JP5805851B2 - リソグラフィシステムにおいて基板を処理する方法 - Google Patents

リソグラフィシステムにおいて基板を処理する方法 Download PDF

Info

Publication number
JP5805851B2
JP5805851B2 JP2014506911A JP2014506911A JP5805851B2 JP 5805851 B2 JP5805851 B2 JP 5805851B2 JP 2014506911 A JP2014506911 A JP 2014506911A JP 2014506911 A JP2014506911 A JP 2014506911A JP 5805851 B2 JP5805851 B2 JP 5805851B2
Authority
JP
Japan
Prior art keywords
substrate
unit
robot
load lock
clamped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014506911A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014513429A5 (https=
JP2014513429A (ja
Inventor
クイパー、ビンセント・シルベスター
スロット、アーウィン
ファン・ケルビンック、マルセル・ニコラース・ヤコブス
デ・ボア、ギード
デ・ヨン、ヘンドリク・ヤン
Original Assignee
マッパー・リソグラフィー・アイピー・ビー．ブイ．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マッパー・リソグラフィー・アイピー・ビー．ブイ． filed Critical マッパー・リソグラフィー・アイピー・ビー．ブイ．
Publication of JP2014513429A publication Critical patent/JP2014513429A/ja
Publication of JP2014513429A5 publication Critical patent/JP2014513429A5/ja
Application granted granted Critical
Publication of JP5805851B2 publication Critical patent/JP5805851B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2014506911A 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法 Expired - Fee Related JP5805851B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2012/057955 WO2012146788A1 (en) 2011-04-28 2012-05-01 Method of processing a substrate in a lithography system

Publications (3)

Publication Number Publication Date
JP2014513429A JP2014513429A (ja) 2014-05-29
JP2014513429A5 JP2014513429A5 (https=) 2015-03-12
JP5805851B2 true JP5805851B2 (ja) 2015-11-10

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法
JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置

Country Status (7)

Country Link
US (4) US8936994B2 (https=)
EP (1) EP2702452B1 (https=)
JP (2) JP5805851B2 (https=)
KR (4) KR101614475B1 (https=)
CN (3) CN103649837B (https=)
TW (2) TWI486723B (https=)
WO (2) WO2012146788A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6158091B2 (ja) * 2010-12-14 2017-07-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
WO2015170972A1 (en) 2014-05-07 2015-11-12 Mapper Lithography Ip B.V. Enclosure for a target processing machine
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
NL2015784B1 (en) * 2015-11-13 2017-06-02 Mapper Lithography Ip Bv Load lock system and method for transferring substrates in a lithography system.
US10153282B1 (en) * 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
CN108287454A (zh) * 2018-01-29 2018-07-17 信利（惠州）智能显示有限公司 掩膜板装载系统
KR102634804B1 (ko) 2018-11-06 2024-02-08 에이에스엠엘 네델란즈 비.브이. 하전 입자 빔 장치에서 웨이퍼를 열적으로 컨디셔닝하는 시스템들 및 방법들
KR101977100B1 (ko) * 2018-11-15 2019-05-10 이지메카시스템(주) 렌즈 어셈블리 어닐링 시스템
US10910239B1 (en) * 2019-07-10 2021-02-02 Mikro Mesa Technology Co., Ltd. Method of transferring micro devices and device transfer system
JP2021086889A (ja) * 2019-11-27 2021-06-03 株式会社日立ハイテク 荷電粒子線装置
US20250266285A1 (en) * 2024-02-15 2025-08-21 Tel Manufacturing And Engineering Of America, Inc. Multi-wafer handling system
CN119742259B (zh) * 2025-03-05 2025-05-23 常州科瑞尔科技有限公司 集成式dsc芯片输送治具及其工作方法

