JP2020150272A - Substrate cleaning device and method executed in substrate cleaning device - Google Patents

Abstract

To provide a substrate cleaning device capable of appropriately determining the replacement timing of a cleaning member, with higher throughput and lower cost than before.SOLUTION: A substrate cleaning device 1 includes a cleaning member 2 abutting on a substrate W and performing scrub cleaning, a holding member 6 for holding the cleaning member 2, an air cylinder 8 generating a force for pressing the cleaning member 2 against the substrate W, a displacement sensor 9 for measuring the position of (the arm 7 of) the holding member 6, and a control arrangement 11 for determining the replacement timing of the cleaning member 2 on the basis of the position of the holding member 6. The position of (the arm 7 of) the holding member 6 includes a cleaning position where the cleaning member 2 is abutting on the substrate W, and a non-cleaning position where the cleaning member 2 is separated from the substrate W. The control arrangement 11 determines the replacement timing of the cleaning member 2 from the change of the cleaning position when performing scrub cleaning of multiple substrates W continuously.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate cleaning apparatus for scrubbing a substrate by bringing a cleaning member into contact with the substrate and a method performed by the substrate cleaning apparatus, and is a technique for determining a replacement time of the cleaning member.

Conventionally, as a method for cleaning the surface of a substrate such as a semiconductor substrate, a scrub cleaning method has been used in which cleaning is performed by rubbing a cleaning member made of a brush, sponge, or the like while supplying pure water to the surface of the substrate. .. However, in this type of scrub cleaning, the cleaning member is directly contacted with the substrate for cleaning, so that the cleaning member is deformed or worn due to long-term use, and as a result, the contact state between the cleaning member and the substrate is maintained. If it changes, the detergency will decrease.

Therefore, conventionally, a method has been proposed in which a check work is used to check the contact state of the cleaning member, and the contact state of the cleaning member is determined from the contact marks of the cleaning member transferred to the check work (for example, a patent). Refer to Documents 1 to 3). By grasping the contact state of the cleaning member in this way, maintenance (replacement of the cleaning member, etc.) is performed only when necessary.

Japanese Unexamined Patent Publication No. 2006-7054 JP-A-2010-74191 Japanese Patent No. 4511591

However, in the conventional method, since it is necessary to use a check work to determine the replacement time of the cleaning member, it takes time and cost accordingly, and as a result, the throughput is lowered and the cost is increased. There was a problem.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate cleaning apparatus capable of appropriately determining a replacement time of a cleaning member with higher throughput and lower cost than before.

The substrate cleaning apparatus of the present invention includes a cleaning member that scrubs the substrate in contact with the substrate, a holding means for holding the cleaning member, and a pressing means provided on the holding means to generate a force for pressing the cleaning member against the substrate. , A position measuring means provided in the holding means for measuring the position of the holding means, and a replacement time determining means for determining the replacement time of the cleaning member based on the position of the holding means, and the position of the holding means is The cleaning position where the cleaning member is in contact with the substrate and the non-cleaning position where the cleaning member is separated from the substrate are included, and the replacement time determination means is the cleaning position when scrubbing a plurality of substrates continuously. Determine when to replace the cleaning member from the change.

In the present invention, when scrubbing the substrate, the cleaning position of the holding means (position of the holding means when the cleaning member is in contact with the substrate) is defined as the amount of pressing of the cleaning member against the substrate (the amount of crushing of the cleaning member). ) Is measured. The cleaning member is deformed or worn as it is used, and the pressing amount (crushing amount) becomes large. Therefore, when a plurality of substrates are continuously cleaned, the cleaning position of the holding means (the amount of pressing of the cleaning member) changes. Therefore, it is possible to appropriately determine the replacement time of the cleaning member from the change in the cleaning position when scrubbing a plurality of substrates continuously.

Further, in the substrate cleaning apparatus of the present invention, the replacement time determination means may determine that it is the replacement time of the cleaning member when the amount of change in the cleaning position becomes larger than a predetermined reference value.

In this case, when the amount of change in the cleaning position becomes larger than a predetermined reference value while scrubbing a plurality of substrates continuously, it is determined that it is time to replace the cleaning member. In this way, by comparing the amount of change in the cleaning position with a predetermined reference value, it is possible to appropriately determine the replacement time of the cleaning member.

The substrate cleaning apparatus of the present invention includes a cleaning member that scrubs the substrate in contact with the substrate, a holding means for holding the cleaning member, and a pressing means provided on the holding means to generate a force for pressing the cleaning member against the substrate. A position measuring means provided in the holding means for measuring the position of the holding means and an abnormality detecting means for detecting the presence or absence of an abnormality in the cleaning member based on the position of the holding means are provided. The cleaning position where the cleaning member is in contact with the substrate and the non-cleaning position where the cleaning member is separated from the substrate are included, and the abnormality detecting means is based on the change in the cleaning position when scrubbing one substrate. Detects the presence or absence of abnormalities in the cleaning member.

In the present invention, when scrubbing the substrate, the position of the cleaning member holding means is measured as the amount of pressing of the cleaning member against the substrate (the amount of crushing of the cleaning member). For example, the cleaning member may have a partial defect on the surface during continuous use, but in that case, vibration due to the defect occurs during cleaning of the substrate, and the defect occurs. , It is detected as a change in the cleaning position of the holding means (the position of the holding means when the cleaning member is in contact with the substrate). Therefore, it is possible to appropriately detect the presence or absence of an abnormality (partial defect occurrence, etc.) of the cleaning member from the change in the cleaning position when cleaning one substrate.

Further, in the substrate cleaning apparatus of the present invention, the abnormality detecting means may detect that there is an abnormality in the cleaning member when the amount of change in the cleaning position becomes larger than a predetermined reference amplitude.

In this case, if the amount of change in the cleaning position becomes larger than a predetermined reference amplitude while scrubbing a single substrate, it is determined that the cleaning member has an abnormality. In this way, by comparing the amount of change in the cleaning position with a predetermined reference amplitude, it is possible to appropriately determine the presence or absence of an abnormality in the cleaning member.

Further, in the substrate cleaning apparatus of the present invention, the position measuring means is a displacement sensor using a position measuring laser, and the holding means may be provided with a position measuring bracket irradiated with the position measuring laser. ..

In this case, when the position measurement bracket provided in the holding means is irradiated with the position measurement laser, the reflected light (position measurement laser) from the position measurement bracket is detected by the displacement sensor and held from the detection result. The position of the means is measured. As a result, the position of the holding means (cleaning position) can be measured in a non-contact manner.

Further, in the substrate cleaning apparatus of the present invention, two cleaning members are arranged above and below the substrate so as to sandwich the substrate, and when the substrate is sandwiched between the two cleaning members for scrub cleaning, the cleaning positions of the two cleaning members are located. A noise removing means for removing noise when measuring the cleaning position may be provided by performing differential processing of the change.

In the present invention, when the substrate is sandwiched between two cleaning members arranged above and below the substrate for cleaning, the position (cleaning position) of the holding means of each cleaning member is measured. When cleaning the substrate with a cleaning member, vibration noise may occur. This vibration noise is extremely small compared to the vibration when the cleaning member has a partial defect. Since it is considered that the vibration noise is generated in the same manner in the two cleaning members arranged above and below the substrate, the vibration noise is removed (cancelled) by performing the difference processing of the change in the cleaning position of the holding means of the two cleaning members. )can do. This makes it possible to measure changes in the position (cleaning position) of the holding means with high accuracy.

Further, the substrate cleaning device of the present invention is a load measuring means for measuring the force of pressing the cleaning member against the substrate, and a load controlling means for controlling the force of pressing the cleaning member against the substrate by feeding back the measurement results of the load measuring means. And may be provided.

In this case, the force for pressing the cleaning member against the substrate can be measured by the load measuring means, and the force for pressing the cleaning member against the substrate can be controlled while feeding back the measurement result (actual pressing force). Therefore, the actual pressing force and the amount of deformation of the cleaning member can be compared, and more accurate management becomes possible.

The method of the present invention is a method for determining the replacement time of a cleaning member of a substrate cleaning device for scrubbing a substrate, and the method for determining the replacement time includes a measurement step for measuring the position of a holding means for holding the cleaning member and a holding means. The position of the holding means for holding the cleaning member includes the determination step of determining the replacement time of the cleaning member based on the position of the cleaning member, and the cleaning position where the cleaning member is in contact with the substrate and the cleaning member from the substrate. In the determination step, the replacement time of the cleaning member is determined from the change in the cleaning position when scrubbing a plurality of substrates continuously, including the non-cleaning positions separated from each other.

Also by this method, it is possible to appropriately determine the replacement time of the cleaning member from the change in the cleaning position of the holding means when scrubbing a plurality of substrates continuously.

