TW201224123A - Polymer etchant and method of using same - Google Patents

Polymer etchant and method of using same Download PDF

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Publication number
TW201224123A
TW201224123A TW100140000A TW100140000A TW201224123A TW 201224123 A TW201224123 A TW 201224123A TW 100140000 A TW100140000 A TW 100140000A TW 100140000 A TW100140000 A TW 100140000A TW 201224123 A TW201224123 A TW 201224123A
Authority
TW
Taiwan
Prior art keywords
weight
glycine
metal salt
composition
aqueous solution
Prior art date
Application number
TW100140000A
Other languages
English (en)
Chinese (zh)
Inventor
Ravi Palaniswamy
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201224123A publication Critical patent/TW201224123A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H10P14/683—
    • H10P50/287—
    • H10P50/667—
    • H10P50/71—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW100140000A 2010-11-03 2011-11-02 Polymer etchant and method of using same TW201224123A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40979110P 2010-11-03 2010-11-03

Publications (1)

Publication Number Publication Date
TW201224123A true TW201224123A (en) 2012-06-16

Family

ID=46024998

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100140000A TW201224123A (en) 2010-11-03 2011-11-02 Polymer etchant and method of using same

Country Status (6)

Country Link
US (1) US9909063B2 (enExample)
JP (1) JP2014503607A (enExample)
KR (1) KR20130132828A (enExample)
CN (1) CN103189470B (enExample)
TW (1) TW201224123A (enExample)
WO (1) WO2012061010A2 (enExample)

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WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
CN103283048B (zh) 2010-12-29 2017-04-12 3M创新有限公司 远程荧光粉led的构造
US9151463B2 (en) 2010-12-29 2015-10-06 3M Innovative Properties Company LED color combiner
CN203932096U (zh) 2011-02-18 2014-11-05 3M创新有限公司 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
US9482416B2 (en) 2011-11-23 2016-11-01 3M Innovative Properties Company Flexible light emitting semiconductor device having a three dimensional structure
KR20150022918A (ko) 2012-06-01 2015-03-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 원격 인광체 led와 직접 방출 led의 조합을 사용한 하이브리드 전구
CN104662680B (zh) 2012-09-13 2017-07-14 3M创新有限公司 具有宽颜色范围的高效照明系统
CN205657081U (zh) 2013-01-16 2016-10-19 3M创新有限公司 支撑制品
WO2015084851A1 (en) 2013-12-04 2015-06-11 3M Innovative Properties Company Flexible light emitting semiconductor device with large area conduit
WO2015183534A1 (en) 2014-05-28 2015-12-03 3M Innovative Properties Company Mems devices on flexible substrate
US20180084635A1 (en) 2015-03-20 2018-03-22 3M Innovative Properties Company Multilayer substrate for a light emitting semi-conductor device package
KR101874194B1 (ko) * 2016-11-09 2018-07-03 경희대학교 산학협력단 고속 롤투롤 공정을 이용한 유연소자의 제조 방법
US11156814B2 (en) 2017-03-31 2021-10-26 3M Innovative Properties Company Optical system for displaying an object to a viewer

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WO2012112666A2 (en) 2011-02-18 2012-08-23 3M Innovate Properties Company Light emitting semiconductor device having multi-level substrate
CN203932096U (zh) 2011-02-18 2014-11-05 3M创新有限公司 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品
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US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device

Also Published As

Publication number Publication date
US9909063B2 (en) 2018-03-06
WO2012061010A2 (en) 2012-05-10
US20130207031A1 (en) 2013-08-15
KR20130132828A (ko) 2013-12-05
JP2014503607A (ja) 2014-02-13
CN103189470B (zh) 2015-05-20
WO2012061010A3 (en) 2012-07-19
CN103189470A (zh) 2013-07-03

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