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH05136247A (ja) * 1991-11-13 1993-06-01 Fuji Electric Co Ltd 半導体ウエハ処理装置
AU6449994A (en) 1993-04-30 1994-11-21 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
JPH0729787A (ja) 1993-07-15 1995-01-31 Toshiba Mach Co Ltd 恒温部材の温度保持装置
EP0634699A1 (en) * 1993-07-16 1995-01-18 Semiconductor Systems, Inc. Clustered photolithography system
DE4446489C1 (de) 1994-12-23 1996-05-15 Fraunhofer Ges Forschung Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JP3892494B2 (ja) * 1996-01-26 2007-03-14 東京エレクトロン株式会社 基板搬送装置
JP3579228B2 (ja) * 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
US5944476A (en) * 1997-03-26 1999-08-31 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
JP4048387B2 (ja) * 1997-09-10 2008-02-20 東京エレクトロン株式会社 ロードロック機構及び処理装置
JPH11121362A (ja) 1997-10-20 1999-04-30 Canon Inc 露光装置およびデバイス製造方法
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP3019260B1 (ja) 1999-03-26 2000-03-13 株式会社日立製作所 電子ビ―ム描画装置
US6364762B1 (en) 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP2002009139A (ja) 2000-06-20 2002-01-11 Nikon Corp 静電チャック
JP5259907B2 (ja) * 2000-09-01 2013-08-07 クロッシング オートメーション インコーポレイテッド 加工ツール、加工物を位置合わせする方法、及び加工物を次々に加工する方法
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
EP1319243A2 (en) 2000-09-15 2003-06-18 Applied Materials, Inc. Double dual slot load lock for process equipment
EP1372186B1 (de) 2000-10-31 2008-12-10 Sez Ag Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen
WO2003008157A2 (en) 2001-07-14 2003-01-30 Brooks Automation, Inc. Centering double side edge grip end effector with integrated mapping sensor
JP2003045947A (ja) 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
US6786996B2 (en) 2001-10-16 2004-09-07 Applied Materials Inc. Apparatus and method for edge bead removal
US6778258B2 (en) 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
CN101105637B (zh) * 2002-02-22 2011-02-02 Asml控股股份有限公司 使用两件式盖子保护模版的系统和方法
KR101058597B1 (ko) 2002-08-31 2011-08-22 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 툴에 기판을 공급하는 방법 및 장치
EP2302457B1 (en) 2002-10-25 2016-03-30 Mapper Lithography Ip B.V. Lithography system
CN101414534B (zh) 2002-10-30 2012-10-03 迈普尔平版印刷Ip有限公司 电子束曝光系统
KR101087633B1 (ko) * 2002-11-15 2011-11-30 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치 및 기판처리방법
KR101068607B1 (ko) 2003-03-10 2011-09-30 마퍼 리쏘그라피 아이피 비.브이. 복수 개의 빔렛 발생 장치
EP1457829A1 (en) 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
TWI234692B (en) * 2003-03-11 2005-06-21 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
JP2004281474A (ja) 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
US7010388B2 (en) 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
ATE524822T1 (de) 2003-05-28 2011-09-15 Mapper Lithography Ip Bv Belichtungsverfahren für strahlen aus geladenen teilchen
DE602004010824T2 (de) 2003-07-30 2008-12-24 Mapper Lithography Ip B.V. Modulator-schaltkreise
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007537606A (ja) 2004-05-14 2007-12-20 ザ・ビーオーシー・グループ・インコーポレーテッド 低圧環境で物品を処理するための装置及び方法
JP2006066690A (ja) 2004-08-27 2006-03-09 Hitachi High-Technologies Corp 電子線描画装置、電子線描画装置の温度制御方法、および回路パターン製造装置
US20070134821A1 (en) * 2004-11-22 2007-06-14 Randhir Thakur Cluster tool for advanced front-end processing
EP1856730B1 (de) * 2005-02-22 2010-12-29 OC Oerlikon Balzers AG Verfahren zur positionierung eines wafers
TWI424260B (zh) 2005-03-18 2014-01-21 尼康股份有限公司 A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
JP4667140B2 (ja) 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
WO2007008941A2 (en) 2005-07-11 2007-01-18 Brooks Automation, Inc. Substrate transport apparatus with automated alignment
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
KR100655079B1 (ko) 2005-11-11 2006-12-08 삼성전자주식회사 트랜스퍼 챔버와 프로세스 챔버 사이의 기밀유지장치
US8325321B2 (en) 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5048352B2 (ja) 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US20080225261A1 (en) 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
WO2008144668A1 (en) 2007-05-17 2008-11-27 Brooks Automation, Inc. Side opening substrate carrier and load port
US7817241B2 (en) 2007-07-05 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI450047B (zh) 2007-07-13 2014-08-21 瑪波微影Ｉｐ公司 微影系統、夾緊方法及晶圓台
US20090110532A1 (en) * 2007-10-29 2009-04-30 Sokudo Co., Ltd. Method and apparatus for providing wafer centering on a track lithography tool
JP5408674B2 (ja) 2008-02-26 2014-02-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． 投影レンズ構成体
KR101570974B1 (ko) * 2008-02-26 2015-11-23 마퍼 리쏘그라피 아이피 비.브이. 투사 렌즈 배열체
NL1036673A1 (nl) 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
WO2009127659A2 (en) * 2008-04-15 2009-10-22 Mapper Lithography Ip B.V. Beamlet blanker arrangement
CN102105960B (zh) 2008-05-23 2014-01-29 迈普尔平版印刷Ip有限公司 成像系统
EP2297766B1 (en) 2008-06-04 2016-09-07 Mapper Lithography IP B.V. Writing strategy
KR101649106B1 (ko) 2008-10-01 2016-08-19 마퍼 리쏘그라피 아이피 비.브이. 정전기 렌즈 구조
JP5548430B2 (ja) * 2008-11-26 2014-07-16 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5000627B2 (ja) 2008-11-27 2012-08-15 東京エレクトロン株式会社 基板処理システム
CN102414781B (zh) * 2009-02-22 2015-07-15 迈普尔平版印刷Ip有限公司 基板支撑结构、箝制准备单元及微影系统
KR101586984B1 (ko) * 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
JP5249098B2 (ja) * 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
WO2014116681A2 (en) 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
CN107407595B (zh) 2015-04-03 2018-09-07 株式会社日立高新技术 光量检测装置、利用其的免疫分析装置及电荷粒子束装置

