JP2014524974A5 - - Google Patents

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Publication number
JP2014524974A5
JP2014524974A5 JP2014515996A JP2014515996A JP2014524974A5 JP 2014524974 A5 JP2014524974 A5 JP 2014524974A5 JP 2014515996 A JP2014515996 A JP 2014515996A JP 2014515996 A JP2014515996 A JP 2014515996A JP 2014524974 A5 JP2014524974 A5 JP 2014524974A5
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JP
Japan
Prior art keywords
dielectric material
layer
depositing
substrate
inducing
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JP2014515996A
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English (en)
Japanese (ja)
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JP2014524974A (ja
JP6076969B2 (ja
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Priority claimed from PCT/US2012/042487 external-priority patent/WO2012174260A2/en
Publication of JP2014524974A publication Critical patent/JP2014524974A/ja
Publication of JP2014524974A5 publication Critical patent/JP2014524974A5/ja
Application granted granted Critical
Publication of JP6076969B2 publication Critical patent/JP6076969B2/ja
Expired - Fee Related legal-status Critical Current
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JP2014515996A 2011-06-17 2012-06-14 ピンホールフリー誘電体薄膜製造 Expired - Fee Related JP6076969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161498480P 2011-06-17 2011-06-17
US61/498,480 2011-06-17
PCT/US2012/042487 WO2012174260A2 (en) 2011-06-17 2012-06-14 Pinhole-free dielectric thin film fabrication

Publications (3)

Publication Number Publication Date
JP2014524974A JP2014524974A (ja) 2014-09-25
JP2014524974A5 true JP2014524974A5 (enExample) 2015-08-06
JP6076969B2 JP6076969B2 (ja) 2017-02-08

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Family Applications (1)

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JP2014515996A Expired - Fee Related JP6076969B2 (ja) 2011-06-17 2012-06-14 ピンホールフリー誘電体薄膜製造

Country Status (5)

Country Link
US (1) US9593405B2 (enExample)
JP (1) JP6076969B2 (enExample)
KR (1) KR101942961B1 (enExample)
CN (2) CN106947948A (enExample)
WO (1) WO2012174260A2 (enExample)

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US9746678B2 (en) * 2014-04-11 2017-08-29 Applied Materials Light wave separation lattices and methods of forming light wave separation lattices
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