Further, the replacement time determination method of the present invention is a load control step for measuring the force for pressing the cleaning member against the substrate and a load control for controlling the force for pressing the cleaning member against the substrate by feeding back the measurement results of the load measurement step. And may include.

In this case, the force of pressing the cleaning member against the substrate can be measured, and the force of pressing the cleaning member against the substrate can be controlled while feeding back the measurement result (actual pressing force). Therefore, it is possible to compare the actual pressing force with the amount of deformation of the cleaning member, and it is possible to determine the replacement time with higher accuracy.

Further, the method of the present invention is a method for detecting an abnormality in a cleaning member of a substrate cleaning device for scrubbing a substrate, and the abnormality detecting method includes a measurement step for measuring the position of a holding means for holding the cleaning member and a holding means. The position of the holding means for holding the cleaning member includes the detection step of detecting the presence or absence of abnormality of the cleaning member based on the position of the cleaning member, and the cleaning position where the cleaning member is in contact with the substrate and the cleaning member is the substrate. In the detection step, the presence or absence of an abnormality in the cleaning member is detected from the change in the cleaning position when scrubbing a single substrate.

Also by this method, it is possible to appropriately detect the presence or absence of an abnormality (occurrence of partial defect, etc.) of the cleaning member from the change in the cleaning position of the holding means when cleaning one substrate.

According to the present invention, when scrubbing a plurality of substrates continuously, it is possible to appropriately determine the replacement time of the cleaning member from the change in the position (cleaning position) of the holding means. In this case, since it is not necessary to use the check work as in the conventional case, it is possible to realize high throughput and low cost accordingly.

It is a perspective view which shows the structure of the substrate cleaning apparatus in embodiment of this invention. It is explanatory drawing which shows the structure of the substrate cleaning apparatus in embodiment of this invention. It is explanatory drawing of the position of the cleaning member and the holding means in embodiment of this invention. In the embodiment of the present invention, it is a figure which shows the change (displacement) of the cleaning position of the holding means when cleaning a plurality of substrates continuously. In the embodiment of the present invention, it is a figure which shows the change (displacement) of the cleaning position of the holding means at the time of cleaning one substrate. It is a figure which shows the change (displacement) of the position of the holding means which removed (cancelled) vibration noise in the embodiment of this invention. It is a perspective view which shows the structure of the substrate cleaning apparatus in another embodiment. It is a perspective view which shows the structure of the substrate cleaning apparatus in still another Embodiment. It is a perspective view which shows the structure of the substrate cleaning apparatus in still another Embodiment. Further, it is explanatory drawing which shows the measurement position of the amount of change in still another Embodiment. It is a perspective view which shows the structure of the substrate cleaning apparatus in still another Embodiment. It is a perspective view which shows the structure of the substrate cleaning apparatus in still another Embodiment.

Hereinafter, the substrate cleaning apparatus according to the embodiment of the present invention will be described with reference to the drawings. In the present embodiment, the case of a substrate cleaning device used for scrub cleaning or the like of a substrate requiring a high degree of cleanliness such as a semiconductor substrate, a glass substrate, or a liquid crystal panel will be exemplified.

The configuration of the substrate cleaning apparatus according to the embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a configuration of a substrate cleaning device according to this embodiment. As shown in FIG. 1, the substrate cleaning device 1 grips and rotates a substrate W such as a semiconductor substrate, and the cleaning member 2 cleans both sides of the substrate W. The substrate cleaning device 1 includes a plurality of spindles 5 that support and rotate the peripheral edge of the substrate W, and foamed polyurethane, PVA, etc. formed in a substantially cylindrical shape and attached so as to cover the entire circumference of the shafts 3 (3a, 3b). A cleaning member 2 (2a, 2b) made of a roll sponge composed of the above, and a cleaning liquid supply nozzle 4 for supplying a cleaning liquid such as ultrapure water are provided on the upper surface of the substrate W. The cleaning member 2 is configured to move up and down as shown by arrows H and to rotate around the axis 3 of the shaft 3 as shown by arrows F1 and F2.

Further, a driving device such as a motor is connected to the spindle 5, all of the spindles 5 rotate at the same rotation speed, and the substrate W is rotated at a predetermined rotation speed. It should be noted that at least one of the spindles 5 may be configured to rotate and the others to rotate in a driven manner.

