TWI534181B - 可固化矽氧樹脂之發光二極體封裝 - Google Patents

可固化矽氧樹脂之發光二極體封裝 Download PDF

Info

Publication number
TWI534181B
TWI534181B TW101106473A TW101106473A TWI534181B TW I534181 B TWI534181 B TW I534181B TW 101106473 A TW101106473 A TW 101106473A TW 101106473 A TW101106473 A TW 101106473A TW I534181 B TWI534181 B TW I534181B
Authority
TW
Taiwan
Prior art keywords
hydrogen
group
resin composition
resin
composition according
Prior art date
Application number
TW101106473A
Other languages
English (en)
Chinese (zh)
Other versions
TW201245287A (en
Inventor
譚文娟
李志明
邢文濤
張立偉
張勇
Original Assignee
漢高股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 漢高股份有限公司 filed Critical 漢高股份有限公司
Publication of TW201245287A publication Critical patent/TW201245287A/zh
Application granted granted Critical
Publication of TWI534181B publication Critical patent/TWI534181B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
TW101106473A 2011-03-28 2012-02-29 可固化矽氧樹脂之發光二極體封裝 TWI534181B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/072199 WO2012129766A1 (en) 2011-03-28 2011-03-28 Curable silicone resins for led encapsulation

Publications (2)

Publication Number Publication Date
TW201245287A TW201245287A (en) 2012-11-16
TWI534181B true TWI534181B (zh) 2016-05-21

Family

ID=46929312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106473A TWI534181B (zh) 2011-03-28 2012-02-29 可固化矽氧樹脂之發光二極體封裝

Country Status (7)

Country Link
US (1) US8668991B2 (enExample)
EP (1) EP2691471A4 (enExample)
JP (1) JP2014509668A (enExample)
KR (1) KR20140038950A (enExample)
CN (1) CN103619958B (enExample)
TW (1) TWI534181B (enExample)
WO (1) WO2012129766A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102924927B (zh) * 2012-11-22 2014-03-12 深圳市森日有机硅材料有限公司 全透明液体硅橡胶组合物及其制备方法
CN103013131A (zh) * 2012-12-30 2013-04-03 江苏天辰硅材料有限公司 高温加成型硫化硅橡胶
CN106661331B (zh) * 2014-03-06 2020-10-23 汉高股份有限及两合公司 单晶氧化铝填充的管芯粘结膏
WO2016101129A1 (en) * 2014-12-23 2016-06-30 Henkel (China) Company Limited 1k high temperature debondable adhesive
CN110832033A (zh) 2017-07-21 2020-02-21 美国陶氏有机硅公司 可固化有机聚硅氧烷组合物及其固化产物
CN108912334A (zh) * 2018-06-07 2018-11-30 福建农林大学 一种含乙烯基的疏水有机硅纳米粒子的制备方法
CN111936582B (zh) * 2018-08-17 2022-06-17 瓦克化学股份公司 可交联的有机硅氧烷组合物
CN116515300B (zh) * 2023-05-06 2023-12-08 上海艾康特医疗科技有限公司 高透氧硬性接触镜材料及接触镜

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656710A (en) * 1995-06-07 1997-08-12 Loctite Corporation Low viscosity silicone sealant
US5629399A (en) * 1996-03-05 1997-05-13 Dow Corning Corporation Fast curing organosiloxane compositions with long working times
JP2000235103A (ja) * 1999-02-16 2000-08-29 Konica Corp 高屈折率を有する光学素子、光学用レンズ及び光学用硬化性樹脂組成物
SE513768C2 (sv) 1999-03-26 2000-11-06 Ericsson Telefon Ab L M Förfarande för effektiv synkronisering i ett kommunikationssystem
JP2004186168A (ja) 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2004359756A (ja) * 2003-06-03 2004-12-24 Wacker Asahikasei Silicone Co Ltd Ｌｅｄ用封止剤組成物
US7287573B2 (en) * 2003-09-30 2007-10-30 General Electric Company Silicone binders for investment casting
JP5137295B2 (ja) * 2005-02-24 2013-02-06 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物及びその硬化物
KR100902852B1 (ko) * 2006-04-24 2009-06-16 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘제 렌즈 및 렌즈 성형용 실리콘 수지 조성물
JP2009173759A (ja) * 2008-01-23 2009-08-06 Kaneka Corp 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物
JP5322491B2 (ja) * 2008-05-07 2013-10-23 学校法人神奈川大学 含ケイ素ポリマーおよびその製造方法並びに光学材料
JP2009280747A (ja) * 2008-05-26 2009-12-03 Adeka Corp ケイ素含有硬化性組成物
JP2010018719A (ja) * 2008-07-11 2010-01-28 Adeka Corp ケイ素含有硬化性組成物
JP5526823B2 (ja) * 2009-02-24 2014-06-18 信越化学工業株式会社 シリコーン樹脂で封止された光半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
JP2010202801A (ja) * 2009-03-04 2010-09-16 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物

Also Published As

Publication number Publication date
WO2012129766A1 (en) 2012-10-04
EP2691471A4 (en) 2014-08-20
US20130190446A1 (en) 2013-07-25
JP2014509668A (ja) 2014-04-21
KR20140038950A (ko) 2014-03-31
US8668991B2 (en) 2014-03-11
CN103619958B (zh) 2016-06-29
CN103619958A (zh) 2014-03-05
TW201245287A (en) 2012-11-16
EP2691471A1 (en) 2014-02-05

Similar Documents

Publication Publication Date Title
TWI534181B (zh) 可固化矽氧樹脂之發光二極體封裝
JP5827834B2 (ja) シリコーン樹脂組成物、シリコーン樹脂シート、シリコーン樹脂シートの製造方法および光半導体装置
KR101520510B1 (ko) 광반도체 장치용 실리콘 수지 조성물과 광반도체 장치
TWI277635B (en) Silicone composition for encapsulating luminescent element and luminescent device
TWI421304B (zh) 經聚矽氧烷樹脂組成物包覆的半導體裝置以及用於包覆半導體裝置之聚矽氧烷樹脂錠
TWI734899B (zh) 晶粒黏著用聚矽氧樹脂組成物及硬化物
TWI351412B (en) Cured product of epoxy resin composition and metho
JP6057503B2 (ja) 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
EP2892953B1 (en) Curable silicone composition and cured product thereof
WO2007046399A1 (ja) 熱硬化性樹脂組成物及び光半導体封止材
CN102807756B (zh) 有机硅树脂组合物、薄片及其制造方法、光半导体元件装置
KR20140043744A (ko) 가교결합성 실리콘 조성물 및 그의 가교결합 생성물
KR101695316B1 (ko) 경화성 오르가노폴리실록산 조성물 및 이를 이용한 광반도체 장치
KR102769563B1 (ko) 다이 본딩용 실리콘 조성물, 그의 경화물 및 광반도체 장치
TWI644986B (zh) 硬化性樹脂組成物
KR102829126B1 (ko) 부가 경화형 실리콘 수지 조성물, 그의 경화물, 및 광반도체 장치
KR102821799B1 (ko) 부가 경화형 실리콘 수지 조성물, 그의 경화물 및 광반도체 장치
JP2021167364A (ja) ダイボンディング用シリコーン組成物、その硬化物、及び光半導体装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees