JPH10289889A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of automatically detecting that the rotation of the substrate is stopped and of subsequently treating the substrate in a good manner. SOLUTION: This wafer cleaning apparatus is provided with a rotation state detection part 100 for detecting the rotation state of a central driven roller 13b out of three driven rollers 13 rotating with the rotation of a wafer W. If the rotation of the driven roller 13b is stopped, a rotation stop signal is outputted from the rotation state detection part 100 to a determination part 111. The determination part 111 determines whether or not the continuous output time of the rotation stop signal reaches a predetermined set time, using a timer 112. If the continuous output time reaches the predetermined set time, then the determination part 111 determines that the rotation of the wafer W is stopped and executes cycle stop processing to make treatment following the cleaning treatment continue and treatment prior to the cleaning treatment, and executes alarm generating processing for generating an alarm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for processing a substantially circular substrate such as a semiconductor wafer.

[0002]

2. Description of the Related Art A semiconductor device manufacturing process includes a process of forming a fine pattern by repeatedly performing processes such as film formation and etching on the surface of a semiconductor wafer (hereinafter, simply referred to as “wafer”). For fine processing, the surface of the wafer itself and the surface of the thin film formed on the wafer surface must be kept clean. Therefore, the wafer is cleaned as necessary. For example, after polishing a thin film formed on the surface of a wafer using an abrasive, the abrasive (slurry)
It is necessary to remove this slurry because the residue remains on the wafer surface.

FIG. 10 is a plan view showing a configuration example of a wafer cleaning apparatus for performing the above-described wafer cleaning.
FIG. 11 is a side view of the configuration shown in FIG. 10 viewed from the Z direction in FIG. This wafer cleaning device is for scrubbing both surfaces of the wafer W to remove slurry, and has three holding rollers 251 and 252 that abut against an end surface of the wafer W to horizontally hold and rotate the wafer W. And 253, and a double-side cleaning device 210 for cleaning both surfaces of the wafer W held by the holding rollers 251, 252 and 253.

[0004] Three holding rollers 251, 252 and 2
53 is a roller shaft 27 supported by the supporting portions 261, 262 and 263 so as to be rotatable around a vertical axis.
1, 272 and 273, respectively. Of these, the holding roller 251 is a driving roller to which the driving force generated by the motor M is transmitted via the driving belt V, and the remaining holding rollers 252 and 253 are the wafer W
It is a driven roller that rotates with the rotation of.

[0005] The double-sided cleaning device 210 includes a holding roller 25.
An upper surface cleaning member 214 and a lower surface cleaning member 217 for cleaning the upper surface and the lower surface of the wafer W held by 1, 252 and 253, respectively, are provided. The upper and lower cleaning members 214 and 217 are arranged so as to cover a part of the surface area of the wafer W so as not to interfere with the holding rollers 251, 252 and 253.
The upper and lower cleaning members 214 and 217 include substantially circular base plates 212 and 215, respectively. Cleaning brushes 213 and 216 are fixed to the lower and upper surfaces of the base plates 212 and 215, respectively. At substantially the center of the cleaning brushes 213 and 216, nozzles 220 and 221 for discharging the cleaning liquid are disposed, respectively.

When cleaning is performed, the holding roller 25
A driving force is applied to the driving roller 251 in a state where the wafer W is held on the wafers 1, 252 and 253, and the wafer W is rotated. In a state where the cleaning brushes 213 and 216 are in contact with the upper surface and the lower surface of the wafer W in this state, the upper and lower cleaning members 214 and 217 are rotated at a high speed by a rotation drive mechanism (not shown). The cleaning liquid is discharged from and 221. Thus, the upper surface and the lower surface of the wafer W are scrub-cleaned.

[0007]

In the above-described wafer cleaning apparatus, the double-side cleaning apparatus 210 is disposed so as to cover a part of the surface area of the wafer W, and the entire area of both sides of the wafer W is rotated by rotating the wafer W. Is to be cleaned. Therefore, if the rotation of the wafer W stops for some reason, the wafer W cannot be cleaned well.

[0008] For example, when a mechanical failure occurs in the mechanism for rotating the wafer W, such as when the drive belt V is cut, the rotation of the wafer W is stopped. As a result, only a part of the surface region of the wafer W is scrubbed by the cleaning brushes 213 and 216, and the remaining surface region remains uncleaned. Even if the driving force is transmitted to the driving roller 251, if the rotation force f1 applied to the wafer W from the driving roller 251 is smaller than the resistance force that hinders the rotation of the wafer W, the driving roller 251 idles, The rotation of the wafer W stops. Specifically, the resistance that hinders the rotation of wafer W includes driven rollers 252 and 253.
And the resistance f3 applied to the wafer W by the cleaning brushes 213 and 216 being pressed against the surface of the wafer W, and
As shown in the following equation (1), if the sum of these two types of resistance forces f2 and f3 is larger than the rotation force f1, the rotation of the wafer W is stopped. As a result, the entire surface of the wafer W cannot be cleaned.

