CN106919006B - 光刻系统、在光刻系统内转移基板的装置及方法 - Google Patents

光刻系统、在光刻系统内转移基板的装置及方法 Download PDF

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Publication number
CN106919006B
CN106919006B CN201710164699.9A CN201710164699A CN106919006B CN 106919006 B CN106919006 B CN 106919006B CN 201710164699 A CN201710164699 A CN 201710164699A CN 106919006 B CN106919006 B CN 106919006B
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China
Prior art keywords
substrate
support structure
fingers
substrate support
transfer device
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Expired - Fee Related
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CN201710164699.9A
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English (en)
Chinese (zh)
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CN106919006A (zh
Inventor
V.S.凯珀
E.斯洛特
M.N.J.范科温克
G.德博尔
H.J.德琼
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ASML Holding NV
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ASML Netherlands BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201710164699.9A 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法 Expired - Fee Related CN106919006B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
CN201280032577.XA CN103649837B (zh) 2011-04-28 2012-05-01 在光刻系统中处理基板的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280032577.XA Division CN103649837B (zh) 2011-04-28 2012-05-01 在光刻系统中处理基板的方法

Publications (2)

Publication Number Publication Date
CN106919006A CN106919006A (zh) 2017-07-04
CN106919006B true CN106919006B (zh) 2020-03-13

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN201710164699.9A Expired - Fee Related CN106919006B (zh) 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法
CN201280032577.XA Expired - Fee Related CN103649837B (zh) 2011-04-28 2012-05-01 在光刻系统中处理基板的方法
CN201710164697.XA Pending CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201280032577.XA Expired - Fee Related CN103649837B (zh) 2011-04-28 2012-05-01 在光刻系统中处理基板的方法
CN201710164697.XA Pending CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法

Country Status (7)

Country Link
US (4) US8936994B2 (https=)
EP (1) EP2702452B1 (https=)
JP (2) JP5805851B2 (https=)
KR (4) KR20180031082A (https=)
CN (3) CN106919006B (https=)
TW (2) TWI514089B (https=)
WO (2) WO2012146789A1 (https=)

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CN106462084B (zh) 2014-05-07 2018-10-19 迈普尔平版印刷Ip有限公司 用于目标处理机械的封闭件
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
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US10153282B1 (en) * 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
CN108287454A (zh) * 2018-01-29 2018-07-17 信利（惠州）智能显示有限公司 掩膜板装载系统
CN112970089A (zh) 2018-11-06 2021-06-15 Asml荷兰有限公司 用于在带电粒子束设备中对晶片进行热调节的系统和方法
KR101977100B1 (ko) * 2018-11-15 2019-05-10 이지메카시스템(주) 렌즈 어셈블리 어닐링 시스템
US10910239B1 (en) * 2019-07-10 2021-02-02 Mikro Mesa Technology Co., Ltd. Method of transferring micro devices and device transfer system
JP2021086889A (ja) * 2019-11-27 2021-06-03 株式会社日立ハイテク 荷電粒子線装置
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Also Published As

Publication number Publication date
US20130034421A1 (en) 2013-02-07
KR20180031082A (ko) 2018-03-27
KR101614475B1 (ko) 2016-04-21
KR20160047590A (ko) 2016-05-02
JP2014513429A (ja) 2014-05-29
JP5787331B2 (ja) 2015-09-30
CN103649837B (zh) 2017-04-12
TW201250402A (en) 2012-12-16
JP2014514769A (ja) 2014-06-19
EP2702452B1 (en) 2016-08-03
JP5805851B2 (ja) 2015-11-10
WO2012146788A1 (en) 2012-11-01
KR20140025495A (ko) 2014-03-04
USRE48903E1 (en) 2022-01-25
US20130044305A1 (en) 2013-02-21
CN106919006A (zh) 2017-07-04
KR101892460B1 (ko) 2018-08-28
US8936994B2 (en) 2015-01-20
US20160004173A1 (en) 2016-01-07
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
US9176397B2 (en) 2015-11-03
TWI486723B (zh) 2015-06-01
TWI514089B (zh) 2015-12-21
CN103649837A (zh) 2014-03-19
WO2012146789A1 (en) 2012-11-01
CN106896650A (zh) 2017-06-27
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