the wafer, more preferably, a plurality of adsorption holes are distributed along the circumferential direction of the wafer, for example, distributed in a local area on the circumferential direction of the wafer, so as to adsorb the wafer at a local position, and more specifically, adsorption holes may be distributed at two ends of the diameter of the wafer.
In addition, the first grip 11 and the second grip 21 may be driven to rotate by the same driving unit 30, or may be driven to rotate by different driving units 30. In order to reduce the complexity of the structure and operation, it is preferable that only one of the driving units 30 synchronously drives the first grip 11 and the second grip 21 to rotate toward or away from each other (i.e., to move relative to each other). Optionally, the driving unit 30 includes a motor and a transmission mechanism, the motor drives the transmission mechanism to move, and the transmission mechanism further drives the corresponding holding portion to rotate. Alternatively, the motor is disposed at a position where the first support arm 10 and the second support arm 20 are connected, for example, at a position where the first support arm 10 and the second support arm 20 are hinged.
With reference to the above embodiments, the operation principle of the robot arm 100 is as follows: when the wafer 200 is located at the target position relative to the robot arm 100, the driving unit 30 drives the first holding portion 11 and the second holding portion 21 to rotate towards each other to clamp the wafer 200 at the side surface of the wafer 200, and simultaneously the vacuum unit vacuum-sucks the edge of the wafer 200 through the suction holes of the first support arm 10 and the second support arm 20, so that the wafer 200 is firmly fixed on the robot arm 100.
Compare pure vacuum adsorption wafer 200, robotic arm 100 of this embodiment still is provided with the portion of gripping similar to finger joint, realizes the centre gripping of wafer through two portions of gripping, has played the effect of duplicate protection, consequently, guarantee wafer that can be better is conveying especially security and reliability in the upset in-process, also can prevent because of the unqualified problem of wafer that results in of vacuum adsorption inefficacy to promote the quality of wafer, reduction in production cost.
In this embodiment, the other end of the first support arm 10 and the other end of the second support arm 20 are preferably movably disposed, so that the first support arm 10 and the second support arm 20 can move in opposite directions or in a back direction, and thus the size of the accommodating space defined by the first support arm 10 and the second support arm 20 is convenient to adjust, so that the robot arm 100 can bear wafers with different sizes. Optionally, the other end of the first support arm 10 is hinged to the other end of the second support arm 20, so that the robot arm 100 is configured to be capable of opening and closing, and the structure is simple and the operation is more convenient. Preferably, the first support arm 10 and the second support arm 20 have the same structure, so as to simplify the structure of the robot arm 100, and improve the synchronization effect of the robot arm 100.
In a preferred embodiment, the robot arm 100 may further include a sensing unit and a control unit 40, which are communicatively connected. The sensing unit preferably includes a first sensor 51 and a second sensor 52. The first sensor 51 is disposed on the first support arm 10, and the second sensor 52 is disposed on the second support arm 20.
The sensing unit is configured to sense a position (specifically, an assembly position) of the wafer 200 with respect to the robot 100, and provide the sensed position information to the control unit 40. The control unit 40 is in communication connection with the driving unit 30, and is configured to control the rotation states of the first holding portion 11 and the second holding portion 21 through the driving unit 30 according to the received position information of the wafer 200 relative to the robot arm 100, so as to achieve a clamping state (clamping or unclamping) of the wafer.
Preferably, the control unit 40 is in communication connection with the vacuum unit, and is configured to control vacuum pressure values of the suction holes on the first support arm 10 and the second support arm 20 through the vacuum unit according to the received position information of the wafer 200 relative to the robot arm 100, so as to control a vacuum suction state of the wafer (to turn on vacuum suction or turn off vacuum suction).
