KR100786627B1 - Apparatus for sensing rotation of wafer - Google Patents

Abstract

An apparatus for detecting rotation of a wafer is provided to inform a rotation state of the wafer to a user by automatically checking the wafer rotation, thereby preventing defect propagation to the post processes. A contact roller(10) is rotated by contacting with a frame surface(2) of a wafer(1), when the wafer is rotated. A detecting unit detects a rotation of a rotation axis(11) of the contact roller. A transport unit transports selectively the contact roller toward the frame surface of the wafer. The detecting unit comprises a rotation plate installed at the rotation axis, a light emitting sensor irradiating the light to a rotation region of the rotation plate, and a controller checking a rotation speed by sensing an on/off signal of a light receiving sensor.

Description

Apparatus for sensing rotation of wafer

1 is a perspective view showing a state of use of an operating state of an apparatus for detecting rotation of a wafer according to an embodiment of the present invention.

2 is a plan view of FIG. 1.

3 is a side view illustrating the wafer entry state of FIG. 1.

4 is a side view illustrating a wafer rotation detection state of FIG. 1.

FIG. 5 is a side view illustrating a rotational sensing device of the wafer of FIG. 1.

6 is a cross-sectional view illustrating a state of a light receiving sensor OFF signal of the rotation detection apparatus of the wafer of FIG. 1.

FIG. 7 is a cross-sectional view illustrating a light receiving sensor ON signal state of the wafer rotation detection device of FIG. 7.

8 is a perspective view of FIG. 7.

9 is a perspective view of FIG. 6.

10 is a perspective view illustrating a state of use of the wafer rotation sensing apparatus according to another embodiment of the present invention.

<Description of Major Symbols in Drawing>

1: wafer 2: edge

10: contact roller 11: axis of rotation

12: rotating plate 20: light emitting sensor

30: light receiving sensor 40: control unit

50: rotary actuator 51: housing

52: drive shaft 53: fixture

60: rotational head 100: bath

110: wafer inlet 120: wafer outlet

200: sponge brush 300: wafer rotation roller

The present invention relates to a wafer rotation sensing device, and more particularly, to accurately determine whether the wafer is rotated and the number of revolutions by using a contact roller rotating in contact with the edge of the wafer so that the equipment does not depend on the user's eyes. The present invention relates to a wafer rotation sensing device that enables quick follow-up in case of malfunction.

In general, the semiconductor wafer process includes a plurality of processes such as ion implantation process, film deposition process, diffusion process, photo process, surface polishing process, cleaning process, etc. to form a semiconductor device on the surface multilayer of a wafer mainly made of silicon. Is done.

In these wafer processes, it is very important to position the wafer in the forward direction while the process is being performed. In particular, in order to align the direction of the wafer in the forward direction, a flat zone which forms a flat zone by processing a portion of the wafer edge surface flat Type wafers have been developed and widely used.

Accordingly, conventional wafer alignment devices such as US Pat. No. 5,606,251, which aligns flat zone type wafers, can detect the flat zone of the wafer to determine whether the wafers are aligned in the correct direction.

However, the wafer in which the conventional flat zone is formed is gradually enlarged in size, for example, from 8 inches to 12 inches, and the processing cost inevitably generated due to the flat zone and the area of the wafer wasted due to the flat zone. In consideration of this, a flat zone type wafer in which a flat zone is not formed at all is widely used.

On the other hand, during the semiconductor wafer processing process, there is a surface polishing process of the wafer for polishing the surface while rotating the wafer at high speed using a chemical-mechanical polishing equipment (CMP equipment) or the like.

Such a wafer surface polishing process necessarily includes a wafer cleaning process to remove foreign substances, particles, and the like.

In addition, the wafer cleaning process is performed in various ways by applying various types of semiconductor wafer cleaning equipment as disclosed in Korean Patent Laid-Open Publication No. 10-2005-82323.

In particular, the wafer cleaning apparatus disclosed in the present invention includes a guide roller for rotating the wafer while being in contact with the wafer edge surface, and rotating the wafer in contact with the front and rear surfaces of the wafer rotated by the guide roller, respectively, in the direction of the guide roller. And a pair of moisture-absorbing sponges for cleaning the wafer at the same time by pressing.

Therefore, the wafer rotated by the guide roller in such a conventional wafer cleaning apparatus must rotate the wafer during cleaning so that the entire surface of the wafer is evenly cleaned.

However, such a conventional wafer cleaning apparatus had to determine whether the wafer was rotated depending on the operator's eyes.

Moreover, the flat zone-free wafer described above was impossible to visually detect the rotation of the wafer or the rotational speed of the wafer.

Therefore, when the wafer is not sufficiently rotated or does not reach a certain rotational speed when the wafer is cleaned due to the malfunction of the guide roller or the slip phenomenon of the wafer, the cleaning failure of the wafer occurs and the cleaning failure cannot be confirmed by the operator. There was a problem that the defect propagates up to the post-process.

In addition, in order to prevent such processing defects in advance, the operator has to check the rotation state of the wafer with the naked eye at all times.

An object of the present invention for solving the above problems, it is possible to automatically determine the rotational state and the number of revolutions of the wafer without the need to visually determine the rotation of the wafer to inform the operator of the abnormality, the wafer during cleaning of the wafer In the case of not being sufficiently rotated, it is possible to provide rapid wafer follow-up by the operator, thereby providing a wafer rotation detection apparatus that can prevent the defect from propagating to the wafer cleaning failure and the post-process.

The rotation detection device of the wafer of the present invention for achieving the above object, the contact roller is rotated in contact with the edge of the wafer during rotation of the wafer; Sensing means for sensing the rotation of the rotating shaft of the contact roller; And transfer means for selectively transferring the contact roller in the direction of the edge of the wafer, wherein the sensing means comprises: a rotating plate installed on a rotation shaft of the contact roller; Light emitting sensor for irradiating light to the rotating region of the rotating plate; A light receiving sensor receiving the light of the light emitting sensor; And a controller for detecting the presence or absence of a rotation speed by detecting a change in an ON-OFF signal of the light receiving sensor. Characterized in that comprises a.

In addition, the rotation detection apparatus of the wafer according to another embodiment of the present invention, the contact roller is rotated in contact with the edge of the wafer when the wafer rotates; Sensing means for sensing the rotation of the rotating shaft of the contact roller; And transfer means for selectively transferring the contact roller in the direction of the edge surface of the wafer, wherein the sensing means is an encoder.

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In addition, according to the present invention, the transfer means, the rotary actuator is installed on the outside of the bath (Bath); A drive shaft rotatably supported by a housing installed inside the bath; And a rotatable head detachably fixed to the drive shaft, having a light emitting sensor and a light receiving sensor embedded therein, and rotating the contact roller.

In addition, according to the present invention, the transfer means, the actuator is installed on the outside of the bath (Bath) to perform a reciprocating linear motion; A drive shaft supported by a housing installed inside the bath and driven by driving of the actuator; And a head fixed to the drive shaft, the light emitting sensor and the light receiving sensor embedded therein, and supporting the rotation of the contact roller.

On the other hand, according to the present invention, the bath is a bath for the wafer cleaning apparatus of the CMP process (chemical-mechanical polishing process) of the wafer, the wafer inlet is formed on one side and the wafer outlet on the other side, the wafer cleaning apparatus, A pair of sponge brushes for cleaning the wafer drawn into the bath through the wafer inlet; And a wafer rotation roller for rotating the wafer drawn into the bath through the wafer inlet.

Hereinafter, an apparatus for detecting a rotation of a wafer according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in Figures 1 and 2, the rotation detection device of the wafer according to a preferred embodiment of the present invention, the contact roller 10 is large so as to detect the presence or rotation of the wafer (1) And a sensing means and a conveying means.

1 and 2, the contact roller 10 is rotated in contact with the edge 2 of the wafer 1 when the wafer 1 is rotated. It is the structure to follow and rotate by rotation.

The contact surface of the contact roller 10, that is, the outer circumferential surface of the contact roller 10 is made of an elastic material having excellent frictional force to prevent the sliding of each other when the wafer 1 rotates, and the impact of the impact or vibration of the wafer 1 when rotating. It is desirable to be able to prevent vibration.

In addition, the sensing means, as detecting the rotation of the rotary shaft 11 of the contact roller 10, a variety of sensing means can be applied, a specific example thereof is shown in Figures 6, 7, 8 and 9 As described above, the sensing means may include the rotating plate 12, the light emitting sensor 20, the light receiving sensor 30, and the controller 40.

That is, the rotating plate 12 is installed on the rotating shaft 11 of the contact roller 10 and rotates together with the rotating shaft 11, and has a flat plate shape.

In addition, the light emitting sensor 20 is to irradiate light to the rotation region of the rotating plate 12, the light receiving sensor 30 is to receive the light of the light emitting sensor 20.

7 and 8, when the rotating plate 12 does not obstruct the path of light emitted from the light emitting sensor 20, the light emitted from the light emitting sensor 20 receives the light. When the sensor 30 is reached, an ON signal is generated in the light receiving sensor 30.

6 and 9, when the rotating plate 12 interferes with the path of the light irradiated from the light emitting sensor 20, the light irradiated from the light emitting sensor 20 receives the light receiving sensor. Since it does not reach 30, an OFF signal is generated in the light receiving sensor 30.

On the other hand, the control unit 40, by detecting the change in the ON-OFF signal of the light receiving sensor 30 can determine the presence or absence of the rotation speed.

That is, for example, when the ON signal or the OFF signal continues, the controller 40 may determine that the wafer 1 is in a non-rotation state, and the ON signal When the and OFF signals are alternately detected, it may be determined that the wafer 1 is in a rotating state, and the conversion time between the ON signal and the OFF signal is measured to measure the wafer ( It is also possible to derive the rotation speed of 1).

In addition, the sensing means may be equipped with an encoder in addition to the sensing means described above to detect the rotation of the contact roller 11 in accordance with the rotation of the wafer (2).

On the other hand, the transfer means, as to selectively transfer the contact roller 10 in the direction of the rim surface 2 of the wafer 1, a wide variety of transfer means can be applied, specific examples thereof are FIGS. 1 and 5 As shown in the drawing, the conveying means may include a rotary actuator 50, a drive shaft 52, and a rotational head 60.

That is, the rotary actuator 50 is installed outside the bath 100 and rotates the drive shaft 52, and various types of rotary power generators such as a motor and a cylinder may be applied.

In addition, the drive shaft 52 is installed inside the bath 100 and is rotatably supported by the housing 51.

In addition, the rotatable head 60 is detachably fixed to the drive shaft 52 by a fastener 53 such as a bolt, and as shown in FIG. 6, the light emitting sensor 20 and the light receiving sensor. 30 is built-in, it is to support the rotation of the contact roller (10).

In addition, the transfer means may employ a linear transfer means, unlike the rotary transfer means, the linear transfer means is installed on the outside of the bath (Bath, 100) as shown in FIG. A drive shaft 56 supported by an actuator 55, a housing 57 installed inside the bath 100, and driven by a drive of the actuator 55, and fixed to the drive shaft 56. The light emitting sensor 20 and the light receiving sensor 30 may be built in, and may be configured as a head 58 for supporting the contact roller 10 in rotation.

Meanwhile, the bath 100 may be applied to all processing equipment of the wafer 1, but preferably, as illustrated in FIGS. 3 and 4, a CMP process (chemical-mechanical polishing process) of the wafer 1 is performed. Wafer cleaning apparatus bath (100), the wafer inlet 110 is formed on one side and the wafer outlet 120 is formed on the other side.

In addition, the wafer cleaning apparatus may include a pair of sponge brushes 200 for cleaning the wafer 1 introduced into the bath 100 through the wafer inlet 110 and a bath (through the wafer inlet 110). It is also possible to include a wafer rotation roller 300 for rotating the wafer 1 introduced into the 100.

Therefore, referring to the operation of the wafer rotation sensing apparatus according to the preferred embodiment of the present invention, first, as shown in FIG. 3, the pivoting head 60 blocks the path of the wafer 1. In the state in which the drive shaft 52 is rotated upward and rotated upward, the wafer 1 is introduced through the wafer inlet 110 of the bath 100.

Subsequently, as shown in FIG. 4, when the wafer 1 is drawn between the pair of sponge brushes 200 and the sponge brush 200 is rotated, the wafer 1 is rotated by the wafer rotating roller ( When the wafer 300 is rotated and the roller 300 for rotation rotates, the wafer 1 is also rotated together, and the surface is washed by the sponge brush 200.

At this time, when the driving shaft 52 is reversely rotated and the pivoting head 60 is rotated downward, the contact roller 10 is in contact with the rim surface 2 of the wafer 1, and the contact roller is When 10 is rotated together with the wafer 1, as described above, a change in the ON-OFF signal is sensed by the light receiving sensor 30 shown in Figs. The controller 40 determines whether the wafer 1 is rotated or not.

The present invention is not limited to the above-described embodiments, and of course, modifications may be made by those skilled in the art without departing from the spirit of the present invention.

For example, in the drawing embodiment of the present invention is applied to the cleaning device of the wafer, but in addition to the process of all wafers or wafer processing equipment that can automatically determine whether the wafer rotation and the wafer rotation speed or rotation speed, etc. It is possible to apply.

Therefore, the scope of the claims in the present invention will not be defined within the scope of the detailed description, but will be defined by the following claims and their technical spirit.

As described above, according to the wafer rotation detection device of the present invention, it is possible to automatically determine the rotation state of the wafer to inform the operator of the abnormality, if the wafer is not sufficiently rotated during the cleaning of the wafer, prompt follow-up of the operator It is possible to have the effect of preventing the propagation of the defects up to the wafer cleaning failure and subsequent steps.

Claims (6)

delete A contact roller 10 which is rotated in contact with the edge surface 2 of the wafer 1 when the wafer 1 is rotated; Sensing means for detecting rotation of the rotating shaft 11 of the contact roller 10; And Transfer means for selectively transferring the contact roller 10 in the direction of the edge surface 2 of the wafer 1; Including, The sensing means, A rotating plate 12 installed on the rotating shaft 11 of the contact roller 10; Light emitting sensor 20 for irradiating light to the rotating region of the rotating plate 12; A light receiving sensor 30 which receives the light of the light emitting sensor 20; And A controller 40 for detecting the presence or absence of a rotation speed by detecting a change in an ON-OFF signal of the light receiving sensor 30; Rotation detection device for a wafer, characterized in that comprises a. A contact roller 10 which is rotated in contact with the edge surface 2 of the wafer 1 when the wafer 1 is rotated; Sensing means for detecting rotation of the rotating shaft 11 of the contact roller 10; And Transfer means for selectively transferring the contact roller 10 in the direction of the edge surface 2 of the wafer 1; Including, The sensing means is a rotation detection device of the wafer, characterized in that the encoder. The method of claim 2, The transfer means, A rotary actuator 50 installed outside the bath 100; A drive shaft 52 which is rotated by the housing 51 installed inside the bath 100 and rotates together with the rotation of the rotary actuator 50; And A rotatable head 60 detachably fixed to the drive shaft 52, having a light emitting sensor 20 and a light receiving sensor 30 embedded therein, and supporting the contact roller 10 in rotation; Wafer rotation detection device comprising a. The method of claim 2, The transfer means, An actuator 55 installed outside the bath 100 to perform a reciprocating linear motion; A drive shaft 56 supported by a housing 57 installed in the bath 100 and driven by the actuator 55; And A head 58 fixed to the drive shaft 56, in which the light emitting sensor 20 and the light receiving sensor 30 are embedded, and supporting the rotation of the contact roller 10; Wafer rotation detection device comprising a. The method according to claim 4 or 5, The bath 100 is a wafer cleaning apparatus bath of the CMP process (chemical-mechanical polishing process) of the wafer, the wafer inlet 110 on one side and the wafer outlet 120 is formed on the other side, The wafer cleaning apparatus, A pair of sponge brushes 200 for cleaning the wafer 1 introduced into the bath through the wafer inlet 110; And A wafer rotation roller (300) for rotating the wafer (1) drawn into the bath through the wafer inlet (110); Rotation detection device for a wafer, characterized in that comprises a.

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