The material of the cleaning member 2 is not limited to a sponge-like material, and may be, for example, a cleaning member having a polishing cloth attached to its surface. As the cleaning member 2, a roll sponge having a cylindrical cleaning surface is used. On the surface of the cylindrical portion of the cleaning member 2, a plurality of homogeneous small-diameter cylindrical protrusions extending in the coaxial direction with the cylinder are provided. By pressing the protrusion against the substrate W during cleaning, the cleaning effect of the substrate W can be enhanced.

In the substrate cleaning device 1, in a state where the cleaning member 2 is retracted in the vertical direction of the substrate W by the drive device 6, the substrate W is chucked and held by the spindle 5 to move the substrate W in the direction of arrow X in FIG. Rotate. Then, the cleaning member 2 is lowered or raised while rotating at a predetermined rotation speed to bring it into contact with the upper and lower surfaces of the substrate W with a predetermined pressing force or pressing amount, thereby bringing the substrate W into contact with the substrate W.
Rub on both sides to clean both sides.

Further, at the time of cleaning, the cleaning liquid (ultra pure water and chemicals such as ionized water, dilute hydrofluoric acid, hydrogen peroxide solution) was sprayed from the cleaning liquid supply nozzle 4 onto the upper surface of the substrate W, and installed below the substrate W. The cleaning liquid is also sprayed onto the lower surface of the substrate W from a cleaning liquid supply nozzle (not shown).

FIG. 2 is an explanatory view of the substrate cleaning device of the present embodiment. As shown in FIG. 2, the cleaning member 2 is held by the holding member 6. In the example of FIG. 2, the arm 7 extends from the upper holding member 6. The arm 7 is provided with an air cylinder 8 that generates a force that presses the cleaning member 2 against the substrate W. Further, the arm 7 is provided with a position measurement bracket 10 on which a position measurement laser is irradiated from the displacement sensor 9. The displacement sensor 9 has a function of measuring the position of the arm 7 (and the upper holding member 6) by detecting the reflected light (laser for position measurement) from the position measurement bracket 10. The operation of the air cylinder 8 and the displacement sensor 9 is controlled by the control device 11.

On the other hand, the lower holding member 6 is not provided with an arm. In this case, the holding member 6 is provided with an air cylinder 8 that generates a force for pressing the cleaning member 2 against the substrate W. Further, the holding member 6 is provided with a position measurement bracket 10 on which a position measurement laser is irradiated from the displacement sensor 9. The displacement sensor 9 has a function of measuring the position of the lower holding member 6 by detecting the reflected light (laser for position measurement) from the position measurement bracket 10. The operation of the air cylinder 8 and the displacement sensor 9 is also controlled by the control device 11.

The control device 11 has a function of determining the replacement time of the upper cleaning member 2 based on the position of the arm 7 (and the upper holding member 6), and the lower side based on the position of the lower holding member 6. It has a function of determining the replacement time of the cleaning member 2. Further, the control device 11 has a function of detecting the presence or absence of an abnormality in the upper cleaning member 2 based on the position of the arm 7 (and the upper holding member 6), and based on the position of the lower holding member 6. It has a function of detecting the presence or absence of abnormality in the lower cleaning member 2. The replacement time determination method and the abnormality detection method will be described in detail later with reference to the drawings.

Here, the upper holding member 6 and the arm 7, and the lower holding member 6 correspond to the holding means of the present invention, respectively. Further, the air cylinder 8 corresponds to the pressing means of the present invention, and the displacement sensor 9 corresponds to the position measuring means of the present invention. Further, the control device 11 corresponds to the replacement time determining means and the abnormality detecting means of the present invention.

FIG. 3 is an explanatory diagram of the positions of the cleaning member 2 and the holding member 6. In FIG. 3A, the cleaning member 2 is in contact with the substrate W. This position is a position where the cleaning member 2 is pressed against the substrate W with a constant pressure to clean the substrate W. The position of the cleaning member 2 is called a cleaning position. The position of the holding member 6 when the cleaning member 2 is in contact with the substrate (when the cleaning member 2 is in the cleaning position) is referred to as a "cleaning position".

In FIG. 3B, the cleaning member 2 is separated upward from the substrate W. This position is the position where the rotation of the cleaning member 2 is started. The position of the cleaning member 2 is called the upper position. Further, in FIG. 3C, the cleaning member 2 is further separated to the right side. This position is a position for the cleaning member 2 to stand by. The position of the cleaning member 2 is called a standby position. The position of the holding member 6 when the cleaning member 2 is separated from the substrate (when the cleaning member 2 is in the upper position and the standby position) is referred to as a “non-cleaning position”.