Specifically, the control unit 40 is further configured to determine whether the wafer 200 is at a target position according to the received position information of the wafer 200 relative to the robot 100. If it can be determined that the wafer 200 is located at the target position (i.e., the wafer 200 is correctly mounted on the robot 100) based on the position information, the control unit 40 may control the driving unit 30 to rotate the first grip 11 and the second grip 21 toward each other to clamp the wafer 200. Of course, if the control unit 40 can determine that the wafer 200 is located at the target position according to the position information, the control unit 40 may further control the vacuum unit to suck the wafer through the suction hole at a vacuum pressure different from zero.
In this embodiment, the control unit 40 may obtain the rotation angle of each holding portion through a correlation operation, and further the driving unit 30 controls each holding portion to rotate to a target angle, so that the holding portion can be accurately attached to the edge of the wafer. The control unit 40 may adopt an existing PLC controller, a single chip, a microprocessor, etc., and a person skilled in the art can know how to select the PLC controller, the single chip, the microprocessor, etc. based on the disclosure of the present application in combination with the common general knowledge in the art.
More preferably, the method for sensing the position of the wafer 200 relative to the robot 100 by the sensing unit includes:
sensing a first position of the wafer 200 with respect to the first support arm 10 by the first sensor 51, and providing the sensed first position information to the control unit 40;
at the same time, the second position of the wafer 200 with respect to the second support arm 20 is sensed by the second sensor 52, and the sensed second position information is provided to the control unit 40;
then, the control unit 40 obtains the position information (i.e., the position and orientation) of the wafer 200 relative to the robot arm 100 according to the received first position information and the second position information.
It can be seen that the position of the wafer relative to the robot is defined by a first position and a second position, and the control unit 40 can determine that the wafer is at a predetermined target position only when the first sensor 51 and the second sensor 52 simultaneously sense the corresponding position information, so as to perform the clamping or vacuum sucking operation. However, the type of any one of the first sensor 51 and the second sensor 52 is not particularly limited, and a photoelectric sensor or a piezoelectric sensor may be selected, for example.
In this embodiment, the wafer 200 has a target position relative to the robot 100, and the target position may be: the diameter of the wafer is aligned with the line connecting the first sensor 51 and the second sensor 52, and it can be substantially determined that the wafer 200 is in place. Of course, in order to smoothly mount the wafer 200 between the support arms, the linear distance between the first sensor 52 and the second sensor 52 is larger than the diameter of the wafer.
Preferably, the first sensor 51 is disposed adjacent to the first holding portion 11, and the second sensor 52 is disposed adjacent to the second holding portion 21, so that the control unit 40 determines the rotation angles of the first holding portion 11 and the second holding portion 21 to clamp the wafer according to the position of the first holding portion 11 relative to the first sensor 51 and the position of the second holding portion 21 relative to the second sensor 52.
Further, the robot arm 100 may further include a position limiting unit 60 disposed between the first support arm 10 and the second support arm 20 for limiting the displacement of the wafer 200 at one side of the wafer 200, and the position limiting unit 60 is preferably combined with the sensing unit to limit the position of the wafer 200 relative to the robot arm 100. The control unit 40 may be in communication connection with the position limiting unit 60, and is configured to control the working state of the position limiting unit 60 according to the received position information of the wafer relative to the robot arm.
For example, when the control unit 40 determines that the wafer is at the target position, the control unit 60 is controlled to act to stop the wafer 200 at one side against the side of the wafer 200. Preferably, the sensing unit further includes a third sensor, the third sensor is configured to sense third position information of the wafer relative to the robot arm, and the control unit 40 is preferably configured to determine that the wafer is located at the target position according to the received first position information, second position information, and third position information. However, in other embodiments, the control unit 40 may control the motion of the position limiting unit only according to the third position information sensed by the third sensor.
