JP2014503607A5 - - Google Patents
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- Publication number
- JP2014503607A5 JP2014503607A5 JP2013537685A JP2013537685A JP2014503607A5 JP 2014503607 A5 JP2014503607 A5 JP 2014503607A5 JP 2013537685 A JP2013537685 A JP 2013537685A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2014503607 A5 JP2014503607 A5 JP 2014503607A5
- Authority
- JP
- Japan
- Prior art keywords
- glycine
- composition
- alkali metal
- metal salt
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- 239000004471 Glycine Substances 0.000 claims 2
- 229910052783 alkali metal Inorganic materials 0.000 claims 2
- -1 alkali metal salt Chemical class 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40979110P | 2010-11-03 | 2010-11-03 | |
| US61/409,791 | 2010-11-03 | ||
| PCT/US2011/056743 WO2012061010A2 (en) | 2010-11-03 | 2011-10-18 | Polymer etchant and method of using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014503607A JP2014503607A (ja) | 2014-02-13 |
| JP2014503607A5 true JP2014503607A5 (enExample) | 2014-10-23 |
Family
ID=46024998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013537685A Ceased JP2014503607A (ja) | 2010-11-03 | 2011-10-18 | ポリマーエッチング剤及びその使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9909063B2 (enExample) |
| JP (1) | JP2014503607A (enExample) |
| KR (1) | KR20130132828A (enExample) |
| CN (1) | CN103189470B (enExample) |
| TW (1) | TW201224123A (enExample) |
| WO (1) | WO2012061010A2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012061183A2 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device for thermal management and method of making |
| US9179543B2 (en) | 2010-11-03 | 2015-11-03 | 3M Innovative Properties Company | Flexible LED device with wire bond free die |
| WO2012091972A1 (en) | 2010-12-29 | 2012-07-05 | 3M Innovative Properties Company | Led color combiner |
| CN103283048B (zh) | 2010-12-29 | 2017-04-12 | 3M创新有限公司 | 远程荧光粉led的构造 |
| KR101931395B1 (ko) | 2011-02-18 | 2018-12-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 발광 반도체 디바이스 |
| US9236547B2 (en) | 2011-08-17 | 2016-01-12 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
| KR20140097404A (ko) | 2011-11-23 | 2014-08-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 3차원 구조를 갖는 가요성 발광 반도체 디바이스 |
| JP2015523722A (ja) | 2012-06-01 | 2015-08-13 | スリーエム イノベイティブ プロパティズ カンパニー | 遠隔蛍光体ledと直接放射ledの組合せを使用するハイブリッド電球 |
| KR20150054937A (ko) | 2012-09-13 | 2015-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 넓은 색상 범위를 갖는 효율적인 조명 시스템 |
| US9754869B2 (en) | 2013-01-16 | 2017-09-05 | 3M Innovative Properties Company | Light emitting semiconductor device and substrate therefore |
| US10692843B2 (en) | 2013-12-04 | 2020-06-23 | 3M Innovative Properties Company | Flexible light emitting semiconductor device with large area conduit |
| JP2017524542A (ja) | 2014-05-28 | 2017-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 可撓性基板上のmemsデバイス |
| WO2016153644A1 (en) | 2015-03-20 | 2016-09-29 | 3M Innovative Properties Company | Multilayer substrate for a light emitting semi-conductor device package |
| KR101874194B1 (ko) * | 2016-11-09 | 2018-07-03 | 경희대학교 산학협력단 | 고속 롤투롤 공정을 이용한 유연소자의 제조 방법 |
| WO2018178817A2 (en) | 2017-03-31 | 2018-10-04 | 3M Innovative Properties Company | Optical system |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3526504A (en) | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
| US3448098A (en) | 1966-09-27 | 1969-06-03 | Merck & Co Inc | Production of guanylic acid |
| US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| US3867153A (en) | 1972-09-11 | 1975-02-18 | Du Pont | Photohardenable element |
| US4340482A (en) * | 1978-02-21 | 1982-07-20 | Millipore Corporation | Process for grafting amino acid molecules onto preformed polymer surfaces and products prepared thereby |
| DE3708214A1 (de) | 1987-03-12 | 1988-09-22 | Schering Ag | Verfahren zur haftfesten metallisierung von kunststoffen |
| FR2630550A1 (fr) | 1988-04-22 | 1989-10-27 | Radiotechnique Compelec | Procede de montage d'elements optiques sur un support et circuit optique ainsi obtenu |
| US4975312A (en) | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
| JPH0415233A (ja) | 1990-05-09 | 1992-01-20 | Sumitomo Metal Mining Co Ltd | ポリイミドフィルムのエッチング方法 |
| US5289630A (en) | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
| JPH05202206A (ja) * | 1991-10-03 | 1993-08-10 | Mitsubishi Shindoh Co Ltd | ポリイミド樹脂のエッチング液およびエッチング方法 |