The control device 11 determines the replacement time of the cleaning member 2 from the change in the cleaning position when the plurality of substrates W are continuously scrubbed. Specifically, when the amount of change in the cleaning position becomes larger than a predetermined reference value, it is determined that it is time to replace the cleaning member 2. FIG. 4 is a diagram showing changes (displacements) in cleaning positions when a plurality of substrates are continuously cleaned. As shown in FIG. 4A, each time the plurality of substrates W are cleaned, the displacement sensor 9 measures the change (displacement) in the cleaning position. That is, the difference (displacement) from the initial value of the cleaning position (the position immediately after the replacement of the cleaning member 2) is measured, and when the difference (displacement) becomes larger than the predetermined reference value (threshold value), the cleaning member It is determined that it is time to replace 2. This is because it is considered that when the cleaning member 2 is used for a long time, the sponge gradually becomes soft and the cleaning position is lowered.

As shown in FIG. 4B, it is also possible to detect an abnormality in which the sponge of the cleaning member 2 becomes hard due to the influence of a chemical or the like from the change in the cleaning position when scrubbing a plurality of substrates W continuously. it can. Further, as shown in FIG. 4C, it is also possible to detect an abnormality in which the cleaning member 2 has fallen off.

Further, the control device 11 detects the presence or absence of an abnormality in the cleaning member 2 from the change in the cleaning position when scrubbing one substrate W. Specifically, when the amount of change in the cleaning position becomes larger than a predetermined reference amplitude, it is detected that the cleaning member 2 has an abnormality. FIG. 5 is a diagram showing a change (displacement) in the cleaning position when cleaning one substrate W. As shown in FIG. 5A, when there is no abnormality in the cleaning member 2, the amount of change in the cleaning position (vibration width Δh) when cleaning one substrate W is within a predetermined reference amplitude. It fits.

On the other hand, as shown in FIG. 5B, partial defects (protrusion defects, etc.) may occur on the surface while the cleaning member 2 is being used continuously. In that case, vibration due to the defect occurs when cleaning one substrate W, and the amount of change in the cleaning position (vibration width Δh) when cleaning one substrate W is Exceeds a predetermined reference amplitude. In this way, the occurrence of protrusion defects and the like is detected as a change in the cleaning position.

Further, when the substrate W is sandwiched between the two cleaning members 2 for scrub cleaning, the control device 11 performs noise (noise) when measuring the cleaning position by performing differential processing for changes in the cleaning positions of the two cleaning members 2. It has a function to remove vibration noise). FIG. 6 is a diagram showing a change in the cleaning position (change in the cleaning position when cleaning one substrate W) from which vibration noise is removed (cancelled). As shown in FIG. 6A, when there is no abnormality in the cleaning member 2, the vibration noise is canceled and the amount of change in the cleaning position (vibration width Δh) is suppressed to be extremely small. In this case, as shown in FIG. 6B, when the cleaning member 2 has an abnormality (partial defect or the like), the vibration caused by the defect is detected with high accuracy (with high S / N). be able to.

According to the substrate cleaning apparatus 1 of the present embodiment as described above, when a plurality of substrates W are continuously scrubbed and cleaned, the replacement time of the cleaning member 2 can be appropriately determined from the change in the cleaning position. .. In this case, since it is not necessary to use the check work as in the conventional case, it is possible to realize high throughput and low cost accordingly.

That is, in the present embodiment, when scrubbing the substrate W, the cleaning position (when the cleaning member 2 is in contact with the substrate) is set as the amount of pressing of the cleaning member 2 against the substrate W (the amount of crushing of the cleaning member). The position of the holding member 6 or the arm 7) is measured. The cleaning member 2 is deformed or worn as it is used continuously, and the pressing amount (crushing amount) becomes large. Therefore, when the plurality of substrates W are continuously cleaned, the cleaning position (the amount of pressing of the cleaning member 2) changes. Therefore, the replacement time of the cleaning member 2 can be appropriately determined from the change in the cleaning position when the plurality of substrates W are continuously scrubbed.

Specifically, as shown in FIG. 4A, when a plurality of substrates W are continuously scrubbed and washed, when the amount of change in the washing position becomes larger than a predetermined reference value (threshold value), the washing is performed. It is determined that it is time to replace the member 2. In this way, by comparing the amount of change in the cleaning position with a predetermined reference value, it is possible to appropriately determine the replacement time of the cleaning member 2.

In addition, the cleaning member 2 may have a partial defect on its surface as it is used continuously. In that case, vibration due to the defect occurs when the substrate W is being cleaned, and the occurrence of the defect is the cleaning position (the position of the holding member 6 or the arm 7 when the cleaning member 2 is in contact with the substrate). ) Is detected as a change. Therefore, it is possible to appropriately detect the presence or absence of an abnormality (partial defect occurrence, etc.) of the cleaning member 2 from the change in the cleaning position when cleaning one substrate W.

Specifically, as shown in FIG. 5B, when one substrate W is scrub-cleaned and the amount of change in the cleaning position (vibration width Δh) becomes larger than a predetermined reference amplitude, the cleaning is performed. It is determined that the member 2 has an abnormality (protrusion defect). In this way, by comparing the amount of change in the cleaning position (vibration width Δh) with a predetermined reference amplitude, it is possible to appropriately determine the presence or absence of an abnormality in the cleaning member 2.

Further, in the present embodiment, the displacement sensor 9 is used as the position measuring means of the holding member 6 and the arm 7. When the position measurement laser is applied to the position measurement bracket 10 provided on the holding member 6 or the arm 7, the displacement sensor 9 detects the reflected light (position measurement laser) from the position measurement bracket 10. The positions of the holding member 6 and the arm 7 are measured from the detection result. In this way, the positions (cleaning positions) of the holding member 6 and the arm 7 can be measured in a non-contact manner.

Further, in the present embodiment, when the substrate is sandwiched between the two cleaning members 2 arranged above and below the substrate W for cleaning, the cleaning position of each cleaning member 2 is measured. When cleaning the substrate with the cleaning member 2, vibration noise may be generated, but this vibration noise (vibration that is extremely small compared to the vibration when the cleaning member 2 has a partial defect) is generated in the substrate. Since it is considered that the two cleaning members 2 arranged above and below the W are generated in the same manner, the vibration noise is removed by performing the difference processing of the change in the cleaning position of the holding member 6 or the arm 7 of the two cleaning members 2. Can be (cancelled). This makes it possible to measure the change in the position (cleaning position) of the holding member 6 or the arm 7 with high accuracy.

Further, in the present embodiment, the amount of deformation of the cleaning member 2 can be directly monitored. On the other hand, when indirectly monitoring the amount of deformation of the cleaning member 2, for example, when monitoring the motor torque of the motor that rotates the substrate W, it is considered that the cleaning member 2 is affected by something other than the cleaning member 2. For example, the motor torque changes depending on the state of other parts (such as a sealing member such as an O-ring and a timing belt that transmits a rotational drive) related to the rotational operation of the substrate W. Further, the frictional resistance on the surface of the substrate W also changes depending on the surface condition of the substrate W (type of substrate, flow rate of rinse, etc.), so that the motor torque also changes. As described above, since the detection by the motor torque includes a plurality of factors other than the cleaning member 2, it is difficult to detect it as a change of the cleaning member 2 itself. According to the present embodiment, since the deformation amount of the cleaning member 2 is directly monitored, it is not affected by factors other than the cleaning member 2, so that it is easy to detect the change of the cleaning member 2 itself.

Although the embodiments of the present invention have been described above by way of illustration, the scope of the present invention is not limited to these, and can be changed or modified according to an object within the scope described in the claims. is there.

For example, FIG. 7 is a diagram showing a configuration example of a substrate cleaning device according to another embodiment of the present invention. The substrate cleaning device 1-3 shown in FIG. 7 uses a pencil-type sponge for the cleaning member 2 instead of the roll sponge used as the cleaning member 2 in the substrate cleaning device 1 shown in FIG. The cleaning member (hereinafter referred to as "pencil type sponge") 2 is formed of foamed polyurethane, PVA, or the like in a cylindrical shape, trapezoidal shape, or the like, and the cleaning surface 2c provided on the lower surface thereof is an axis orthogonal to the cleaning surface 2a. It abuts on the substrate W while rotating around (rotating shaft 42) in a horizontal plane. The configuration of other parts of the substrate cleaning device 1-3 shall be the same as that of the substrate cleaning device 1, and the description thereof will be omitted here.

The pencil-type sponge 2 is held by the cleaning member holding mechanism 40. The cleaning member holding mechanism 40 has a swing arm 41 overhanging in the horizontal direction, a rotating shaft 42 is provided vertically downward at the tip of the swing arm 41, and is held by a holder 43 at the tip of the rotating shaft 42. A pencil type sponge 2 is attached. The rotation shaft 42 is rotated in the direction of arrow D by a rotation mechanism (not shown), and the pencil-type sponge 2 is rotated in the same direction. Further, a swing shaft 44 and a drive device 45 are provided at the rear end of the swing arm 41 so that the swing arm 41 swings in the direction of arrow E and moves up and down in the direction of arrow J. ..

In the substrate cleaning apparatus 1-3 having the above configuration, a cleaning liquid such as pure water is supplied from the cleaning liquid supply nozzle 4 to the upper surface of the substrate W supported by the spindle 5 and rotating in the direction of the arrow X in FIG. 7, and a pencil type. The sponge 2 is lowered while rotating at a predetermined constant rotation speed, and the cleaning surface 2c is brought into contact with the position A (cleaning start position) on the upper surface of the substrate W with a predetermined pressing force or pressing amount. From that state, the swing arm 41 is swung in the direction of arrow E so that the pencil-type sponge 2 passes through the position O, which is the rotation center position of the substrate W, so that the pencil-type sponge 2 is rubbed against the upper surface of the substrate W. Scrub clean. When the scrub cleaning is completed, the swing arm 41 is raised and swiveled to move the pencil-type sponge 2 to the position C, which is the evacuation position, via the position B, which is the cleaning outer peripheral position.

The cleaning member 2 may be provided on both sides of the substrate W, or may be provided on only one side of the substrate W. When the cleaning member 2 is provided on both sides of the substrate W, only the roll sponge may be used, only the pencil type sponge may be used, or the roll sponge and the pencil type sponge may be used in combination.

Further, FIG. 8 is a perspective view showing the configuration of the substrate cleaning device according to still another embodiment. In the substrate cleaning device 1 shown in FIG. 2, an air cylinder 8 is used as a means for generating a force for pressing the cleaning member 2 against the substrate W, and a displacement sensor 9 is used as a means for measuring the position of the arm 7 (or the holding member 6). However, as shown in FIG. 8, the servomotor 12 may be used.

In this case, a load cell 13 is provided at the mounting portion of the arm 7 so that the pressing force (load) can be measured, and the servo motor 12 is rotated until the load cell 13 reaches a constant load. Since the number of revolutions and the phase of the servomotor 12 can be detected by the servomotor 12 itself, the cleaning position changes for each substrate W by recording the position (cleaning position) of the arm 7 when a constant load is applied. Can be measured, and the replacement time of the cleaning member 2 can be determined from the change in the cleaning position.

Further, FIG. 9 is a perspective view showing the configuration of the substrate cleaning device according to still another embodiment. In the substrate cleaning device 1 shown in FIG. 2, an air cylinder 8 is used as a means for generating a force for pressing the cleaning member 2 against the substrate W, and a displacement sensor 9 is used as a means for measuring the position of the arm 7 (or the holding member 6). However, as shown in FIG. 9, the contact sensor 14 may be used.

For example, the amount of crushing corresponding to the replacement time of the cleaning member 2 (the amount of crushing equivalent to the replacement time) is measured and grasped in advance, and the arm 7 (or the holding member 6) is crushed by the position (the amount of crushing corresponding to the replacement time). The contact sensor 14 can detect that the position) has been reached, and the replacement time of the cleaning member 2 can be determined.

Further, in the above example, the case of measuring the change amount of the cleaning position has been described, but the place where the change amount is measured is not limited to the cleaning position. For example, as shown in FIG. 10, the place where the amount of change is measured may be the self-cleaning position of the cleaning member. Further, a dedicated place (dedicated measurement position) for measuring the amount of change may be provided in the module. At the self-cleaning position and the dedicated measurement position, it is possible to measure only the amount of change of the cleaning member 2 without being affected by the force of pressing the cleaning member 2 against the substrate W or the warp due to the weight of the substrate W. .. The measurement of the amount of change at the self-cleaning position or the dedicated measurement position is particularly suitable when the thickness and the amount of change differ depending on the substrate W to be processed.

Further, as shown in FIG. 11, the control device 11 may have a load CLC (Closed Loop Control) function. When the amount of change in the cleaning position reaches a predetermined reference value by the load CLC, the air cylinder 8 is controlled by the control device 11 so that the cleaning position becomes the position immediately after replacement. Then, this is repeated, and when a predetermined number of times have passed, it is time to replace the cleaning member.

