CN103619958B - 用于led封装的可固化的硅树脂 - Google Patents

用于led封装的可固化的硅树脂 Download PDF

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Publication number
CN103619958B
CN103619958B CN201180069882.1A CN201180069882A CN103619958B CN 103619958 B CN103619958 B CN 103619958B CN 201180069882 A CN201180069882 A CN 201180069882A CN 103619958 B CN103619958 B CN 103619958B
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CN
China
Prior art keywords
silicone resin
hydrogen
sio
resin composition
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201180069882.1A
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English (en)
Chinese (zh)
Other versions
CN103619958A (zh
Inventor
谭文娟
李志明
邢文涛
张立伟
张勇
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Henkel AG and Co KGaA
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Henkel China Co Ltd
Henkel AG and Co KGaA
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Publication of CN103619958A publication Critical patent/CN103619958A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
CN201180069882.1A 2011-03-28 2011-03-28 用于led封装的可固化的硅树脂 Expired - Fee Related CN103619958B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/072199 WO2012129766A1 (en) 2011-03-28 2011-03-28 Curable silicone resins for led encapsulation

Publications (2)

Publication Number Publication Date
CN103619958A CN103619958A (zh) 2014-03-05
CN103619958B true CN103619958B (zh) 2016-06-29

Family

ID=46929312

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180069882.1A Expired - Fee Related CN103619958B (zh) 2011-03-28 2011-03-28 用于led封装的可固化的硅树脂

Country Status (7)

Country Link
US (1) US8668991B2 (enExample)
EP (1) EP2691471A4 (enExample)
JP (1) JP2014509668A (enExample)
KR (1) KR20140038950A (enExample)
CN (1) CN103619958B (enExample)
TW (1) TWI534181B (enExample)
WO (1) WO2012129766A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102924927B (zh) * 2012-11-22 2014-03-12 深圳市森日有机硅材料有限公司 全透明液体硅橡胶组合物及其制备方法
CN103013131A (zh) * 2012-12-30 2013-04-03 江苏天辰硅材料有限公司 高温加成型硫化硅橡胶
CN106661331B (zh) * 2014-03-06 2020-10-23 汉高股份有限及两合公司 单晶氧化铝填充的管芯粘结膏
WO2016101129A1 (en) * 2014-12-23 2016-06-30 Henkel (China) Company Limited 1k high temperature debondable adhesive
JP6982106B2 (ja) * 2017-07-21 2021-12-17 ダウ シリコーンズ コーポレーション 硬化性オルガノポリシロキサン組成物及びその硬化物
CN108912334A (zh) * 2018-06-07 2018-11-30 福建农林大学 一种含乙烯基的疏水有机硅纳米粒子的制备方法
US12187854B2 (en) 2018-08-17 2025-01-07 Wacker Chemie Ag Crosslinkable organosiloxane compositions
CN116515300B (zh) * 2023-05-06 2023-12-08 上海艾康特医疗科技有限公司 高透氧硬性接触镜材料及接触镜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824221A (zh) * 2009-03-04 2010-09-08 日东电工株式会社 用于热固性硅树脂的组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656710A (en) * 1995-06-07 1997-08-12 Loctite Corporation Low viscosity silicone sealant
US5629399A (en) * 1996-03-05 1997-05-13 Dow Corning Corporation Fast curing organosiloxane compositions with long working times
JP2000235103A (ja) * 1999-02-16 2000-08-29 Konica Corp 高屈折率を有する光学素子、光学用レンズ及び光学用硬化性樹脂組成物
SE513768C2 (sv) 1999-03-26 2000-11-06 Ericsson Telefon Ab L M Förfarande för effektiv synkronisering i ett kommunikationssystem
JP2004186168A (ja) 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2004359756A (ja) 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
US7287573B2 (en) * 2003-09-30 2007-10-30 General Electric Company Silicone binders for investment casting
JP5137295B2 (ja) * 2005-02-24 2013-02-06 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物及びその硬化物
KR100902852B1 (ko) * 2006-04-24 2009-06-16 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘제 렌즈 및 렌즈 성형용 실리콘 수지 조성물
JP2009173759A (ja) * 2008-01-23 2009-08-06 Kaneka Corp 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物
JP5322491B2 (ja) * 2008-05-07 2013-10-23 学校法人神奈川大学 含ケイ素ポリマーおよびその製造方法並びに光学材料
JP2009280747A (ja) * 2008-05-26 2009-12-03 Adeka Corp ケイ素含有硬化性組成物
JP2010018719A (ja) * 2008-07-11 2010-01-28 Adeka Corp ケイ素含有硬化性組成物
JP5526823B2 (ja) * 2009-02-24 2014-06-18 信越化学工業株式会社 シリコーン樹脂で封止された光半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824221A (zh) * 2009-03-04 2010-09-08 日东电工株式会社 用于热固性硅树脂的组合物

Also Published As

Publication number Publication date
KR20140038950A (ko) 2014-03-31
CN103619958A (zh) 2014-03-05
US8668991B2 (en) 2014-03-11
EP2691471A4 (en) 2014-08-20
JP2014509668A (ja) 2014-04-21
EP2691471A1 (en) 2014-02-05
WO2012129766A1 (en) 2012-10-04
US20130190446A1 (en) 2013-07-25
TWI534181B (zh) 2016-05-21
TW201245287A (en) 2012-11-16

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Effective date of registration: 20151230

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