|
US3157308A
(en)
|
1961-09-05 |
1964-11-17 |
Clark Mfg Co J L |
Canister type container and method of making the same
|
|
US3159408A
(en)
|
1961-10-05 |
1964-12-01 |
Grace W R & Co |
Chuck
|
|
US4524308A
(en)
|
1984-06-01 |
1985-06-18 |
Sony Corporation |
Circuits for accomplishing electron beam convergence in color cathode ray tubes
|
|
US4951601A
(en)
|
1986-12-19 |
1990-08-28 |
Applied Materials, Inc. |
Multi-chamber integrated process system
|
|
US5536128A
(en)
|
1988-10-21 |
1996-07-16 |
Hitachi, Ltd. |
Method and apparatus for carrying a variety of products
|
|
JPH05136247A
(ja)
*
|
1991-11-13 |
1993-06-01 |
Fuji Electric Co Ltd |
半導体ウエハ処理装置
|
|
WO1994025880A1
(en)
|
1993-04-30 |
1994-11-10 |
Board Of Regents, The University Of Texas System |
Megavoltage scanning imager and method for its use
|
|
JPH0729787A
(ja)
|
1993-07-15 |
1995-01-31 |
Toshiba Mach Co Ltd |
恒温部材の温度保持装置
|
|
DE634699T1
(de)
*
|
1993-07-16 |
1996-02-15 |
Semiconductor Systems Inc |
Gruppiertes fotolithografisches System.
|
|
DE4446489C1
(de)
|
1994-12-23 |
1996-05-15 |
Fraunhofer Ges Forschung |
Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens
|
|
EP0766405A1
(en)
|
1995-09-29 |
1997-04-02 |
STMicroelectronics S.r.l. |
Successive approximation register without redundancy
|
|
JP3892494B2
(ja)
*
|
1996-01-26 |
2007-03-14 |
東京エレクトロン株式会社 |
基板搬送装置
|
|
JP3579228B2
(ja)
*
|
1997-01-24 |
2004-10-20 |
大日本スクリーン製造株式会社 |
基板処理装置
|
|
US5944476A
(en)
*
|
1997-03-26 |
1999-08-31 |
Kensington Laboratories, Inc. |
Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
|
|
JP4048387B2
(ja)
*
|
1997-09-10 |
2008-02-20 |
東京エレクトロン株式会社 |
ロードロック機構及び処理装置
|
|
JPH11121362A
(ja)
|
1997-10-20 |
1999-04-30 |
Canon Inc |
露光装置およびデバイス製造方法
|
|
US6719516B2
(en)
*
|
1998-09-28 |
2004-04-13 |
Applied Materials, Inc. |
Single wafer load lock with internal wafer transport
|
|
JP3019260B1
(ja)
|
1999-03-26 |
2000-03-13 |
株式会社日立製作所 |
電子ビ―ム描画装置
|
|
US6364762B1
(en)
*
|
1999-09-30 |
2002-04-02 |
Lam Research Corporation |
Wafer atmospheric transport module having a controlled mini-environment
|
|
US6949143B1
(en)
|
1999-12-15 |
2005-09-27 |
Applied Materials, Inc. |
Dual substrate loadlock process equipment
|
|
JP2002009139A
(ja)
|
2000-06-20 |
2002-01-11 |
Nikon Corp |
静電チャック
|
|
KR100885082B1
(ko)
*
|
2000-09-01 |
2009-02-25 |
어사이스트 테크놀로지스, 인코포레이티드 |
버퍼링 성능을 가진 에지 그립 얼라이너
|
|
TW559855B
(en)
*
|
2000-09-06 |
2003-11-01 |
Olympus Optical Co |
Wafer transfer apparatus
|
|
KR20030032034A
(ko)
|
2000-09-15 |
2003-04-23 |
어플라이드 머티어리얼스, 인코포레이티드 |
처리 장비용 두 개의 이중 슬롯 로드록
|
|
ATE257277T1
(de)
|
2000-10-31 |
2004-01-15 |
Sez Ag |
Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
|
|
WO2003008157A2
(en)
|
2001-07-14 |
2003-01-30 |
Brooks Automation, Inc. |
Centering double side edge grip end effector with integrated mapping sensor
|
|
JP2003045947A
(ja)
*
|
2001-07-27 |
2003-02-14 |
Canon Inc |
基板処理装置及び露光装置
|
|
JP2003068600A
(ja)
|
2001-08-22 |
2003-03-07 |
Canon Inc |
露光装置、および基板チャックの冷却方法
|
|
US6786996B2
(en)
|
2001-10-16 |
2004-09-07 |
Applied Materials Inc. |
Apparatus and method for edge bead removal
|
|
US6778258B2
(en)
|
2001-10-19 |
2004-08-17 |
Asml Holding N.V. |
Wafer handling system for use in lithography patterning
|
|
CN101650528B
(zh)
*
|
2002-02-22 |
2012-09-26 |
Asml控股股份有限公司 |
使用两件式盖子保护模版的系统和方法
|
|
CN100397558C
(zh)
|
2002-08-31 |
2008-06-25 |
应用材料有限公司 |
向处理工具提供衬底的方法和设备
|
|
ATE538412T1
(de)
|
2002-10-25 |
2012-01-15 |
Mapper Lithography Ip Bv |
Lithographisches system
|
|
AU2003276779A1
(en)
|
2002-10-30 |
2004-05-25 |
Mapper Lithography Ip B.V. |
Electron beam exposure system
|
|
TWI601199B
(zh)
*
|
2002-11-15 |
2017-10-01 |
荏原製作所股份有限公司 |
基板處理裝置及基板處理方法
|
|
KR101068607B1
(ko)
*
|
2003-03-10 |
2011-09-30 |
마퍼 리쏘그라피 아이피 비.브이. |
복수 개의 빔렛 발생 장치
|
|
SG115631A1
(en)
*
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Lithographic projection assembly, load lock and method for transferring objects
|
|
TWI234692B
(en)
*
|
2003-03-11 |
2005-06-21 |
Asml Netherlands Bv |
Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
|
|
EP1457829A1
(en)
|
2003-03-11 |
2004-09-15 |
ASML Netherlands B.V. |
Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
|
|
JP2004281474A
(ja)
|
2003-03-12 |
2004-10-07 |
Seiko Epson Corp |
製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
|
|
JP3674864B2
(ja)
*
|
2003-03-25 |
2005-07-27 |
忠素 玉井 |
真空処理装置
|
|
US7010388B2
(en)
|
2003-05-22 |
2006-03-07 |
Axcelis Technologies, Inc. |
Work-piece treatment system having load lock and buffer
|
|
ATE524822T1
(de)
*
|
2003-05-28 |
2011-09-15 |
Mapper Lithography Ip Bv |
Belichtungsverfahren für strahlen aus geladenen teilchen
|
|
ATE381728T1
(de)
|
2003-07-30 |
2008-01-15 |
Mapper Lithography Ip Bv |
Modulator-schaltkreise
|
|
US7158211B2
(en)
|
2003-09-29 |
2007-01-02 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
|
WO2005113853A1
(en)
|
2004-05-14 |
2005-12-01 |
The Boc Group, Inc. |
Methods and apparatuses for transferring articles through a load lock chamber under vacuum
|
|
JP2006066690A
(ja)
|
2004-08-27 |
2006-03-09 |
Hitachi High-Technologies Corp |
電子線描画装置、電子線描画装置の温度制御方法、および回路パターン製造装置
|
|
US20070134821A1
(en)
*
|
2004-11-22 |
2007-06-14 |
Randhir Thakur |
Cluster tool for advanced front-end processing
|
|
US7706908B2
(en)
*
|
2005-02-22 |
2010-04-27 |
Oc Oerlikon Balzers Ag |
Method for positioning a wafer
|
|
TWI424260B
(zh)
|
2005-03-18 |
2014-01-21 |
尼康股份有限公司 |
A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
|
|
JP4667140B2
(ja)
|
2005-06-30 |
2011-04-06 |
キヤノン株式会社 |
露光装置およびデバイス製造方法
|
|
JP5336184B2
(ja)
*
|
2005-07-11 |
2013-11-06 |
ブルックス オートメーション インコーポレイテッド |
自動位置合わせ基板搬送装置
|
|
KR20070029032A
(ko)
*
|
2005-09-08 |
2007-03-13 |
주성엔지니어링(주) |
이동식 이송챔버와 이를 포함하는 기판처리장치
|
|
US7709815B2
(en)
|
2005-09-16 |
2010-05-04 |
Mapper Lithography Ip B.V. |