In the case of load CLC, the load cell 13 is provided on the arm 7, the pressing load is measured at the same time, and the pressing force can be controlled while feeding back the actual pressing load. Therefore, the actual pressing load and the amount of deformation of the sponge of the cleaning member 2 can be measured. Since comparisons can be made, more accurate management is possible. When the sliding resistance changes due to wear of the components of the elevating mechanism such as the air cylinder 8, if CLC is not performed, the load actually applied will also shift, and it is possible to distinguish between changes in the cleaning member 2 and changes in other components. Is difficult. For example, at the initial stage of use, the pressing force of the cleaning member 2 is 4N and the displacement is 1 mm. Assuming that the air cylinder 8 is worn and the sliding resistance is increased by 1N during use, the force that actually presses the cleaning member 2 is used by friction and becomes equivalent to 3N. Therefore, even if the cleaning member 2 is normal, the amount of deformation of the cleaning member 2 is crushed only by the pressing force of 3N, and the actual change of the cleaning member 2 cannot be accurately monitored. On the other hand, when the load CLC function is provided, the pressing load can be kept constant, so that the amount of deformation of only the cleaning member 2 can be monitored.

Further, as shown in FIG. 12, the control device 11 may have a position CLC (Closed Loop Control) function. In this case, the control device 11 performs position CLC (Closed Loop Control) using the measured value of the displacement sensor. By performing the position CLC, a constant amount can be reliably pressed and the contact area of the cleaning member 2 can be made constant.

As described above, the substrate cleaning apparatus according to the present invention has an effect that the replacement time of the cleaning member can be appropriately determined with higher throughput and lower cost than the conventional ones, and is obtained from a semiconductor substrate, a glass substrate, and a liquid crystal panel. It is useful for scrub cleaning of substrates that require a high degree of cleanliness.

1 Board cleaning device 2 Cleaning member 3 Shaft 4 Cleaning liquid supply nozzle 5 Spindle 6 Holding member 7 Arm 8 Air cylinder 9 Displacement sensor 10 Position measurement bracket 11 Control device W board

Claims (6)

A holding means that holds a cleaning member that comes into contact with a substrate for scrubbing and is provided with a bracket for position measurement.
A pressing means provided on the holding means and generating a force for pressing the cleaning member against the substrate.
A displacement sensor that measures the position of the position measurement bracket by irradiating the position measurement bracket with a position measurement laser,
A control device having a position CLC function for controlling the pressing means and the displacement sensor and transmitting a signal for changing the position of the cleaning member based on the measured value of the displacement sensor to the pressing means is provided. It is a substrate cleaning device
In measuring the cleaning position, which is the position of the position measuring bracket when the cleaning member comes into contact with the substrate at a predetermined position by the control device, the initial value of the cleaning position is set and a plurality of substrates are used. Replacement time to measure the difference between the initial value of the cleaning position and the cleaning position during continuous scrub cleaning, and to determine the replacement time of the cleaning member from the number of cleanings and the change in the difference corresponding to the number of cleanings. A substrate cleaning device including a determination means. The substrate cleaning device according to claim 1, wherein the cleaning member is a roll sponge or a pencil-type sponge. A first nozzle that injects a cleaning liquid onto the upper surface of the substrate,
The substrate cleaning apparatus according to claim 1 or 2, further comprising a second nozzle for injecting a cleaning liquid onto the lower surface of the substrate. The substrate cleaning device according to any one of claims 1 to 3, wherein the pressing means is an air cylinder. It is a method of determining the replacement time of a cleaning member of a substrate cleaning device that abuts on a substrate and scrubs the substrate.
The replacement time determination method is
A position measurement step of irradiating a position measurement bracket provided on a holding member holding the cleaning member with a position measurement laser to measure the position of the position measurement bracket,
A signal for changing the position of the cleaning member to a pressing means provided on the holding member for generating a force for pressing the cleaning member against the substrate by the position CLC function based on the measured value in the position measurement step. With control steps to send
In measuring the cleaning position, which is the position of the position measuring bracket when the cleaning member comes into contact with the substrate at a predetermined position, the initial value of the cleaning position is set and a plurality of substrates are continuously scrubbed. A replacement time determination step of measuring the difference between the initial value of the cleaning position at the time of cleaning and the cleaning position and determining the replacement time of the cleaning member from the number of cleaning sheets and the change of the difference corresponding to the number of cleaning sheets. A method for determining the replacement time, which is characterized in that The method for determining replacement time of a cleaning member according to claim 5, wherein the pressing means is an air cylinder.

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