JP2014523030A - タッチパネル及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000007772 electrode material Substances 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 4
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- 238000000034 method Methods 0.000 claims description 28
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- 238000000576 coating method Methods 0.000 claims description 9
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- 239000011247 coating layer Substances 0.000 claims description 7
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- 230000001070 adhesive effect Effects 0.000 claims description 6
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- 230000008569 process Effects 0.000 claims description 5
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- 238000007740 vapor deposition Methods 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
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- 238000005530 etching Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
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- 150000004706 metal oxides Chemical class 0.000 description 2
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Classifications
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- General Engineering & Computer Science (AREA)
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
本発明に従うタッチパネルの製造方法は、基板及び透明電極用基材を準備するステップ、前記透明電極用基材に透明電極を形成するステップ、前記透明電極用基材に配線電極物質を蒸着するステップ、及び前記透明電極用基材に反射防止層を形成するステップを含む。
【選択図】図3
Description
Claims (19)
- 基板と、
前記基板のある一面に位置し、透明電極が位置する透明電極用基材と、
前記透明電極用基材のある一面に位置し、一方向に延びる第1透明電極と、前記透明電極用基材のある一面に位置し、前記第1透明電極と交差する方向に延びる第2透明電極と、
前記透明電極と電気的に連結される配線電極を含むことを特徴とするタッチパネル。 - 前記第1透明電極及び前記第2透明電極が前記透明電極用基材の同一の面に位置し、前記第1透明電極及び前記第2透明電極の間に絶縁層が位置する、請求項1に記載のタッチパネル。
- 前記透明電極用基材はハードコーティング層を含み、
前記ハードコーティング層及び前記絶縁層がインデックスマッチングされる、請求項2に記載のタッチパネル。 - 前記第1透明電極及び前記第2透明電極は、前記透明電極用基材の互いに反対になる面に位置する、請求項1に記載のタッチパネル。
- 前記透明電極用基材はポリエチレンテレフタレート(poly(ethylene terephthalate):PET)フィルムを含む、請求項1に記載のタッチパネル。
- 前記透明電極用基材のある一面に位置する反射防止層をさらに含む、請求項1に記載のタッチパネル。
- 前記基板及び前記透明電極用基材の間に光学用透明接着剤(optically clear adhesive:OCA)が含まれる、請求項1に記載のタッチパネル。
- 前記基板の少なくともある一面は曲面を含む、請求項1に記載のタッチパネル。
- 基板及び透明電極用基材を準備するステップと、
前記透明電極用基材に透明電極を形成するステップと、
前記透明電極用基材に配線電極物質を形成するステップと、を含み、
前記透明電極を形成するステップは、一方向に延びる第1透明電極及び前記第1透明電極と交差する方向に延びる第2透明電極を形成するステップを含むことを特徴とするタッチパネルの製造方法。 - 前記透明電極用基材に反射防止層を形成するステップをさらに含む、請求項9に記載のタッチパネルの製造方法。
- 前記透明電極を形成するステップは、前記第1透明電極及び前記第2透明電極が前記透明電極用基材の同一の面に形成され、前記第1透明電極及び前記第2透明電極の間に絶縁層を形成するステップをさらに含む、請求項10に記載のタッチパネルの製造方法。
- 前記絶縁層を形成するステップは絶縁物質をコーティングするステップを含み、前記絶縁物質が有機物を含む、請求項11に記載のタッチパネルの製造方法。
- 前記絶縁層を形成するステップは絶縁物質を蒸着するステップを含み、前記絶縁物質が無機物を含む、請求項11に記載のタッチパネルの製造方法。
- 前記透明電極用基材にハードコーティングするステップをさらに含み、
前記ハードコーティングにより形成されたハードコーティング層及び前記絶縁層がインデックスマッチングされるようにする、請求項11に記載のタッチパネルの製造方法。 - 前記配線電極物質を形成するステップでは、前記配線電極物質が蒸着により形成され、前記配線電極物質をエッチングして配線電極を形成する、請求項9に記載のタッチパネルの製造方法。
- 前記配線電極の線幅は10μmから100μmである、請求項15に記載のタッチパネルの製造方法。
- 前記反射防止層を形成するステップは、反射防止物質をコーティングするステップを含む、請求項9に記載のタッチパネルの製造方法。
- 前記反射防止層を形成するステップは反射防止フィルムを形成するステップを含む、請求項9に記載のタッチパネルの製造方法。
- 前記配線電極物質を形成するステップでは、前記配線電極物質が印刷工程により形成される、請求項9に記載のタッチパネルの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020110064111A KR101294569B1 (ko) | 2011-06-29 | 2011-06-29 | 터치 패널 및 이의 제조 방법 |
KR10-2011-0064111 | 2011-06-29 | ||
PCT/KR2012/005200 WO2013002609A2 (en) | 2011-06-29 | 2012-06-29 | Touch panel and method for manufacturing the same |
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JP2014523030A true JP2014523030A (ja) | 2014-09-08 |
JP6185462B2 JP6185462B2 (ja) | 2017-08-23 |
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US (5) | US9433089B2 (ja) |
EP (1) | EP2726964B1 (ja) |
JP (1) | JP6185462B2 (ja) |
KR (1) | KR101294569B1 (ja) |
CN (2) | CN107885401B (ja) |
TW (1) | TWI612458B (ja) |
WO (1) | WO2013002609A2 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101294569B1 (ko) * | 2011-06-29 | 2013-08-07 | 엘지이노텍 주식회사 | 터치 패널 및 이의 제조 방법 |
CN103576950B (zh) * | 2012-07-24 | 2016-08-24 | 宸鸿科技(厦门)有限公司 | 触控面板及其制作方法 |
US9213781B1 (en) | 2012-09-19 | 2015-12-15 | Placemeter LLC | System and method for processing image data |
JP2014194749A (ja) * | 2013-02-27 | 2014-10-09 | Hosiden Corp | タッチパネル |
US10432896B2 (en) | 2014-05-30 | 2019-10-01 | Placemeter Inc. | System and method for activity monitoring using video data |
JP6639098B2 (ja) * | 2015-03-20 | 2020-02-05 | 富士フイルム株式会社 | タッチパネル部材、タッチパネル及びタッチパネル表示装置 |
US10043078B2 (en) | 2015-04-21 | 2018-08-07 | Placemeter LLC | Virtual turnstile system and method |
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KR20130002885A (ko) | 2013-01-08 |
US9933890B2 (en) | 2018-04-03 |
US20160334927A1 (en) | 2016-11-17 |
KR101294569B1 (ko) | 2013-08-07 |
CN107885401A (zh) | 2018-04-06 |
US20140333850A1 (en) | 2014-11-13 |
WO2013002609A3 (en) | 2013-04-11 |
TWI612458B (zh) | 2018-01-21 |
US10592043B2 (en) | 2020-03-17 |
WO2013002609A2 (en) | 2013-01-03 |
EP2726964A2 (en) | 2014-05-07 |
US20180348952A1 (en) | 2018-12-06 |
CN107885401B (zh) | 2020-12-22 |
US10088948B2 (en) | 2018-10-02 |
US9433089B2 (en) | 2016-08-30 |
EP2726964B1 (en) | 2020-02-19 |
US20190250761A1 (en) | 2019-08-15 |
US20180046315A1 (en) | 2018-02-15 |
JP6185462B2 (ja) | 2017-08-23 |
CN103765359A (zh) | 2014-04-30 |
US10310666B2 (en) | 2019-06-04 |
TW201305890A (zh) | 2013-02-01 |
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