|
TWI547454B
(zh)
*
|
2011-05-31 |
2016-09-01 |
康寧公司 |
於玻璃中高速製造微孔洞的方法
|
|
US9938186B2
(en)
|
2012-04-13 |
2018-04-10 |
Corning Incorporated |
Strengthened glass articles having etched features and methods of forming the same
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2925482A1
(en)
*
|
2012-11-29 |
2015-10-07 |
Corning Incorporated |
Sacrificial cover layers for laser drilling substrates and methods thereof
|
|
US9346706B2
(en)
|
2012-11-29 |
2016-05-24 |
Corning Incorporated |
Methods of fabricating glass articles by laser damage and etching
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
DE112013007305A5
(de)
*
|
2013-08-07 |
2016-06-02 |
Trumpf Laser- Und Systemtechnik Gmbh |
Verfahren zum Bearbeiten eines plattenartigen Werkstückes mit einer transparenten, gläsernen, glasartigen keramischen und/oder kristallinen Lage, Trennvorrichtung für ein derartiges Werkstück sowie Produkt aus einem derartigen Werkstück
|
|
US9296646B2
(en)
|
2013-08-29 |
2016-03-29 |
Corning Incorporated |
Methods for forming vias in glass substrates
|
|
US10005152B2
(en)
*
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
|
US9517963B2
(en)
*
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9815730B2
(en)
*
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
EP3100081B1
(en)
*
|
2014-01-29 |
2020-03-11 |
Corning Incorporated |
Laser modified glass for display illumination
|
|
JP6262039B2
(ja)
|
2014-03-17 |
2018-01-17 |
株式会社ディスコ |
板状物の加工方法
|
|
TWI556898B
(zh)
*
|
2014-04-29 |
2016-11-11 |
Nat Inst Chung Shan Science & Technology |
A method and system for preparing vertical micro-guide hole on fly black laser on opaque ceramic sheet
|
|
EP3138120B1
(en)
*
|
2014-04-30 |
2018-04-18 |
Corning Incorporated |
Etch back processes of bonding material for the manufacture of through-glass vias
|
|
JP6301203B2
(ja)
*
|
2014-06-02 |
2018-03-28 |
株式会社ディスコ |
チップの製造方法
|
|
EP3166895B1
(en)
|
2014-07-08 |
2021-11-24 |
Corning Incorporated |
Methods and apparatuses for laser processing materials
|
|
EP3169476A1
(en)
|
2014-07-14 |
2017-05-24 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
WO2016010954A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Systems and methods for processing transparent materials using adjustable laser beam focal lines
|
|
EP3536440A1
(en)
|
2014-07-14 |
2019-09-11 |
Corning Incorporated |
Glass article with a defect pattern
|
|
WO2016010949A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for forming perforations
|
|
US11610783B2
(en)
|
2014-07-30 |
2023-03-21 |
Corning Incorporated |
Ultrasonic tank and methods for uniform glass substrate etching
|
|
JP2016070900A
(ja)
*
|
2014-10-02 |
2016-05-09 |
セイコーエプソン株式会社 |
磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル
|
|
JP2016080613A
(ja)
*
|
2014-10-21 |
2016-05-16 |
セイコーエプソン株式会社 |
磁気計測装置、ガスセル、磁気計測装置の製造方法、およびガスセルの製造方法
|
|
US10932371B2
(en)
|
2014-11-05 |
2021-02-23 |
Corning Incorporated |
Bottom-up electrolytic via plating method
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
JP6104354B2
(ja)
*
|
2014-12-16 |
2017-03-29 |
旭硝子株式会社 |
貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法
|
|
EP3245166B1
(en)
|
2015-01-12 |