F1 <f2 + f3 (1) A case where the expression (1) is satisfied is, for example, a case where the cleaning liquid used for cleaning adheres to the contact surface of the drive roller 251 with the wafer W. That is, in this case, the wafer W slides, and the drive roller 251 idles.
As a result, the rotational force f1 decreases.

In another case satisfying the above expression (1), the cleaning liquid mist is applied to the driven rollers 252 and 253.
And the particles adhere to the roller shafts 272 and 273 of the driven rollers 252 and 253, or crystallize. That is, in this case, since the rotation of the driven rollers 252 and 253 becomes slow, the resistance f2 increases.

Further, as another case satisfying the above expression (1), as a result of replacing the cleaning brushes 213 and 216 with new ones, the cleaning brushes 213 and 216 can be obtained.
May increase the pressing force against the surface of the wafer W. That is, in this case, the resistance f3 increases. As described above, when the rotation of the wafer W is stopped, the wafer W cannot be cleaned well,
Some action is needed.

However, since the above-described wafer cleaning apparatus is not provided with a mechanism for detecting that the rotation of the wafer W is stopped, even if the rotation of the wafer W is stopped, a predetermined processing time elapses. Then, the wafer W is taken out for the next step. Therefore, there is a problem that the quality of the wafer W may be reduced.

It is an object of the present invention to solve the above-mentioned technical problems and to provide a substrate processing apparatus capable of automatically detecting the stop of the rotation of the substrate and, as a result, satisfactorily processing the substrate.

[0014]

Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, there is provided a rotary driving source for generating a rotary driving force, and a rotary driving force from the rotary driving source is applied to a substrate. Including a driving roller for transmitting, a holding roller that abuts against an end surface of a substantially circular substrate to hold the substrate, a driven roller that rotates according to the rotation of the substrate, and detects a rotation state of the driven roller, and the rotation is stopped. And a rotation state detection unit that outputs a rotation stop signal when the rotation is stopped.

In the present invention, the rotation state of the driven roller is detected, and when the rotation is detected to be stopped, a rotation stop signal is output. Since the driven roller rotates according to the rotation of the substrate, when the rotation of the substrate is stopped, the rotation of the driven roller is also stopped. Therefore, according to the present invention, it is possible to reliably detect the rotation stop of the substrate.

Therefore, for example, when the present invention is applied to an apparatus for sequentially processing a plurality of substrates, if the rotation of the substrate is detected and the processing in the apparatus is stopped, the processing is thereafter performed. Insufficient processing can be prevented from being performed on the substrate that is to be performed. Therefore, if an unprocessed substrate is processed after the apparatus is returned to a normal state, it is possible to perform favorable processing on any substrate.

According to the present invention, the continuous output time of the rotation stop signal from the rotation state detecting means is compared with a predetermined time, and the continuous output time of the rotation stop signal reaches the set time. The substrate processing apparatus according to claim 1, further comprising an output time comparison unit that outputs an error signal in response to the output signal. When a substrate having a notch such as an orientation flat or a notch in a peripheral portion is to be processed, when the notch is applied to a driven roller, the driven roller rotates while the substrate is rotating normally. Nevertheless, stop temporarily.

In the present invention, the continuous output time of the rotation stop signal is compared with the set time in order to eliminate the possibility that the rotation of the substrate is erroneously detected as being stopped in such a case. . In this case, if the set time is set to a time sufficient for the notch to pass through the driven roller, the rotation of the substrate is stopped or only the notch passes through the driven roller. Can be identified. That is, the stop of the rotation of the substrate can be reliably detected. Therefore, even if the substrate having the notch in the peripheral portion is the object to be processed, the same effects as those of the first aspect of the invention can be obtained.

According to a third aspect of the present invention, the substrate has a notch in a peripheral portion thereof, and the driven roller has a pair of a pair of rollers arranged at intervals larger than the width of the notch. A pair of rotation state detecting means for detecting a rotation state of the pair of driven rollers and outputting a rotation stop signal when the rotation of the corresponding driven roller is stopped. The substrate processing apparatus according to claim 1 or 2, further comprising a sensor.

Since the pair of driven rollers whose rotational state is detected has an interval larger than the width of the notch formed in the peripheral portion of the substrate, the notch is simultaneously formed in the pair of driven rollers. It will not hang. Therefore, based on whether or not a rotation stop signal has been output by the rotation state detection means, whether the rotation of the substrate has stopped or whether the notch portion has just passed through the driven roller can be reliably determined. Can be identified. Therefore, even if the substrate having the notch portion is a processing target, the same effect as that of the first aspect of the invention can be obtained.

The driven roller may be, together with the driving roller, a holding roller that abuts on an end surface of the substrate and holds the substrate. According to a fifth aspect of the present invention, the driven roller whose rotation state is detected by the rotation state detecting means is capable of approaching / separating from the end face of the substrate held by the holding roller. 4. The substrate processing apparatus according to claim 1, further comprising: urging means for urging the end surface of the substrate held by the holding roller.

According to the present invention, since the driven roller whose rotational state is detected is urged toward the end face of the substrate, it follows the notch when passing through the notch formed in the substrate. Also, the contact state with the end face of the substrate is maintained in the notch. Therefore, even if the substrate having the notch is to be processed, the driven roller rotates as long as the substrate rotates. Therefore, even when passing through the notch, if the substrate is rotating, the rotation stop signal is not output. Therefore, the output of the rotation stop signal can be limited to when the rotation of the substrate is stopped, so that it can be reliably determined whether the substrate is rotating. Therefore, even if the substrate having the notch portion is a processing target, the same effect as that of the first aspect of the invention can be obtained.

According to a sixth aspect of the present invention, the substrate processing apparatus according to any one of the first to fifth aspects, further comprising a double-side cleaning means for cleaning both surfaces of the substrate held by the holding roller. Device. According to the present invention, even when the rotation of the substrate is stopped for some reason, it is possible to prevent the insufficient cleaning processing from being performed on the substrate to be subsequently subjected to the cleaning processing. And the entire area of both surfaces of the substrate can be satisfactorily cleaned.

[0024]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a configuration of a wafer cleaning apparatus which is a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a sectional view taken along the line II-I of FIG.
I is a cross-sectional view, partly omitted and partly conceptually shown.

This apparatus uses a CMP (Chemical Mechanical Polishing) method for polishing a thin film formed on the surface of a wafer W.
g) For removing slurry and excess thin film remaining on the surface of the wafer W after the processing is performed, the processing chamber 5 having a substantially rectangular shape in plan view surrounded by the side walls 1, 2, 3, and 4. And the wafer W in the processing chamber 5
Holding device 6 that can hold and rotate the wafer horizontally, and the upper surface and the lower surface of the wafer W while supplying the cleaning liquid from the cleaning liquid supply nozzles 7 and 8 to the upper and lower surfaces of the wafer W held by the wafer holding device 6. And a disk-type double-side cleaning device 9 for scrubbing the lower surface.

The wafer holding device 6 includes a pair of holding hands 1 that are opposed to each other in a direction A (hereinafter, referred to as a “holding direction”) orthogonal to the side walls 2 and 4 of the processing chamber 5.
0,30. The holding hands 10 and 30 are movable in the holding direction A, and the base mounting portions 11 and
It has base portions 12 and 32 attached to 31, and three holding rollers 13 and 33, respectively, which are arranged above the base portions 12 and 32 and hold the wafer W. These holding rollers 13 and 33 are arranged on a circumference corresponding to the shape of the end surface of the wafer W. Wafer W
Is held in a state where the end surfaces thereof abut against the side surfaces of the holding rollers 13 and 33.

The base mounting portions 11 and 31 are connected to one ends of hand shafts 15 and 35 formed long in the holding direction A, and the other ends of the hand shafts 15 and 35 are connected to the side walls 2 and 4.
, And extend to the outside of the side walls 2 and 4 through the holes 14 and 34 formed in the holes. Mounting plate 36 provided outside sidewall 4
Above is fixed a cylinder 37 having a rod 38 which can be protruded or retracted along the holding direction A. The other end of the hand shaft 35 is connected to the rod 38 by the connecting plate 3.
9 is attached. That is, when the rod 38 projects or retracts, the holding hand 3
0 can move along the holding direction A.

On a mounting plate 16 provided outside the side wall 2, a cylinder 17 having a rod 18 which can be protruded or retracted in the holding direction A is fixed. One end of a connecting plate 19 having a hole (not shown) formed on the opposite side is connected to the rod 18. A connecting shaft 50 is connected to an end of the hand shaft 15 on the side drawn out of the side wall 2. The connecting shaft 50 is inserted through a hole of the connecting plate 19, and a restricting portion 51 for restricting the movement of the connecting plate 19 toward the outside of the side wall 2 is formed at the distal end. A coil spring 52 is attached between the connecting plate 19 and the hand shaft 15 so as to wind around the connecting shaft 50. That is, the hand shaft 15 is urged by the coil spring 52 in a direction toward the inside of the side wall 2.

With this configuration, when the rod 18 projects, the connecting plate 19 hits the regulating portion 51 and pulls the connecting shaft 50 and the hand shaft 15. As a result, the holding hand 10
Move toward the outside of the side wall 2. On the other hand, rod 1
When 8 is retracted, the connecting plate 19 moves toward the inside of the side wall 2. At this time, since the moving force of the connecting plate 19 is transmitted to the hand shaft 15 via the coil spring 52, the hand shaft 15 is pushed toward the inside of the side wall 2. As a result, the holding hand 10 moves toward the inside of the side wall 2.

As described above, by driving the cylinders 17, 37, the holding hands 10, 30 are held in the holding direction A.
Can be moved along. Therefore, the holding hands 10 and 30 can be moved back and forth in the opposite direction along the holding direction A, thereby holding the wafer W between the holding rollers 13 and 33 and releasing the holding. it can.

Reference numerals 20 and 40 denote bellows that can expand and contract with the movement of the holding hands 10 and 30.
The bellows 20 and 40 are for preventing the cleaning liquid supplied from the cleaning liquid supply nozzles 7 and 8 of the double-sided cleaning apparatus 9 to the wafer W and the atmosphere thereof from affecting the hand shafts 15 and 35. This is for preventing the cleaning liquid and the atmosphere from leaking out of the processing chamber 5. Furthermore, the bellows 20 and 40 prevent particles generated from the rods 18 and 38 of the cylinders 17 and 37 and the hand shafts 15 and 35 from entering the processing chamber 5.

The holding rollers 13 and 33 are rotatably provided on the base portions 12 and 32 so as to rotate while holding the wafer W. That is, the holding roller 13,
33 is fixed to the upper ends of the roller shafts 21 and 41 supported by the base portions 12 and 32 so as to be rotatable around a vertical axis. The driving force required to rotate the wafer W is given to the holding roller 33. That is, the driving force of the motor M mounted on the motor mounting plate 42 provided outside the side wall 2 is applied to the belt 4 by the central holding roller 33b of the three holding rollers 33.
3 is transmitted. Further, the driving force transmitted to the central holding roller 33b is applied to the other two holding rollers 33a, 33 via the belts 44, 45.
c.

With the above configuration, when the central holding roller 33b is driven by the motor M, the holding roller 33b
Rotates, and the other two holding rollers 33a,
33c also rotates. As a result, the wafer W held by the holding rollers 13 and 33 rotates. At this time, the holding roller 13 rotates following the rotation of the wafer W. Thus, the wafer W is rotated along the rotation direction B while being held by the holding rollers 13 and 33. The rotation speed of wafer W in this case is, for example, about 10 to 20 (rotation / minute).

As described above, while the holding roller 33 applies a rotational force to the wafer W, the holding roller 13
It only rotates with the rotation of. Therefore, hereinafter, the holding roller 33 is referred to as a “drive roller 33” and the holding roller 13 is referred to as a “driven roller 13” for convenience.
The double-sided cleaning device 9 includes an upper surface cleaning unit 60 disposed above and below the wafer W held by the wafer holding device 6.
And a lower surface cleaning unit 80. The upper surface cleaning unit 60 and the lower surface cleaning unit 80 are respectively provided with the holding hands 10 and 3.
Cleaning brushes 66 and 68 provided so as to cover a part of the entire surface area of the surface of the wafer W from the center to the peripheral edge of the wafer W at positions not interfering with zero.

The upper surface cleaning unit 60 and the lower surface cleaning unit 80
It has base portions 62 and 82 having mounting surfaces 61 and 81 on the side facing the wafer W, and rotating shafts 63 and 83 mounted on the base portions 62 and 82, and is vertically driven by rotation driving portions 64 and 84. It is configured to be able to rotate along a rotation axis C along the rotation direction C. Further, the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are respectively
5, 85 can be moved up and down. Accordingly, the wafer W can be sandwiched between the upper surface cleaning unit 60 and the lower surface cleaning unit 80 during the wafer cleaning, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 can be separated from the wafer W after the wafer cleaning. I can do it.

Upper base 62 and lower base 82
Cleaning brushes 66, 86 are provided on the respective mounting surfaces 61, 81. In the vicinity of the center of the cleaning brushes 66, 86, cleaning liquid supply nozzles 7, 8 for supplying a cleaning liquid to the wafer W are arranged, respectively. Cleaning pipes 67 and 87 are connected to the cleaning liquid supply nozzles 7 and 8. The cleaning pipes 67 and 87 are inserted into the rotating shafts 63 and 83 so as not to rotate, and the other end is connected to the other ends through three-way valves 68 and 88, such as hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid,
Chemical supply paths 69 and 89 through which a chemical such as acetic acid and ammonia are led from a chemical tank (not shown) and pure water supply paths 70 and 90 through which pure water is led from a pure water tank (not shown) are connected. With this configuration, by controlling the switching of the three-way valves 68 and 88, the cleaning pipes 67 and 87 are controlled.
The cleaning solution supply nozzles 7 and 8 can selectively discharge the chemical solution and pure water from the cleaning solution supply nozzles 7 and 8.

Next, a basic operation for scrub cleaning the wafer W will be described. Before cleaning, the holding hands 10 and 30 stand by at the standby position retracted from the holding position for holding the wafer W, and the upper surface cleaning unit 60 and the lower surface cleaning unit 80 stand by at the standby position retracted from the cleaning position for cleaning the wafer W. Waiting at. When the wafer W is transferred by the transfer arm (not shown) after the previous process is completed, the rods 18 and 38 of the cylinders 17 and 37 are retracted. As a result, the holding hands 10, 30 approach each other. As a result, the wafer W is held at its end face by the holding rollers 13, 33.
Is held. In this case, the hand shaft 15 attached to the holding hand 10 is urged by the coil spring 52 in the direction toward the inside of the side wall 2.
Is reliably chucked by the holding rollers 13 and 33.