| JP3186834B2 (ja) | 1992-04-28 | 2001-07-11 | 住友金属鉱山株式会社 | ポリイミド樹脂溶解用エッチング液およびそれを使用したスルーホールのエッチング加工方法 |
| JP3273825B2 (ja) | 1993-04-14 | 2002-04-15 | 三井化学株式会社 | ポリイミド樹脂のエッチング方法 |
| JPH06302586A (ja) | 1993-04-14 | 1994-10-28 | Mitsui Toatsu Chem Inc | ポリイミドエッチング液及び廃液処理方法 |
| JP3535602B2 (ja) | 1995-03-23 | 2004-06-07 | 松下電器産業株式会社 | 面実装型led |
| US6218022B1 (en) | 1996-09-20 | 2001-04-17 | Toray Engineering Co., Ltd. | Resin etching solution and process for etching polyimide resins |
| JP3251515B2 (ja) * | 1996-09-20 | 2002-01-28 | 東レエンジニアリング株式会社 | 樹脂エッチング液及びエッチング方法 |
| JP2001288286A (ja) | 2000-02-01 | 2001-10-16 | Toray Ind Inc | エッチング方法 |
| JP2001310959A (ja) | 2000-02-23 | 2001-11-06 | Toray Ind Inc | 樹脂膜のウエットエッチング用エッチング液及びそれを用いて成るエッチング方法 |
| JP2002082451A (ja) | 2000-07-06 | 2002-03-22 | Toray Ind Inc | 多段階エッチング方法 |
| US6923919B2 (en) | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US6403211B1 (en) | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
| JP2002180044A (ja) | 2000-12-07 | 2002-06-26 | Toray Eng Co Ltd | 熱可塑性ポリイミド樹脂用エッチング液 |
| EP1389496A1 (en) | 2001-05-22 | 2004-02-18 | Mitsubishi Chemical Corporation | Method for cleaning surface of substrate |
| JP4326887B2 (ja) | 2003-09-08 | 2009-09-09 | 新日鐵化学株式会社 | 配線基板用積層体 |
| JP2005206903A (ja) * | 2004-01-23 | 2005-08-04 | Kanto Chem Co Inc | エッチング液組成物 |
| US20050186404A1 (en) * | 2004-02-23 | 2005-08-25 | Guoping Mao | Etched polycarbonate films |
| US7323421B2 (en) * | 2004-06-16 | 2008-01-29 | Memc Electronic Materials, Inc. | Silicon wafer etching process and composition |
| JP4339284B2 (ja) | 2004-06-17 | 2009-10-07 | 三菱製紙株式会社 | 樹脂エッチング液、樹脂エッチング方法、樹脂剥離方法、およびフレキシブルプリント配線板の製造方法 |
| EP1701218A3 (en) * | 2005-03-11 | 2008-10-15 | Rohm and Haas Electronic Materials LLC | Polymer remover |
| JP2006319074A (ja) | 2005-05-12 | 2006-11-24 | Mitsui Chemicals Inc | Led実装用基板およびその製造方法 |
| KR20080042798A (ko) | 2005-06-27 | 2008-05-15 | 라미나 라이팅, 인크. | 발광 다이오드 패키지 및 제작방법 |
| JP2007027278A (ja) | 2005-07-13 | 2007-02-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| TW200709471A (en) | 2005-08-29 | 2007-03-01 | Shane Harrah | Bendable high flux LED array |
| US20070120089A1 (en) | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| KR101347486B1 (ko) | 2006-01-31 | 2014-01-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 유연성 포일 구조를 구비한 led 조명 조립체 |
| WO2008039730A1 (en) * | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
| US8049112B2 (en) | 2007-04-13 | 2011-11-01 | 3M Innovative Properties Company | Flexible circuit with cover layer |
| FR2934916B1 (fr) | 2008-08-06 | 2013-09-20 | Laurain | Support de diodes electroluminescentes et procede de realisation d'un circuit de diodes electroluminescentes avec un tel support. |
| JP5379441B2 (ja) | 2008-10-09 | 2013-12-25 | 関東化学株式会社 | 基板処理用アルカリ性水溶液組成物 |
| JP2010251376A (ja) | 2009-04-10 | 2010-11-04 | Sumitomo Electric Printed Circuit Inc | 配線体,その製造方法および電子機器 |
| JP2012064841A (ja) | 2010-09-17 | 2012-03-29 | Citizen Holdings Co Ltd | 半導体発光装置 |
| US9179543B2 (en) | 2010-11-03 | 2015-11-03 | 3M Innovative Properties Company | Flexible LED device with wire bond free die |
| WO2012061183A2 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device for thermal management and method of making |
| KR20130143067A (ko) | 2010-11-03 | 2013-12-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 led 디바이스 및 제조 방법 |
| WO2012112666A2 (en) | 2011-02-18 | 2012-08-23 | 3M Innovate Properties Company | Light emitting semiconductor device having multi-level substrate |
| KR101931395B1 (ko) | 2011-02-18 | 2018-12-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 발광 반도체 디바이스 |
| WO2012112310A1 (en) | 2011-02-18 | 2012-08-23 | 3M Innovative Properties Company | Flexible light emitting semiconductor device having thin dielectric substrate |
| US9236547B2 (en) | 2011-08-17 | 2016-01-12 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
-
2011
- 2011-10-18 WO PCT/US2011/056743 patent/WO2012061010A2/en not_active Ceased
- 2011-10-18 JP JP2013537685A patent/JP2014503607A/ja not_active Ceased
- 2011-10-18 KR KR20137013716A patent/KR20130132828A/ko not_active Ceased
- 2011-10-18 US US13/882,068 patent/US9909063B2/en not_active Expired - Fee Related
- 2011-10-18 CN CN201180052625.7A patent/CN103189470B/zh not_active Expired - Fee Related
- 2011-11-02 TW TW100140000A patent/TW201224123A/zh unknown
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