JP2014527315A - 半導体集積のための反応しないドライ除去プロセス - Google Patents
半導体集積のための反応しないドライ除去プロセス Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 121
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims description 51
- 230000010354 integration Effects 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 238000000151 deposition Methods 0.000 claims abstract description 57
- 238000005530 etching Methods 0.000 claims abstract description 53
- 230000008021 deposition Effects 0.000 claims abstract description 31
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 239000000243 solution Substances 0.000 claims abstract description 20
- 239000007864 aqueous solution Substances 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 55
- 239000003989 dielectric material Substances 0.000 claims description 49
- 230000009969 flowable effect Effects 0.000 claims description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 14
- 229910021529 ammonia Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 238000005137 deposition process Methods 0.000 claims 4
- 238000002207 thermal evaporation Methods 0.000 claims 2
- 238000001039 wet etching Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 152
- 239000000463 material Substances 0.000 description 38
- 239000002243 precursor Substances 0.000 description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 28
- 229910052757 nitrogen Inorganic materials 0.000 description 20
- 238000012545 processing Methods 0.000 description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 15
- 229920005591 polysilicon Polymers 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000012530 fluid Substances 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- 229910017840 NH 3 Inorganic materials 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 7
- 239000012686 silicon precursor Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 230000016507 interphase Effects 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- -1 H 2 N (SiH 3 ) Chemical class 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
本出願は、2012年9月21日に出願の「INSENSITIVE DRY REMOVAL PROCESS FOR SEMICONDUCTOR INTEGRATION」と題する米国特許出願第13/624,693号のPCT出願であり、2011年9月26日に出願の「INSENSITIVE DRY REMOVAL PROCESS FOR SEMICONDUCTOR INTEGRATION」と題する米国仮特許出願第61/539,270号に関連し、その特許出願の恩典を主張し、いずれの特許出願も全ての目的のためにその全体を参照して本明細書に援用される。
ドライエッチャントガス混合物を用いるエッチング選択性の間の比較例が作られた。そのエッチングは、HDP CVD及び流動性CVDによって堆積された酸化物を含む基板上で行われた。流動性酸化物はエッチング前に400℃でのアニールによって硬化した。その酸化物は、13秒の時間にわたって、三フッ化窒素及びアンモニアを含むドライエッチャントガス混合物に暴露された。以下の表Iにおいて見ることができるように、ドライエッチャントガス混合物は、HDP品質酸化物に比べて、流動性酸化物をわずかだけ多く除去するが、そのドライエッチャントガスが酸化物品質に対して実質的に反応しないことを示す。
Claims (19)
- 半導体基板の表面に誘電体層を堆積し、前記半導体基板の表面から前記誘電体層をエッチングする方法であって、前記方法は、
HF水溶液内で第1のウエットエッチング速度を有する第1の誘電体層を堆積することと、
第2の誘電体層を堆積することであって、前記第2の誘電体層は前記堆積後に初めは流動性を有し、前記第2の誘電体層は、HF水溶液内で、前記第1のウエットエッチング速度より速い第2のウエットエッチング速度を有する、堆積することと、