In this embodiment, the first sensor 51, the second sensor 52 and the third sensor are distributed in a triangular shape, so that the position of the wafer 200 relative to the robot arm 100 can be correctly positioned, the positioning is accurate, the operation of the robot arm 100 is more convenient, and the efficiency is higher. Further, the spacing unit 60 may include a stopper, which is stopped against the side of the wafer by a side of the stopper. Preferably, the stopper further has a suction surface for vacuum-sucking the edge of the wafer. Here, in addition to the edge of the wafer being adsorbed through the adsorption holes of the first support arm 10 and the second support arm 20, the edge of the wafer is also vacuum-adsorbed through the position limiting unit 60, and the wafer is better protected.
Optionally, the surfaces of the first holding portion 11 and the second holding portion 21 facing the wafer side are both provided with grooves, so that the edge of the wafer 200 can extend into the grooves, the side walls of the grooves can stop against the edge of the wafer 200, and when the side walls of the grooves of the two holding portions stop against the edge of the wafer 200 synchronously, the robot arm 100 can clamp the wafer 200. Preferably, the groove is a V-shaped groove, and since the contact area between the groove wall of the V-shaped groove and the surface and the edge of the wafer 200 is small, the surface of the wafer 200 can be prevented from being worn to some extent, and the quality of the wafer 200 can be ensured. More preferably, the two sidewalls of the groove may be symmetrically disposed about an intersection line of the two sidewalls, so that reliability of the robot arm 100 clamping the wafer 200 may be ensured, and a contact area between the groove and the wafer 200 may be further reduced. Similarly, the stopper of the position limiting unit 60 may also be provided with a groove for receiving the edge of the wafer, and the groove is preferably a V-shaped groove.
In addition, the embodiment of the invention further provides a wafer transfer apparatus, which includes the robot 100, and the wafer 200 is transferred by the robot 100.
In addition, the embodiment of the invention also provides a wafer detection machine, which comprises the mechanical arm 100, wherein the mechanical arm 100 is used for overturning the wafer 200 so as to detect whether the surface of the wafer has defects.
According to the technical scheme provided by the embodiment of the invention, the mechanical arm for bearing the wafer is provided with the adsorption hole capable of vacuum-adsorbing the edge of the wafer, and the first holding part and the second holding part which can rotate oppositely or reversely, so that in actual use, the edge of the wafer can be vacuum-adsorbed through the adsorption hole, and the wafer can be clamped by means of the two holding parts.
In a preferred embodiment, the robot arm further includes a limiting unit, and the limiting unit is disposed between the first support arm and the second support arm and is configured to limit displacement of the wafer at one side of the wafer, so as to further effectively protect the wafer. More preferably, the limiting unit comprises a stopper, the stopper is provided with an adsorption surface and used for vacuum adsorption of the edge of the wafer, and the safety and reliability of wafer bearing are further improved.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (14)
1. A mechanical arm is used for bearing a wafer and is characterized by comprising a first supporting arm, a second supporting arm, a driving unit, a vacuum unit, a sensing unit and a control unit;
the first support arm and the second support arm are arranged oppositely, one end of the first support arm is provided with a first holding part, and one end of the second support arm is provided with a second holding part;
the driving unit is respectively connected with the first holding part and the second holding part so as to drive the first holding part and the second holding part to move relatively to realize the clamping of the wafer;
the vacuum unit comprises adsorption holes which are arranged on the first supporting arm and the second supporting arm so as to adsorb the edge of the wafer in a vacuum mode through the adsorption holes;
the sensing unit is in communication connection with the control unit; the sensing unit is arranged on the first supporting arm and the second supporting arm so as to sense the position of the wafer relative to the mechanical arm and provide the sensed position information for the control unit;
the control unit is in communication connection with the driving unit and is used for controlling the rotation states of the first holding part and the second holding part through the driving unit according to the received position information of the wafer relative to the mechanical arm; and/or the presence of a gas in the gas,
the control unit is in communication connection with the vacuum unit and is used for controlling the vacuum pressure values of the adsorption holes in the first support arm and the second support arm through the vacuum unit according to the received position information of the wafer relative to the mechanical arm.
