JP2014503607A - ポリマーエッチング剤及びその使用方法 - Google Patents

ポリマーエッチング剤及びその使用方法 Download PDF

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Publication number
JP2014503607A
JP2014503607A JP2013537685A JP2013537685A JP2014503607A JP 2014503607 A JP2014503607 A JP 2014503607A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2014503607 A JP2014503607 A JP 2014503607A
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JP
Japan
Prior art keywords
glycine
alkali metal
etching
metal salt
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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JP2013537685A
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English (en)
Japanese (ja)
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JP2014503607A5 (enExample
Inventor
ラヴィ パラニスワミー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2014503607A publication Critical patent/JP2014503607A/ja
Publication of JP2014503607A5 publication Critical patent/JP2014503607A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2013537685A 2010-11-03 2011-10-18 ポリマーエッチング剤及びその使用方法 Ceased JP2014503607A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40979110P 2010-11-03 2010-11-03
US61/409,791 2010-11-03
PCT/US2011/056743 WO2012061010A2 (en) 2010-11-03 2011-10-18 Polymer etchant and method of using same

Publications (2)

Publication Number Publication Date
JP2014503607A true JP2014503607A (ja) 2014-02-13
JP2014503607A5 JP2014503607A5 (enExample) 2014-10-23

Family

ID=46024998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013537685A Ceased JP2014503607A (ja) 2010-11-03 2011-10-18 ポリマーエッチング剤及びその使用方法

Country Status (6)

Country Link
US (1) US9909063B2 (enExample)
JP (1) JP2014503607A (enExample)
KR (1) KR20130132828A (enExample)
CN (1) CN103189470B (enExample)
TW (1) TW201224123A (enExample)
WO (1) WO2012061010A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101874194B1 (ko) * 2016-11-09 2018-07-03 경희대학교 산학협력단 고속 롤투롤 공정을 이용한 유연소자의 제조 방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103190204B (zh) 2010-11-03 2016-11-16 3M创新有限公司 具有无引线接合管芯的柔性led器件
WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
JP6104174B2 (ja) 2010-12-29 2017-03-29 スリーエム イノベイティブ プロパティズ カンパニー リモート蛍光体ｌｅｄ構造
KR20140004695A (ko) 2010-12-29 2014-01-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 색상 조합기
WO2012112873A2 (en) 2011-02-18 2012-08-23 3M Innovative Properties Company Flexible light emitting semiconductor device
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
WO2013078180A1 (en) 2011-11-23 2013-05-30 3M Innovative Properties Company Flexible light emitting semiconductor device having a three dimensional structure
CN104541382B (zh) 2012-06-01 2017-05-17 3M创新有限公司 使用远程荧光粉led和直接发射led组合的混合灯泡
US9559272B2 (en) 2012-09-13 2017-01-31 3M Innovative Properties Company Efficient lighting system with wide color range
WO2014113045A1 (en) 2013-01-16 2014-07-24 3M Innovative Properties Company Light emitting semiconductor device and substrate therefore
WO2015084851A1 (en) 2013-12-04 2015-06-11 3M Innovative Properties Company Flexible light emitting semiconductor device with large area conduit
EP3148924A1 (en) 2014-05-28 2017-04-05 3M Innovative Properties Company Mems devices on flexible substrate
US20180084635A1 (en) 2015-03-20 2018-03-22 3M Innovative Properties Company Multilayer substrate for a light emitting semi-conductor device package
WO2018178817A2 (en) 2017-03-31 2018-10-04 3M Innovative Properties Company Optical system

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JPH05202206A (ja) * 1991-10-03 1993-08-10 Mitsubishi Shindoh Co Ltd ポリイミド樹脂のエッチング液およびエッチング方法
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JP2006253692A (ja) * 2005-03-11 2006-09-21 Rohm & Haas Electronic Materials Llc ポリマー除去剤
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
JP2010093126A (ja) * 2008-10-09 2010-04-22 Kanto Chem Co Inc 基板処理用アルカリ性水溶液組成物

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CN103190204B (zh) 2010-11-03 2016-11-16 3M创新有限公司 具有无引线接合管芯的柔性led器件
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WO2012112873A2 (en) 2011-02-18 2012-08-23 3M Innovative Properties Company Flexible light emitting semiconductor device
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JPS63297573A (ja) * 1987-03-12 1988-12-05 シエーリング・アクチエンゲゼルシヤフト プラスチツクの付着堅固なメタライジング法
JPH05202206A (ja) * 1991-10-03 1993-08-10 Mitsubishi Shindoh Co Ltd ポリイミド樹脂のエッチング液およびエッチング方法
JPH1097081A (ja) * 1996-09-20 1998-04-14 Toray Eng Co Ltd 樹脂エッチング液及びエッチング方法
JP2004504439A (ja) * 2000-07-18 2004-02-12 スリーエム　イノベイティブ　プロパティズ　カンパニー フレキシブル回路用液晶ポリマー
JP2005206903A (ja) * 2004-01-23 2005-08-04 Kanto Chem Co Inc エッチング液組成物
JP2006253692A (ja) * 2005-03-11 2006-09-21 Rohm & Haas Electronic Materials Llc ポリマー除去剤
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
JP2010093126A (ja) * 2008-10-09 2010-04-22 Kanto Chem Co Inc 基板処理用アルカリ性水溶液組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101874194B1 (ko) * 2016-11-09 2018-07-03 경희대학교 산학협력단 고속 롤투롤 공정을 이용한 유연소자의 제조 방법

Also Published As

Publication number Publication date
WO2012061010A3 (en) 2012-07-19
TW201224123A (en) 2012-06-16
CN103189470A (zh) 2013-07-03
WO2012061010A2 (en) 2012-05-10
US9909063B2 (en) 2018-03-06
CN103189470B (zh) 2015-05-20
US20130207031A1 (en) 2013-08-15
KR20130132828A (ko) 2013-12-05

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