JP2014503607A - ポリマーエッチング剤及びその使用方法 - Google Patents

ポリマーエッチング剤及びその使用方法 Download PDF

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Publication number
JP2014503607A
JP2014503607A JP2013537685A JP2013537685A JP2014503607A JP 2014503607 A JP2014503607 A JP 2014503607A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2014503607 A JP2014503607 A JP 2014503607A
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JP
Japan
Prior art keywords
glycine
alkali metal
etching
metal salt
weight
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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JP2013537685A
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English (en)
Japanese (ja)
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JP2014503607A5 (enExample
Inventor
ラヴィ パラニスワミー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2014503607A publication Critical patent/JP2014503607A/ja
Publication of JP2014503607A5 publication Critical patent/JP2014503607A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H10P14/683—
    • H10P50/287—
    • H10P50/667—
    • H10P50/71—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2013537685A 2010-11-03 2011-10-18 ポリマーエッチング剤及びその使用方法 Ceased JP2014503607A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40979110P 2010-11-03 2010-11-03
US61/409,791 2010-11-03
PCT/US2011/056743 WO2012061010A2 (en) 2010-11-03 2011-10-18 Polymer etchant and method of using same

Publications (2)

Publication Number Publication Date
JP2014503607A true JP2014503607A (ja) 2014-02-13
JP2014503607A5 JP2014503607A5 (enExample) 2014-10-23

Family

ID=46024998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013537685A Ceased JP2014503607A (ja) 2010-11-03 2011-10-18 ポリマーエッチング剤及びその使用方法

Country Status (6)

Country Link
US (1) US9909063B2 (enExample)
JP (1) JP2014503607A (enExample)
KR (1) KR20130132828A (enExample)
CN (1) CN103189470B (enExample)
TW (1) TW201224123A (enExample)
WO (1) WO2012061010A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101874194B1 (ko) * 2016-11-09 2018-07-03 경희대학교 산학협력단 고속 롤투롤 공정을 이용한 유연소자의 제조 방법

Families Citing this family (14)

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WO2012061182A1 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device with wire bond free die
WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
CN103283048B (zh) 2010-12-29 2017-04-12 3M创新有限公司 远程荧光粉led的构造
US9151463B2 (en) 2010-12-29 2015-10-06 3M Innovative Properties Company LED color combiner
CN203932096U (zh) 2011-02-18 2014-11-05 3M创新有限公司 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
US9482416B2 (en) 2011-11-23 2016-11-01 3M Innovative Properties Company Flexible light emitting semiconductor device having a three dimensional structure
KR20150022918A (ko) 2012-06-01 2015-03-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 원격 인광체 led와 직접 방출 led의 조합을 사용한 하이브리드 전구
CN104662680B (zh) 2012-09-13 2017-07-14 3M创新有限公司 具有宽颜色范围的高效照明系统
CN205657081U (zh) 2013-01-16 2016-10-19 3M创新有限公司 支撑制品
WO2015084851A1 (en) 2013-12-04 2015-06-11 3M Innovative Properties Company Flexible light emitting semiconductor device with large area conduit
WO2015183534A1 (en) 2014-05-28 2015-12-03 3M Innovative Properties Company Mems devices on flexible substrate
US20180084635A1 (en) 2015-03-20 2018-03-22 3M Innovative Properties Company Multilayer substrate for a light emitting semi-conductor device package
US11156814B2 (en) 2017-03-31 2021-10-26 3M Innovative Properties Company Optical system for displaying an object to a viewer

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JPS63297573A (ja) * 1987-03-12 1988-12-05 シエーリング・アクチエンゲゼルシヤフト プラスチツクの付着堅固なメタライジング法
JPH05202206A (ja) * 1991-10-03 1993-08-10 Mitsubishi Shindoh Co Ltd ポリイミド樹脂のエッチング液およびエッチング方法
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JP2004504439A (ja) * 2000-07-18 2004-02-12 スリーエム　イノベイティブ　プロパティズ　カンパニー フレキシブル回路用液晶ポリマー
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JP2006253692A (ja) * 2005-03-11 2006-09-21 Rohm & Haas Electronic Materials Llc ポリマー除去剤
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
JP2010093126A (ja) * 2008-10-09 2010-04-22 Kanto Chem Co Inc 基板処理用アルカリ性水溶液組成物

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JPH0415233A (ja) 1990-05-09 1992-01-20 Sumitomo Metal Mining Co Ltd ポリイミドフィルムのエッチング方法
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WO2012061182A1 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device with wire bond free die
WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
WO2012112666A2 (en) 2011-02-18 2012-08-23 3M Innovate Properties Company Light emitting semiconductor device having multi-level substrate
CN203932096U (zh) 2011-02-18 2014-11-05 3M创新有限公司 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品
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JPS63297573A (ja) * 1987-03-12 1988-12-05 シエーリング・アクチエンゲゼルシヤフト プラスチツクの付着堅固なメタライジング法
JPH05202206A (ja) * 1991-10-03 1993-08-10 Mitsubishi Shindoh Co Ltd ポリイミド樹脂のエッチング液およびエッチング方法
JPH1097081A (ja) * 1996-09-20 1998-04-14 Toray Eng Co Ltd 樹脂エッチング液及びエッチング方法
JP2004504439A (ja) * 2000-07-18 2004-02-12 スリーエム　イノベイティブ　プロパティズ　カンパニー フレキシブル回路用液晶ポリマー
JP2005206903A (ja) * 2004-01-23 2005-08-04 Kanto Chem Co Inc エッチング液組成物
JP2006253692A (ja) * 2005-03-11 2006-09-21 Rohm & Haas Electronic Materials Llc ポリマー除去剤
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
JP2010093126A (ja) * 2008-10-09 2010-04-22 Kanto Chem Co Inc 基板処理用アルカリ性水溶液組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101874194B1 (ko) * 2016-11-09 2018-07-03 경희대학교 산학협력단 고속 롤투롤 공정을 이용한 유연소자의 제조 방법

Also Published As

Publication number Publication date
US9909063B2 (en) 2018-03-06
WO2012061010A2 (en) 2012-05-10
US20130207031A1 (en) 2013-08-15
KR20130132828A (ko) 2013-12-05
TW201224123A (en) 2012-06-16
CN103189470B (zh) 2015-05-20
WO2012061010A3 (en) 2012-07-19
CN103189470A (zh) 2013-07-03

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