Lithography system and projection method
|
|
DE102006021647A1
(de)
|
2005-11-09 |
2007-11-15 |
Coenen, Wolfgang, Dipl.-Ing. |
Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
|
|
KR100655079B1
(ko)
|
2005-11-11 |
2006-12-08 |
삼성전자주식회사 |
트랜스퍼 챔버와 프로세스 챔버 사이의 기밀유지장치
|
|
US8325321B2
(en)
|
2006-07-28 |
2012-12-04 |
Mapper Lithography Ip B.V. |
Lithography system, method of heat dissipation and frame
|
|
JP5048352B2
(ja)
|
2007-01-31 |
2012-10-17 |
東京エレクトロン株式会社 |
基板処理方法及び基板処理装置
|
|
US8950998B2
(en)
*
|
2007-02-27 |
2015-02-10 |
Brooks Automation, Inc. |
Batch substrate handling
|
|
US20080225261A1
(en)
|
2007-03-13 |
2008-09-18 |
Noriyuki Hirayanagi |
Exposure apparatus and device manufacturing method
|
|
WO2008144668A1
(en)
|
2007-05-17 |
2008-11-27 |
Brooks Automation, Inc. |
Side opening substrate carrier and load port
|
|
US7817241B2
(en)
|
2007-07-05 |
2010-10-19 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
|
TWI450047B
(zh)
|
2007-07-13 |
2014-08-21 |
瑪波微影Ｉｐ公司 |
微影系統、夾緊方法及晶圓台
|
|
US8705010B2
(en)
*
|
2007-07-13 |
2014-04-22 |
Mapper Lithography Ip B.V. |
Lithography system, method of clamping and wafer table
|
|
US20090110532A1
(en)
*
|
2007-10-29 |
2009-04-30 |
Sokudo Co., Ltd. |
Method and apparatus for providing wafer centering on a track lithography tool
|
|
KR101570974B1
(ko)
|
2008-02-26 |
2015-11-23 |
마퍼 리쏘그라피 아이피 비.브이. |
투사 렌즈 배열체
|
|
JP5408674B2
(ja)
|
2008-02-26 |
2014-02-05 |
マッパー・リソグラフィー・アイピー・ビー．ブイ． |
投影レンズ構成体
|
|
NL1036673A1
(nl)
|
2008-04-09 |
2009-10-12 |
Asml Holding Nv |
Robot Position Calibration Tool (RPCT).
|
|
JP5268170B2
(ja)
*
|
2008-04-15 |
2013-08-21 |
マッパー・リソグラフィー・アイピー・ビー．ブイ． |
投影レンズ構成体
|
|
US8757026B2
(en)
|
2008-04-15 |
2014-06-24 |
Dynamic Micro Systems, Semiconductor Equipment Gmbh |
Clean transfer robot
|
|
WO2009141428A1
(en)
|
2008-05-23 |
2009-11-26 |
Mapper Lithography Ip B.V. |
Imaging system
|
|
WO2009147202A1
(en)
|
2008-06-04 |
2009-12-10 |
Mapper Lithography Ip B.V. |
Writing strategy
|
|
TWI479530B
(zh)
|
2008-10-01 |
2015-04-01 |
Mapper Lithography Ip Bv |
靜電透鏡結構、靜電透鏡陣列、帶電粒子的子束微影系統以及製造絕緣結構的方法
|
|
JP5548430B2
(ja)
|
2008-11-26 |
2014-07-16 |
株式会社日立国際電気 |
基板処理装置及び半導体装置の製造方法
|
|
JP5000627B2
(ja)
|
2008-11-27 |
2012-08-15 |
東京エレクトロン株式会社 |
基板処理システム
|
|
US8991330B2
(en)
*
|
2009-02-22 |
2015-03-31 |
Mapper Lithography Ip B.V. |
Substrate support structure, clamp preparation unit, and lithography system
|
|
KR101586984B1
(ko)
|
2009-02-22 |
2016-01-20 |
마퍼 리쏘그라피 아이피 비.브이. |
리소그래피 머신을 위한 준비 유닛
|
|
GB2469112A
(en)
|
2009-04-03 |
2010-10-06 |
Mapper Lithography Ip Bv |
Wafer support using controlled capillary liquid layer to hold and release wafer
|
|
JP5249098B2
(ja)
*
|
2009-03-17 |
2013-07-31 |
東京エレクトロン株式会社 |
基板処理システム及び基板処理方法
|
|
TWI738166B
(zh)
|
2013-01-22 |
2021-09-01 |
美商布魯克斯自動機械公司 |
基材運送
|
|
WO2016158421A1
(ja)
|
2015-04-03 |
2016-10-06 |
株式会社日立ハイテクノロジーズ |
光量検出装置、それを用いた免疫分析装置および荷電粒子線装置
|