JP2014509668A5 - - Google Patents
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- Publication number
- JP2014509668A5 JP2014509668A5 JP2014501389A JP2014501389A JP2014509668A5 JP 2014509668 A5 JP2014509668 A5 JP 2014509668A5 JP 2014501389 A JP2014501389 A JP 2014501389A JP 2014501389 A JP2014501389 A JP 2014501389A JP 2014509668 A5 JP2014509668 A5 JP 2014509668A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- siloxane resin
- composition according
- sio
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 150000004820 halides Chemical class 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 6
- 229910052697 platinum Inorganic materials 0.000 claims 4
- 239000002131 composite material Substances 0.000 claims 2
- 229920002554 vinyl polymer Polymers 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- LDKSTCHEYCNPDS-UHFFFAOYSA-L carbon monoxide;dichloroplatinum Chemical compound O=C=[Pt](Cl)(Cl)=C=O LDKSTCHEYCNPDS-UHFFFAOYSA-L 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2011/072199 WO2012129766A1 (en) | 2011-03-28 | 2011-03-28 | Curable silicone resins for led encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014509668A JP2014509668A (ja) | 2014-04-21 |
| JP2014509668A5 true JP2014509668A5 (enExample) | 2014-05-29 |
Family
ID=46929312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014501389A Pending JP2014509668A (ja) | 2011-03-28 | 2011-03-28 | Ｌｅｄ封入用硬化性シリコーン樹脂 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8668991B2 (enExample) |
| EP (1) | EP2691471A4 (enExample) |
| JP (1) | JP2014509668A (enExample) |
| KR (1) | KR20140038950A (enExample) |
| CN (1) | CN103619958B (enExample) |
| TW (1) | TWI534181B (enExample) |
| WO (1) | WO2012129766A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102924927B (zh) * | 2012-11-22 | 2014-03-12 | 深圳市森日有机硅材料有限公司 | 全透明液体硅橡胶组合物及其制备方法 |
| CN103013131A (zh) * | 2012-12-30 | 2013-04-03 | 江苏天辰硅材料有限公司 | 高温加成型硫化硅橡胶 |
| CN106661331B (zh) * | 2014-03-06 | 2020-10-23 | 汉高股份有限及两合公司 | 单晶氧化铝填充的管芯粘结膏 |
| WO2016101129A1 (en) * | 2014-12-23 | 2016-06-30 | Henkel (China) Company Limited | 1k high temperature debondable adhesive |
| CN110832033A (zh) | 2017-07-21 | 2020-02-21 | 美国陶氏有机硅公司 | 可固化有机聚硅氧烷组合物及其固化产物 |
| CN108912334A (zh) * | 2018-06-07 | 2018-11-30 | 福建农林大学 | 一种含乙烯基的疏水有机硅纳米粒子的制备方法 |
| CN111936582B (zh) * | 2018-08-17 | 2022-06-17 | 瓦克化学股份公司 | 可交联的有机硅氧烷组合物 |
| CN116515300B (zh) * | 2023-05-06 | 2023-12-08 | 上海艾康特医疗科技有限公司 | 高透氧硬性接触镜材料及接触镜 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5656710A (en) * | 1995-06-07 | 1997-08-12 | Loctite Corporation | Low viscosity silicone sealant |
| US5629399A (en) * | 1996-03-05 | 1997-05-13 | Dow Corning Corporation | Fast curing organosiloxane compositions with long working times |
| JP2000235103A (ja) * | 1999-02-16 | 2000-08-29 | Konica Corp | 高屈折率を有する光学素子、光学用レンズ及び光学用硬化性樹脂組成物 |
| SE513768C2 (sv) | 1999-03-26 | 2000-11-06 | Ericsson Telefon Ab L M | Förfarande för effektiv synkronisering i ett kommunikationssystem |
| JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| JP2004359756A (ja) * | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Ｌｅｄ用封止剤組成物 |
| US7287573B2 (en) * | 2003-09-30 | 2007-10-30 | General Electric Company | Silicone binders for investment casting |
| JP5137295B2 (ja) * | 2005-02-24 | 2013-02-06 | 株式会社Ａｄｅｋａ | ケイ素含有硬化性組成物及びその硬化物 |
| KR100902852B1 (ko) * | 2006-04-24 | 2009-06-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 실리콘제 렌즈 및 렌즈 성형용 실리콘 수지 조성물 |
| JP2009173759A (ja) * | 2008-01-23 | 2009-08-06 | Kaneka Corp | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物 |
| JP5322491B2 (ja) * | 2008-05-07 | 2013-10-23 | 学校法人神奈川大学 | 含ケイ素ポリマーおよびその製造方法並びに光学材料 |
| JP2009280747A (ja) * | 2008-05-26 | 2009-12-03 | Adeka Corp | ケイ素含有硬化性組成物 |
| JP2010018719A (ja) * | 2008-07-11 | 2010-01-28 | Adeka Corp | ケイ素含有硬化性組成物 |
| JP5526823B2 (ja) * | 2009-02-24 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂で封止された光半導体装置 |
| JP5499774B2 (ja) * | 2009-03-04 | 2014-05-21 | 信越化学工業株式会社 | 光半導体封止用組成物及びそれを用いた光半導体装置 |
| JP2010202801A (ja) * | 2009-03-04 | 2010-09-16 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
-
2011
- 2011-03-28 CN CN201180069882.1A patent/CN103619958B/zh not_active Expired - Fee Related
- 2011-03-28 WO PCT/CN2011/072199 patent/WO2012129766A1/en not_active Ceased
- 2011-03-28 JP JP2014501389A patent/JP2014509668A/ja active Pending
- 2011-03-28 KR KR1020137025356A patent/KR20140038950A/ko not_active Ceased
- 2011-03-28 EP EP11862764.5A patent/EP2691471A4/en not_active Withdrawn
-
2012
- 2012-02-29 TW TW101106473A patent/TWI534181B/zh not_active IP Right Cessation
-
2013
- 2013-03-12 US US13/796,096 patent/US8668991B2/en not_active Expired - Fee Related
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