フッ素含有ガス及びアンモニアを含むエッチャントガス混合物で前記第1の誘電体層及び前記第2の誘電体層をエッチングすることであって、前記第1の誘電体層及び前記第2の誘電体層は、HF水溶液内の前記第1のウエットエッチング速度に対する前記第2のウエットエッチング速度の比より1に近い前記エッチャントガス混合物とのエッチング速度比を有する、エッチングすることと
を含む、半導体基板の表面に誘電体層を堆積し、前記半導体基板の表面から前記誘電体層をエッチングする方法。 - 前記エッチャントガス混合物は、プラズマ排出物を含むドライエッチャントガス混合物である、請求項1に記載の方法。
- 前記第1の誘電体層及び前記第2の誘電体層の少なくとも一方は酸化物を含む、請求項1に記載の方法。
- 前記第1の誘電体層は熱堆積プロセス又は高密度プラズマ堆積プロセスのいずれかによって堆積される、請求項1に記載の方法。
- 前記第1の誘電体層は高密度プラズマ堆積プロセスによって堆積される、請求項4に記載の方法。
- 前記第2の誘電体層はスピン−オン−ガラス又は流動性CVDのいずれかによって堆積される、請求項1に記載の方法。
- 前記第2の誘電体層は流動性CVDによって堆積される、請求項6に記載の方法。
- 前記第2の誘電体層を堆積した後に前記第2の誘電体層を硬化させることを更に含む、請求項1に記載の方法。
- 前記第2の誘電体層は約400℃以下の温度で堆積され、硬化され、エッチングされる、請求項8に記載の方法。
- 前記エッチャントガス混合物との前記エッチング速度比は約1.1未満である、請求項1に記載の方法。
- 置換金属ゲート半導体プロセスにおいて半導体基板の表面上の誘電体材料を除去する方法であって、前記方法は、
前記基板上に第1の誘電体材料を堆積して、HF水溶液内で第1のウエットエッチング速度を有する第1の品質の誘電体層を作製することと、
第2の誘電体材料を堆積することであって、前記第2の誘電体は前記堆積後に初めは流動性を有する、堆積することと、
前記第2の誘電体材料を硬化させ、HF水溶液内で、前記第1のウエットエッチング速度より速い第2のウエットエッチング速度を有する第2の品質の第2の誘電体層を作製することと、
ドライエッチャントガス混合物で前記第1の誘電体層及び前記第2の誘電体層をエッチングすることであって、前記第1の誘電体層及び前記第2の誘電体は、HF水溶液内での前記第1のウエットエッチング速度に対する前記第2のウエットエッチング速度の比よりも1に近い前記ドライエッチャントガス混合物とのエッチング速度比を有する、エッチングすることと
を含む、置換金属ゲート半導体プロセスにおいて半導体基板の表面上の誘電体材料を除去する方法。 - 前記ドライエッチャントガス混合物はフッ素含有ガス及びアンモニアからなるプラズマ排出物を含む、請求項11に記載の方法。
- 前記フッ素含有ガスは三フッ化窒素である、請求項12に記載の方法。
- 前記第2の誘電体層は約400℃以下の温度で堆積され、硬化され、エッチングされる、請求項11に記載の方法。
- 前記第1の誘電体層の前記ドライエッチャントガスとの前記エッチング速度に対する前記第2の誘電体層の前記ドライエッチャントガスとの前記エッチング速度の比が約1.1未満であるように、前記ドライエッチャントガスは、エッチングされる前記誘電体層の前記品質に対して実質的に反応しない、請求項11に記載の方法。
- 前記第1の誘電体層は熱堆積プロセス又は高密度プラズマ堆積プロセスのいずれかによって堆積される、請求項11に記載の方法。
- 前記第1の誘電体層は高密度プラズマ堆積プロセスによって堆積される、請求項11に記載の方法。
- 前記第2の誘電体層はスピン−オン−ガラス又は流動性CVDのいずれかによって堆積される、請求項11に記載の方法。
- 前記第2の誘電体層は流動性CVDによって堆積される、請求項11に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161539270P | 2011-09-26 | 2011-09-26 | |
US61/539,270 | 2011-09-26 | ||
US13/624,693 US20130260564A1 (en) | 2011-09-26 | 2012-09-21 | Insensitive dry removal process for semiconductor integration |
US13/624,693 | 2012-09-21 | ||
PCT/US2012/057358 WO2013049223A2 (en) | 2011-09-26 | 2012-09-26 | Insensitive dry removal process for semiconductor integration |
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JP2014527315A true JP2014527315A (ja) | 2014-10-09 |
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Country Status (6)
Country | Link |
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US (1) | US20130260564A1 (ja) |
JP (1) | JP2014527315A (ja) |
KR (1) | KR20140070630A (ja) |
CN (1) | CN103843118A (ja) |
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WO2013049223A3 (en) | 2013-05-23 |
TWI541898B (zh) | 2016-07-11 |
TW201330101A (zh) | 2013-07-16 |
KR20140070630A (ko) | 2014-06-10 |
WO2013049223A2 (en) | 2013-04-04 |
CN103843118A (zh) | 2014-06-04 |
US20130260564A1 (en) | 2013-10-03 |
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