Thereafter, the upper surface cleaning unit 60 and the lower surface cleaning unit 80 are rotated by the rotation driving units 64 and 84.
At the same time, the three-way valves 68 and 88 cause the
9, 89 and the cleaning pipes 67, 87 are connected. As a result, the chemical liquid is supplied from the cleaning liquid supply nozzles 7 and 8 to the upper and lower surfaces of the wafer W, respectively. Thereafter, the motor M is driven, and the holding roller 33 is driven to rotate. Along with this, the wafer W rotates at a low speed. Further, the upper and lower cleaning units 60 and 80 are moved in directions approaching each other by the lifting and lowering driving units 65 and 85. as a result,
The wafer W held by the holding rollers 13 and 33 is sandwiched between the cleaning brushes 66 and 86, and the upper and lower surfaces of the wafer W are rubbed by the cleaning brushes 66 and 86.

In this manner, the upper and lower surfaces of the wafer W are scrub-cleaned by the cleaning brushes 66 and 86 while the chemical solution is supplied. When the scrub cleaning with the chemical solution is completed, the upper and lower drive units 65 and 85 drive the upper surface cleaning unit 60.
The lower surface cleaning unit 80 is moved in a direction away from the wafer W, and the cleaning brushes 66 and 8 are separated from the wafer W.
6 leaves. Thereafter, the three-way valves 68 and 88 connect the cleaning pipes 67 and 87 to the pure water supply paths 70 and 90. As a result, pure water is supplied from the cleaning liquid supply nozzles 7 and 8, and the chemical liquid and the like remaining on the upper and lower surfaces of the wafer W are washed away.

As described in the section "Problems to be Solved by the Invention", when the rotation of the wafer W is stopped, the entire surface of the wafer W cannot be uniformly cleaned by the double-side cleaning device 9. Therefore, the wafer cleaning apparatus according to this embodiment automatically detects the rotation stop of the wafer W,
As a result, when the rotation of the wafer W is stopped, a configuration for performing an appropriate treatment is adopted.

When the rotation of the wafer W is stopped, the driving roller 33 continues to rotate (runs idle) by the driving force from the motor M, whereas the driven roller 13 stops.
Therefore, the configuration for detecting the rotation stop and performing the necessary measures is provided in relation to the driven roller 13.
FIG. 3 is a diagram illustrating a configuration related to the driven roller 13. The roller shaft 21a of the driven roller 13a is
2 extends to a space 25 formed near the lower end of the base portion 12 through an insertion hole 26a formed in the base portion 12, and through two bearings 27a and 28a arranged in the insertion hole 26a. It is supported rotatably. The other two
Roller shafts 21b, 21 of the two holding rollers 13b, 13c
c also extends to the space 25 through the insertion holes 26b and 26c, and is disposed in the insertion holes 26b and 26c.
The two bearings 27b and 28b are rotatably supported by the base portion 12 via 27c and 28c.

Near the lower end of the central roller shaft 21b, there is provided a rotation state detector 100 for detecting the rotation state of the roller shaft 21b. Rotation state detection unit 100
Is a slit plate 101 attached to the roller shaft 21b.
And a transmissive photoelectric sensor 102 having a light projecting unit 103 and a light receiving unit 104 arranged to face each other with the peripheral edge of the slit plate 101 interposed therebetween. As shown in FIG.
Is a disk-shaped member having a plurality of slits SL formed at predetermined intervals on a peripheral portion thereof.

When the driven roller 13b is rotating, that is, when the roller shaft 21b is rotating, the light emitted from the light projecting unit 103 intermittently passes through the slit SL. Is intermittently received. In this case, a pulse signal (hereinafter, referred to as a “rotation signal”) is output from the light receiving unit 104. On the other hand, the driven roller 13b
When the rotation of is stopped, that is, when the roller shaft 21b is stopped, the light receiving unit 104 continues to receive light or not to receive light. Therefore, the light receiving unit 104 outputs a high-level or low-level continuous signal (hereinafter, referred to as a “rotation stop signal”). The rotation signal and the rotation stop signal are provided to the determination unit 111 of the control unit 110.

The determination section 111 determines whether or not the wafer W is rotating based on a signal output from the photoelectric sensor 102. When the rotation signal is output, it can be considered that the wafer W is rotating normally, and therefore, the determination unit 111 does not perform any processing. On the other hand, when the rotation stop signal is output, the determination unit 1
Reference numeral 11 denotes a preset time determined by the rotation stop signal.
A process for determining whether or not the output is continuous over t0 is executed. That is, the determination unit 111 sets the timer 112 in response to the rotation stop signal being given. The timer 112 counts down the set time t0, and outputs a count-up signal to the determination unit 111 upon completion of the countdown. The determination unit 111
When a count-up signal is given from the timer 112 while the rotation stop signal is continuously output,
It is determined that the rotation of the wafer W has stopped. On the other hand, when a rotation signal is given after setting the timer 112, the determination unit 111 resets the timer 112.