Also Published As

Publication number Publication date
KR20180031082A (ko) 2018-03-27
CN106919006B (zh) 2020-03-13
KR101614475B1 (ko) 2016-04-21
WO2012146788A1 (en) 2012-11-01
TWI486723B (zh) 2015-06-01
JP2014513429A (ja) 2014-05-29
US8936994B2 (en) 2015-01-20
US9575418B2 (en) 2017-02-21
KR20160047590A (ko) 2016-05-02
US20160004173A1 (en) 2016-01-07
KR101892460B1 (ko) 2018-08-28
EP2702452B1 (en) 2016-08-03
TW201250402A (en) 2012-12-16
USRE48903E1 (en) 2022-01-25
WO2012146789A1 (en) 2012-11-01
KR20140025495A (ko) 2014-03-04
CN103649837B (zh) 2017-04-12
JP2014514769A (ja) 2014-06-19
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
EP2702452A1 (en) 2014-03-05
KR20140041501A (ko) 2014-04-04
US9176397B2 (en) 2015-11-03
CN106919006A (zh) 2017-07-04
US20130034421A1 (en) 2013-02-07
TWI514089B (zh) 2015-12-21
CN103649837A (zh) 2014-03-19
CN106896650A (zh) 2017-06-27
JP5787331B2 (ja) 2015-09-30
US20130044305A1 (en) 2013-02-21

Similar Documents

Publication Publication Date Title
JP5805851B2 (ja) リソグラフィシステムにおいて基板を処理する方法
EP2681624B1 (en) Lithography system and method of processing substrates in such a lithography system
CN100550285C (zh) 用于离子束注入器的工件转移系统
TW201324592A (zh) 高產量離子植入機
CN112687598A (zh) 基板传送设备和基板处理设备
KR102108312B1 (ko) 기판 처리 장치 및 방법
JP2026061081A (ja) 基板搬送モジュール及び基板搬送モジュールの運用方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150119

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150119

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150119

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150224

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150525

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150804

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150902

R150 Certificate of patent or registration of utility model

Ref document number: 5805851

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees