JP2014518010A5 - - Google Patents
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- Publication number
- JP2014518010A5 JP2014518010A5 JP2014508753A JP2014508753A JP2014518010A5 JP 2014518010 A5 JP2014518010 A5 JP 2014518010A5 JP 2014508753 A JP2014508753 A JP 2014508753A JP 2014508753 A JP2014508753 A JP 2014508753A JP 2014518010 A5 JP2014518010 A5 JP 2014518010A5
- Authority
- JP
- Japan
- Prior art keywords
- lithium
- donor substrate
- substrate
- reinforcement
- atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 11
- 229910052744 lithium Inorganic materials 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 13
- 230000002787 reinforcement Effects 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 238000002513 implantation Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- -1 Hydrogen ions Chemical class 0.000 claims 1
- 238000000137 annealing Methods 0.000 claims 1
- 230000032798 delamination Effects 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000005468 ion implantation Methods 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1153737 | 2011-05-02 | ||
| FR1153737A FR2974944B1 (fr) | 2011-05-02 | 2011-05-02 | Procédé de formation d'une fracture dans un matériau |
| PCT/EP2012/057713 WO2012150184A1 (fr) | 2011-05-02 | 2012-04-27 | Procede de formation d'une fracture dans un materiau |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014518010A JP2014518010A (ja) | 2014-07-24 |
| JP2014518010A5 true JP2014518010A5 (enExample) | 2016-05-26 |
| JP6019106B2 JP6019106B2 (ja) | 2016-11-02 |
Family
ID=44262789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014508753A Active JP6019106B2 (ja) | 2011-05-02 | 2012-04-27 | 材料中にクラックを形成するための方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9105688B2 (enExample) |
| EP (1) | EP2705529B1 (enExample) |
| JP (1) | JP6019106B2 (enExample) |
| KR (1) | KR101913174B1 (enExample) |
| CN (1) | CN103534800B (enExample) |
| FR (1) | FR2974944B1 (enExample) |
| SG (1) | SG194748A1 (enExample) |
| WO (1) | WO2012150184A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102212296B1 (ko) * | 2014-01-23 | 2021-02-04 | 글로벌웨이퍼스 씨오., 엘티디. | 고 비저항 soi 웨이퍼 및 그 제조 방법 |
| TW201603193A (zh) * | 2014-06-19 | 2016-01-16 | Gtat公司 | 增強用於離子佈植的施體基板的發射性 |
| FR3043248B1 (fr) * | 2015-10-30 | 2017-12-15 | Commissariat Energie Atomique | Procede d'elimination de defauts dans un film semiconducteur comprenant la formation d'une couche de piegeage d'hydrogene |
| JP6632462B2 (ja) * | 2016-04-28 | 2020-01-22 | 信越化学工業株式会社 | 複合ウェーハの製造方法 |
| FR3079658B1 (fr) * | 2018-03-28 | 2021-12-17 | Soitec Silicon On Insulator | Procede de detection de la fracture d'un substrat fragilise par implantation d'especes atomiques |
| FR3091000B1 (fr) * | 2018-12-24 | 2020-12-04 | Soitec Silicon On Insulator | Procede de fabrication d’un substrat pour un capteur d’image de type face avant |
| FR3091620B1 (fr) * | 2019-01-07 | 2021-01-29 | Commissariat Energie Atomique | Procédé de transfert de couche avec réduction localisée d’une capacité à initier une fracture |
| FR3091619B1 (fr) | 2019-01-07 | 2021-01-29 | Commissariat Energie Atomique | Procédé de guérison avant transfert d’une couche semi-conductrice |
| FR3094573B1 (fr) * | 2019-03-29 | 2021-08-13 | Soitec Silicon On Insulator | Procede de preparation d’une couche mince de materiau ferroelectrique |
| CN110341291B (zh) * | 2019-08-16 | 2021-04-06 | 江阴市合助机械科技有限公司 | 一种复合板材自动剥离方法 |
| CN113311309B (zh) * | 2021-07-30 | 2021-10-12 | 度亘激光技术（苏州）有限公司 | 半导体结构的覆盖层剥除方法及半导体结构失效分析方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE504916C2 (sv) | 1995-01-18 | 1997-05-26 | Ericsson Telefon Ab L M | Förfarande för att åstadkomma en ohmsk kontakt jämte halvledarkomponent försedd med dylik ohmsk kontakt |
| US6544862B1 (en) * | 2000-01-14 | 2003-04-08 | Silicon Genesis Corporation | Particle distribution method and resulting structure for a layer transfer process |
| FR2847076B1 (fr) * | 2002-11-07 | 2005-02-18 | Soitec Silicon On Insulator | Procede de detachement d'une couche mince a temperature moderee apres co-implantation |
| US20050181210A1 (en) * | 2004-02-13 | 2005-08-18 | Doering Patrick J. | Diamond structure separation |
| US7456080B2 (en) * | 2005-12-19 | 2008-11-25 | Corning Incorporated | Semiconductor on glass insulator made using improved ion implantation process |
| FR2899378B1 (fr) * | 2006-03-29 | 2008-06-27 | Commissariat Energie Atomique | Procede de detachement d'un film mince par fusion de precipites |
-
2011
- 2011-05-02 FR FR1153737A patent/FR2974944B1/fr not_active Expired - Fee Related
-
2012
- 2012-04-27 WO PCT/EP2012/057713 patent/WO2012150184A1/fr not_active Ceased
- 2012-04-27 CN CN201280021785.XA patent/CN103534800B/zh active Active
- 2012-04-27 EP EP12723839.2A patent/EP2705529B1/fr active Active
- 2012-04-27 JP JP2014508753A patent/JP6019106B2/ja active Active
- 2012-04-27 KR KR1020137031564A patent/KR101913174B1/ko active Active
- 2012-04-27 US US14/114,998 patent/US9105688B2/en active Active
- 2012-04-27 SG SG2013081252A patent/SG194748A1/en unknown
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