As described above, it waits until it is determined that the rotation of the wafer W is stopped until the set time t0 elapses after the rotation stop signal is output, and the rotation is continued until the set time t0 elapses. The reason why the timer 112 is reset when the signal is output is that a case where a notch is formed in the peripheral portion of the wafer W is taken into consideration. That is, when an orientation flat (hereinafter, referred to as “orientation flat”) or a notch is formed on the peripheral portion of the wafer W, as shown in FIGS. 5A and 5B, the orientation flat OF or the notch N is driven by the driven roller. 1
3b, the rotation of the driven roller 13b rotates the wafer W
Is temporarily stopped even though it is rotating normally. Therefore, it is necessary to set the set time t0 to be longer than the time required for the notch to pass through the driven roller 13b. In this case, if the time to be set is made to correspond to the orientation flat, the width of the notch is usually smaller than the width of the orientation flat, so that the determination process is normally performed regardless of whether the notch or the orientation flat is formed in the peripheral portion. be able to.

When determining section 111 determines that rotation of wafer W is stopped, determination section 111 outputs an error signal to cycle stop command section 113. The cycle stop command unit 113 executes a cycle stop process in response to the input of the error signal. Specifically, the process performed after the scrub cleaning process in the wafer cleaning apparatus is continued as it is, and the process performed before the scrub cleaning process is stopped.

Here, as a process performed before the scrub cleaning process, a CMP process can be considered. Further, as a process performed after the scrub cleaning process, an upper surface cleaning process for further cleaning only the upper surface of the wafer W to increase cleanliness, and a spin dry process for drying the wafer W can be considered. Therefore, as a result of performing the cycle stop process, the wafer W that has been normally scrub-cleaned by the wafer cleaning apparatus is subjected to the upper surface cleaning process and the spin dry process as it is. On the other hand, for the wafer W that has not been subjected to the scrub cleaning processing in the wafer cleaning apparatus, execution of the subsequent processing is prohibited. Accordingly, it is possible to prevent the insufficient scrub cleaning process from being performed on the wafer W beforehand, and it is possible to prevent the wafer W that has been properly subjected to the scrub cleaning process.
For, the subsequent processing can be performed.

Further, the judgment unit 111 includes an alarm generation unit 114
Also outputs an error signal. The alarm generation section 114 executes an alarm generation process in response to the input of the error signal. That is, the alarm generation unit 114 drives the alarm 115 such as an LED lamp and an alarm sound generator, and notifies the user that the rotation of the wafer W is stopped in the wafer cleaning apparatus and the cycle stop processing is executed. . This allows the user to quickly investigate, for example, the cause of the stoppage of the rotation of the wafer W, and thus can promptly return the apparatus to normal operation. Therefore, productivity can be improved.

As described above, according to the first embodiment, the rotation state of the driven roller 13b is detected, and if the rotation is stopped, necessary processing such as cycle stop processing is performed. It is possible to prevent insufficient scrub cleaning processing from being executed. Therefore, it is possible to avoid lowering the quality of the wafer W. for that reason,
The yield of semiconductor devices can be improved.

Since it is determined that the rotation of the wafer W has stopped after the set time t0 has elapsed since the detection of the rotation stop of the driven roller 13b, the driven roller 13b has a notch such as an orientation flat. Even if the rotation of the driven roller 13b is temporarily stopped due to the application of the part, it is possible to prevent this state from being erroneously determined that the rotation of the wafer W is stopped.
Therefore, a highly reliable device can be provided.

The driven roller for detecting the rotation state is
The number is not limited to one as described above, but may be, for example, two or more. In this case, it is determined whether or not the continuous output time of the rotation stop signal is equal to or longer than the set time t0 for each driven roller 13, and when all the determination results are positive, it is determined that the rotation of the wafer W is stopped. The determination may be made. According to this configuration, for example, even if the photoelectric sensor corresponding to one of the driven rollers 13 fails and continuously outputs the rotation stop signal, the rotation state of the wafer W is not erroneously detected. Further, when any one of them is affirmative, it may be determined that the rotation of the wafer W is stopped. In this case, it is possible to detect as much as possible a case where the rotation of the wafer W may be stopped or a case where there is a possibility of a failure of the photoelectric sensor.

FIG. 6 is a plan view simply showing the configuration of a wafer holding device in a wafer cleaning device which is a substrate processing device according to a second embodiment of the present invention. FIG. 7 is a diagram showing a configuration related to the driven roller 13 of the wafer holding device. 6 and 7, the same reference numerals are used for the same functional parts as in FIGS. 1 and 3, respectively.

In the first embodiment, by comparing the continuous output time of the rotation stop signal with the set time t0, it is possible to avoid the erroneous determination that the temporary stop of the rotation of the driven roller 13b is the rotation stop of the wafer W. On the other hand, in the second embodiment, the rotation state of the two driven rollers 13a and 13b arranged at a predetermined interval is detected, and based on the rotation state of the two driven rollers 13a and 13b. Thus, the erroneous determination as described above is avoided.