2. The robot arm according to claim 1, wherein the sensing unit includes a first sensor and a second sensor; the first sensor is arranged on the first support arm, and the second sensor is arranged on the second support arm;
the first sensor is used for sensing a first position of the wafer relative to the first support arm and providing the sensed first position information to the control unit;
the second sensor is used for sensing a second position of the wafer relative to the second supporting arm and providing the sensed second position information to the control unit;
the control unit is used for acquiring the position information of the wafer relative to the mechanical arm according to the received first position information and the second position information, and controlling the rotation states of the first holding part and the second holding part through the driving unit according to the position information; and/or the presence of a gas in the gas,
the control unit is used for obtaining the position information of the wafer relative to the mechanical arm according to the received first position information and the second position information, and controlling the vacuum pressure values of the adsorption holes in the first supporting arm and the second supporting arm through the vacuum unit according to the position information.
3. The robot of claim 2, wherein the control unit is further configured to determine whether the wafer is at a target position according to the received position information of the wafer relative to the robot;
when the wafer is located at the target position, the control unit controls the driving unit to drive the first holding part and the second holding part to clamp the wafer, and/or controls the adsorption holes on the first supporting arm and the second supporting arm to adsorb the edge of the wafer in a vacuum manner at a vacuum pressure value different from zero through the vacuum unit.
4. The robot arm of claim 3, wherein a line connecting the first sensor and the second sensor is disposed in a diameter direction of the wafer, and a linear distance between the first sensor and the second sensor is greater than a diameter of the wafer.
5. A robot arm as claimed in claim 2, characterized in that the first sensor and/or the second sensor is a photoelectric sensor or a piezoelectric sensor.
6. The robotic arm of claim 2, wherein the first sensor is disposed adjacent the first grip and the second sensor is disposed adjacent the second grip.
7. The robot arm of claim 1, further comprising a limiting unit disposed between the first support arm and the second support arm and configured to limit displacement of the wafer at one side of the wafer.
8. The robotic arm of claim 7, further comprising a sensing unit and a control unit communicatively coupled to the robotic arm;
the sensing unit is arranged on the limiting unit to sense the position of the wafer relative to the mechanical arm and provide sensed position information for the control unit;
the control unit is in communication connection with the limiting unit and is used for controlling the working state of the limiting unit according to the received position information of the wafer relative to the mechanical arm.
9. The robot of claim 8, wherein the sensing unit comprises a third sensor configured to sense a third position of the wafer relative to the robot and provide the sensed third position information to the control unit;
and when the control unit determines that the wafer is at a target position according to the received third position information, the limiting unit is controlled to stop against the side face of the wafer.
10. The robot arm as claimed in claim 7, wherein the position limiting unit comprises a stopper having a suction surface for vacuum-sucking the edge of the wafer.
11. The robot arm according to claim 1, wherein the other end of the first support arm is hinged to the other end of the second support arm, and the first support arm and the second support arm are capable of relative movement.
12. The robot arm of claim 1, wherein the first holding portion and/or the second holding portion has a recess for receiving an edge of the wafer.
13. A wafer transfer apparatus comprising the robot as claimed in any one of claims 1 to 12.
14. A wafer inspecting apparatus comprising the robot as claimed in any one of claims 1 to 12.
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| CN105161449A (en) * | 2014-05-30 | 2015-12-16 | 盛美半导体设备（上海）有限公司 | Wafer fixing device |
| CN205497455U (en) * | 2016-02-20 | 2016-08-24 | 杭州佳巨机械配件有限公司 | Movable robot bridge |
| CN106340486A (en) * | 2016-09-26 | 2017-01-18 | 天津华海清科机电科技有限公司 | Wafer clamping device |
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| CN108098794A (en) | 2018-06-01 |
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Effective date of registration: 20221223 Address after: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee after: Huaian Xide Industrial Design Co.,Ltd. Address before: 223300 no.599, East Changjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: HUAIAN IMAGING DEVICE MANUFACTURER Corp. |