JP2014529186A5 - - Google Patents

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Publication number
JP2014529186A5
JP2014529186A5 JP2014523999A JP2014523999A JP2014529186A5 JP 2014529186 A5 JP2014529186 A5 JP 2014529186A5 JP 2014523999 A JP2014523999 A JP 2014523999A JP 2014523999 A JP2014523999 A JP 2014523999A JP 2014529186 A5 JP2014529186 A5 JP 2014529186A5
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JP
Japan
Prior art keywords
assembly
barrier laminate
electrical device
multilayer film
protective layer
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Application number
JP2014523999A
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English (en)
Japanese (ja)
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JP6139525B2 (ja
JP2014529186A (ja
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Priority claimed from PCT/US2012/048763 external-priority patent/WO2013019695A2/en
Publication of JP2014529186A publication Critical patent/JP2014529186A/ja
Publication of JP2014529186A5 publication Critical patent/JP2014529186A5/ja
Application granted granted Critical
Publication of JP6139525B2 publication Critical patent/JP6139525B2/ja
Active legal-status Critical Current
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JP2014523999A 2011-08-04 2012-07-30 縁部保護バリアアセンブリ Active JP6139525B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161515043P 2011-08-04 2011-08-04
US61/515,043 2011-08-04
PCT/US2012/048763 WO2013019695A2 (en) 2011-08-04 2012-07-30 Edge protected barrier assemblies

Publications (3)

Publication Number Publication Date
JP2014529186A JP2014529186A (ja) 2014-10-30
JP2014529186A5 true JP2014529186A5 (enExample) 2015-09-17
JP6139525B2 JP6139525B2 (ja) 2017-05-31

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ID=47629866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014523999A Active JP6139525B2 (ja) 2011-08-04 2012-07-30 縁部保護バリアアセンブリ

Country Status (8)

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US (2) US9614113B2 (enExample)
EP (1) EP2742537A4 (enExample)
JP (1) JP6139525B2 (enExample)
KR (1) KR101911581B1 (enExample)
CN (1) CN103988578B (enExample)
SG (1) SG2014007876A (enExample)
TW (1) TW201316535A (enExample)
WO (1) WO2013019695A2 (enExample)

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TWI599489B (zh) * 2014-04-25 2017-09-21 財團法人工業技術研究院 面板封裝結構
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