More specifically, in the second embodiment, as shown in FIG. 6, the two driven rollers 13a and 13b are arranged at an interval d1 wider than the width do of the orientation flat OF. Roller shaft 21 of driven roller 13a
a near the lower end of the driven roller 1 as shown in FIG.
Rotation state detection unit 10 provided near the lower end of 3b
A rotation state detection unit 150 having the same configuration as that of the rotation state detection unit 150 is provided. That is, the rotation state detection unit 150
a slit plate 151 attached near the lower end of
The light projecting unit 15 opposed to the slit plate 151 across the peripheral edge thereof
3 and a photoelectric sensor 152 having a light receiving section 154. Both the rotation signal and the rotation stop signal output from the photoelectric sensors 102 and 152 of the rotation state detection units 100 and 150 are provided to the determination unit 161 of the control unit 160.

The determination unit 161 determines that the rotation of the wafer W is stopped only when the rotation stop signal is output from both the photoelectric sensors 102 and 152. That is, as described above, the two driven rollers 13
a and 13b are intervals d1 wider than the width d0 of the orientation flat OF.
Even when a notch N or a notch such as an orientation flat OF is formed in the peripheral portion of the wafer W, the notch is formed by two driven rollers 13a.
And 13b at the same time. Therefore,
If the wafer W is rotating normally, no rotation stop signal is output from both the photoelectric sensors 102 and 152. Therefore, the two photoelectric sensors 102 and 1
If the rotation stop signal is output from both of the two, it can be determined that the rotation of the wafer W has stopped.

As described above, according to the second embodiment as well, it is possible to reliably determine whether or not the rotation of the wafer W is stopped, so that a highly reliable apparatus can be provided. As described above, the two driven rollers 1
Each photoelectric sensor 1 provided in connection with 3a and 13b
It may be determined that the rotation of the wafer W has stopped immediately in response to the output of the rotation stop signal from both of the photoelectric sensors 102 and 152. The rotation stop of the wafer W may be determined when the time during which the stop signal is continuously output exceeds the set time t0. According to this configuration, the stop of the rotation of the wafer W can be more reliably determined.

FIG. 8 is a plan view showing a configuration of a wafer holding device in a wafer cleaning apparatus which is a substrate processing apparatus according to a third embodiment of the present invention. FIG. 9 is a diagram showing a configuration related to a driven roller of the wafer holding device. FIG.
9 and FIG. 9, the same reference numerals are used for the same functional portions as those in FIG. 1 and FIG. In the first and second embodiments, on the assumption that the rotation of the driven roller 13 is temporarily stopped when the notch formed in the peripheral portion of the wafer W is engaged with the driven roller 13.
The configuration for avoiding the erroneous determination of the rotation stop of the wafer W is described. However, in the third embodiment, the rotation of the wafer W is stopped by adding a driven roller 13d that is not stopped from rotating even when the notch is engaged, and by detecting the rotation state of the driven roller 13d. You are trying to avoid a misjudgment.

More specifically, as shown in FIG. 9, the roller holding unit 1 rotatably mounted on the fulcrum shaft 170 is provided.
At a predetermined position 71, a roller shaft 172 is rotatably supported. The driven roller 1 is provided at the upper end of the roller shaft 172.
3d is attached. The roller shaft 172 extends through an insertion hole 173 formed in the roller holding portion 171 to a space 174 formed near the lower end of the roller holding portion 171, and has two bearings disposed in the insertion hole 173. It is rotatably supported by the roller holder 171 via 175a and 175b.

The predetermined position of the roller holding portion 171 is pulled by a tension coil spring 176 such that the driven roller 13d is urged toward the end face of the wafer W as shown in FIG. In this case, the urging force is held by the wafer holding device 6, and the notch formed in the peripheral portion of the rotating wafer W is driven by the driven roller 13.
The distance d is set to such an extent that the driven roller 13d can abut on the notch when it hits the notch.

According to this configuration, when the wafer W having the orientation flat OF at the periphery is to be processed, the orientation flat OF
Has reached the driven roller 13d, as shown by a two-dot chain line in FIG. 8, the position of the driven roller 13d (shown by a solid line) when the peripheral portion of the wafer W other than the orientation flat OF is hung on the driven roller 13d. Further moves to a position near the center WO of the wafer W and contacts the orientation flat OF.
That is, even if the orientation flat OF is applied to the driven roller 13d, the driven roller 13d follows the orientation flat OF so that the rotation of the driven roller 13d is not stopped.

When the notch reaches the driven roller 13d when the wafer W having the notch on the peripheral edge is to be processed, similarly, the driven roller 13d follows the notch,
The rotation does not stop. Near the lower end of the roller shaft 172,
As shown in FIG. 9, a rotation state detection unit 180 having the same configuration as the rotation state detection unit 100 provided in association with the roller shaft 21b in the first embodiment is provided. That is, the rotation state detection unit 180
Slit plate 181 attached to the
And a transmissive photoelectric sensor 182 having a light projecting unit 183 and a light receiving unit 184 that are arranged to face each other so as to sandwich the peripheral portion of the light emitting device 1. The output of the photoelectric sensor 182 is provided to the determination unit 191 of the control unit 190.

As described above, the rotation of the driven roller 13d whose rotation state is detected does not stop even if the notch is engaged. Therefore, when the rotation stop signal is output from the photoelectric sensor 182, , It can be considered that the rotation of the wafer W is stopped. That is, the case where the rotation stop signal is output can be limited to the case where the rotation of the wafer W is stopped.

Therefore, the determination unit 190 determines that the photoelectric sensor 18
2 outputs a rotation stop signal, determines that the rotation of the wafer W is stopped, controls the cycle stop command unit 113 and the alarm generation unit 114 in response to the output of the rotation stop signal, and performs a cycle stop process. And an alarm generation process. As described above, also according to the third embodiment, it is possible to reliably determine whether or not the rotation of the wafer W is stopped. Therefore, as in the first and second embodiments, a highly reliable device can be provided.

In the third embodiment also, when the continuous output time of the rotation stop signal reaches the set time t0,
It may be determined that the rotation of the wafer W has stopped, and in this case, the rotation stop of the wafer W can be more reliably determined. Further, instead of the configuration of the third embodiment, for example, the driven roller 13b and the rotation state detector 1
00 may be configured to be able to approach / separate from the center WO of the wafer W, and these may be urged toward the end face of the wafer W by a tension coil spring, and the width d0 of the orientation flat
A pair of driven rollers 13a and 13b spaced apart by an interval d1 wider than
And 150 may be configured to be able to approach / separate from the center WO of the wafer W, and may be individually urged toward the end face of the wafer W by a tension coil spring.
Even in this case, the output of the rotation stop signal can be associated one-to-one with the rotation stop state of the wafer W.
The rotation stop of the wafer W can be reliably recognized.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, in the above-described embodiment, a disk-type double-side cleaning device 9 having a brush that rotates around a vertical axis is described as an example of a device for cleaning the wafer W. However, for example, a horizontal axis that is substantially perpendicular to the vertical axis is described. A roll-type double-side cleaning device around which a brush rotates may be used.

In the above embodiment, the case where the present invention is applied to an apparatus for cleaning a wafer W is described as an example. However, the present invention is applicable to an apparatus for performing processing while rotating the wafer W. Is possible. Further, in the above embodiment, the wafer W is described as an example of the substrate, but the present invention is not limited to this, and the substrate can be applied as long as the shape is substantially circular.

In addition, various design changes can be made within the scope described in the claims.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of a wafer cleaning apparatus that is a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a diagram showing a configuration related to a driven roller whose rotation state is detected.

FIG. 4 is a schematic perspective view of a rotation state detection unit.

FIG. 5 is a diagram illustrating a state in which the orientation flat and the notch are hung on a driven roller whose rotation state is detected.

FIG. 6 is a plan view illustrating a configuration of a wafer cleaning apparatus that is a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a diagram illustrating a configuration related to a driven roller whose rotation state is detected.

FIG. 8 is a plan view illustrating a configuration of a wafer cleaning apparatus that is a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 9 is a diagram showing a configuration related to a driven roller whose rotation state is detected.

FIG. 10 is a plan view showing a configuration of a conventional wafer cleaning apparatus for cleaning a wafer.

11 is a side view of the configuration shown in FIG. 10 as viewed from the Z direction in FIG. 10;

[Explanation of symbols]

 9 Double-sided cleaning device (double-sided cleaning means) 13 Driven roller 33 Drive roller 100, 150, 180 Rotational state detection unit 111, 161, 194 Judgment unit (output time comparison unit) 112 Timer (output time comparison unit) 176 Tension coil spring ( Biasing means) W wafer (substrate)

Claims (6)

[Claims] A rotating drive source for generating a rotating drive force, and a drive roller for transmitting the rotating drive force from the rotary drive source to the substrate, and holding the substrate in contact with an end surface of the substantially circular substrate. A substrate, comprising: a roller; a driven roller that rotates in accordance with the rotation of the substrate; and a rotation state detection unit that detects a rotation state of the driven roller and outputs a rotation stop signal when the rotation is stopped. Processing equipment. 2. The method according to claim 1, wherein a continuous output time of the rotation stop signal from the rotation state detecting means is compared with a predetermined time, and in response to the continuous output time of the rotation stop signal reaching the set time, an error is detected. The substrate processing apparatus according to claim 1, further comprising an output time comparison unit that outputs a signal. 3. The substrate has a notch in a peripheral portion thereof, and the driven roller includes a pair of driven rollers arranged at an interval wider than a width of the notch. The rotation state detection means has a pair of rotation state detection sensors that respectively detect the rotation state of the pair of driven rollers and output a rotation stop signal when the rotation of the corresponding driven roller is stopped. The substrate processing apparatus according to claim 1, wherein: 4. The substrate processing apparatus according to claim 1, wherein said driven roller is a holding roller which, together with said driving roller, abuts on an end face of said substrate to hold said substrate. . 5. A driven roller whose rotation state is detected by said rotation state detecting means is capable of approaching / separating from an end face of a substrate held by said holding roller, and said driven roller is held by said holding means. 4. The substrate processing apparatus according to claim 1, further comprising: an urging unit for urging the substrate held by the roller toward an end surface of the substrate. 6. The substrate processing apparatus according to claim 1, further comprising a double-side cleaning means for cleaning both surfaces of the substrate held by the holding roller.