2020-05-27 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
|
US11773004B2
(en)
|
2015-03-24 |
2023-10-03 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
|
JP2018516215A
(ja)
|
2015-03-27 |
2018-06-21 |
コーニング インコーポレイテッド |
気体透過性窓、および、その製造方法
|
|
KR20170139680A
(ko)
|
2015-04-28 |
2017-12-19 |
코닝 인코포레이티드 |
출구 희생 커버 층을 사용하여 기판에 쓰루 홀을 레이저 드릴링하는 방법 및 이에 상응하는 피가공재
|
|
KR20180008723A
(ko)
*
|
2015-05-18 |
2018-01-24 |
코닝 인코포레이티드 |
광 추출 피쳐들을 포함하는 유리 제품들 및 그 제조 방법들
|
|
US20160347643A1
(en)
*
|
2015-05-29 |
2016-12-01 |
Asahi Glass Company, Limited |
Glass substrate manufacturing method
|
|
TW201704177A
(zh)
*
|
2015-06-10 |
2017-02-01 |
康寧公司 |
蝕刻玻璃基板的方法及玻璃基板
|
|
KR102499697B1
(ko)
*
|
2015-07-10 |
2023-02-14 |
코닝 인코포레이티드 |
유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
|
|
RU2598011C1
(ru)
*
|
2015-07-16 |
2016-09-20 |
федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) |
Способ изготовления полой трехмерной структуры в объеме пластины фоточувствительного стекла
|
|
CN107922254A
(zh)
*
|
2015-08-31 |
2018-04-17 |
日本板硝子株式会社 |
带微细结构的玻璃的制造方法
|
|
US20170103249A1
(en)
|
2015-10-09 |
2017-04-13 |
Corning Incorporated |
Glass-based substrate with vias and process of forming the same
|
|
JP2017088467A
(ja)
*
|
2015-11-16 |
2017-05-25 |
旭硝子株式会社 |
ガラス基板に孔を形成する装置および方法
|
|
US10292275B2
(en)
*
|
2016-04-06 |
2019-05-14 |
AGC Inc. |
Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
|
|
JP6885161B2
(ja)
*
|
2016-04-06 |
2021-06-09 |
Ａｇｃ株式会社 |
貫通孔を有するガラス基板の製造方法およびガラス基板に貫通孔を形成する方法
|
|
CN109311725B
(zh)
|
2016-05-06 |
2022-04-26 |
康宁股份有限公司 |
从透明基材激光切割及移除轮廓形状
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
JP6911288B2
(ja)
*
|
2016-06-23 |
2021-07-28 |
凸版印刷株式会社 |
ガラスの加工方法
|
|
US10134657B2
(en)
|
2016-06-29 |
2018-11-20 |
Corning Incorporated |
Inorganic wafer having through-holes attached to semiconductor wafer
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
KR20190035805A
(ko)
|
2016-07-29 |
2019-04-03 |
코닝 인코포레이티드 |
레이저 처리를 위한 장치 및 방법
|
|
JP2018024571A
(ja)
*
|
2016-08-05 |
2018-02-15 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法
|
|
WO2018044843A1
(en)
|
2016-08-30 |
2018-03-08 |
Corning Incorporated |
Laser processing of transparent materials
|
|
TW201815710A
(zh)
|
2016-08-31 |
2018-05-01 |
美商康寧公司 |
具有經填充之孔洞的經強化玻璃系物件及製造其之方法
|
|
JP6341245B2
(ja)
|
2016-09-05 |
2018-06-13 |
大日本印刷株式会社 |
貫通電極基板の製造方法、貫通電極基板および半導体装置
|
|
US10366904B2
(en)
|
2016-09-08 |
2019-07-30 |
Corning Incorporated |
Articles having holes with morphology attributes and methods for fabricating the same
|
|
TW201822282A
(zh)
|
2016-09-09 |
2018-06-16 |
美商康寧公司 |
具有通孔的低表面粗糙度基板及其製作方法
|
|
JP6923284B2
(ja)
|
2016-09-30 |
2021-08-18 |
コーニング インコーポレイテッド |
非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
|
|
WO2018074560A1
(ja)
*
|
2016-10-20 |
2018-04-26 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法、インターポーザの製造方法、およびガラス基板に孔を形成する方法
|
|
JP7066701B2
(ja)
|
2016-10-24 |
2022-05-13 |
コーニング インコーポレイテッド |
シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
WO2018085249A1
(en)
|
2016-11-04 |
2018-05-11 |
Corning Incorporated |
Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
JP6898998B2
(ja)
*
|
2017-03-06 |
2021-07-07 |
エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト |
電磁放射及び続くエッチングプロセスにより材料内に少なくとも１つの空隙を施すための方法
|
|
CN106848832A
(zh)
*
|
2017-04-24 |
2017-06-13 |
西南石油大学 |
一种小型化单巴条端面泵浦脉冲激光器
|
|
WO2018200920A1
(en)
|
2017-04-28 |
2018-11-01 |
Corning Incorporated |
Glass electrochemical sensor with wafer level stacking and through glass via (tgv) interconnects
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US20190024237A1
(en)
|
2017-07-20 |
2019-01-24 |
Corning Incorporated |
Methods for metalizing vias within a substrate
|
|
TW201919805A
(zh)
*
|
2017-08-25 |
2019-06-01 |
美商康寧公司 |
使用遠焦光束調整組件以雷射處理透明工件的設備與方法
|
|
KR102487611B1
(ko)
|
2017-10-27 |
2023-01-11 |
코닝 인코포레이티드 |
보호 물질을 사용한 관통 유리 비아 제조방법
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11846597B2
(en)
|
2018-01-03 |
2023-12-19 |
Corning Incorporated |
Methods for making electrodes and providing electrical connections in sensors
|
|
US10917966B2
(en)
|
2018-01-29 |
2021-02-09 |
Corning Incorporated |
Articles including metallized vias
|
|
TWI675126B
(zh)
*
|
2018-02-14 |
2019-10-21 |
國立臺灣大學 |
針對矽晶圓之經製絨的表面上孔洞之擴孔方法
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
WO2019193862A1
(ja)
*
|
2018-04-05 |
2019-10-10 |
パナソニックＩｐマネジメント株式会社 |
傷形成方法、試料分割方法、半導体素子の製造方法、半導体レーザ素子の製造方法及び半導体レーザ素子
|
|
US11152294B2
(en)
|
2018-04-09 |
2021-10-19 |
Corning Incorporated |
Hermetic metallized via with improved reliability
|
|
WO2020061437A1
(en)
|
2018-09-20 |
2020-03-26 |
Industrial Technology Research Institute |
Copper metallization for through-glass vias on thin glass
|
|
WO2020112710A1
(en)
|
2018-11-27 |
2020-06-04 |
Corning Incorporated |
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
|
|
CN113614045B
(zh)
*
|
2019-02-08 |
2023-11-21 |
康宁股份有限公司 |
采用脉冲激光束聚焦线和气相蚀刻对透明工件进行激光加工的方法
|
|
US11760682B2
(en)
|
2019-02-21 |
2023-09-19 |
Corning Incorporated |
Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
|
|
WO2020190489A1
(en)
|
2019-03-21 |
2020-09-24 |
Corning Incorporated |
Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam
|
|
TW202103830A
(zh)
*
|
2019-03-25 |
2021-02-01 |
美商康寧公司 |
在玻璃中形成穿孔之方法
|
|
US11881613B2
(en)
|
2019-05-10 |
2024-01-23 |
Corning Incorporated |
Transparent package for window mounted transceiver unit
|
|
US11952310B2
(en)
|
2019-05-10 |
2024-04-09 |
Corning Incorporated |
Silicate glass compositions useful for the efficient production of through glass vias
|
|
KR20220025060A
(ko)
|
2019-07-01 |
2022-03-03 |
코닝 인코포레이티드 |
곡선형 준-비-회절 레이저 빔을 사용하여 투명 가공물을 레이저 가공하는 방법
|
|
JP7205413B2
(ja)
*
|
2019-08-07 |
2023-01-17 |
株式会社Sumco |
レーザマーク付きシリコンウェーハの製造方法
|
|
EP4037863A1
(en)
|
2019-10-03 |
2022-08-10 |
Orvinum AG |
Apparatus for creating a hole in a glass container
|
|
WO2021108079A1
(en)
|
2019-11-27 |
2021-06-03 |
Corning Incorporated |
Fabricating laminate glass with blind vias
|
|
CN112894146A
(zh)
*
|
2019-12-04 |
2021-06-04 |
大族激光科技产业集团股份有限公司 |
玻璃基板通孔的激光加工方法和装置
|
|
WO2022055671A1
(en)
*
|
2020-09-09 |
2022-03-17 |
Corning Incorporated |
Glass substrates with blind vias having depth uniformity and methods for forming the same
|
|
KR20250088656A
(ko)
*
|
2020-10-06 |
2025-06-17 |
니폰 덴키 가라스 가부시키가이샤 |
관통 구멍을 갖는 유리 기판
|
|
KR20230107620A
(ko)
|
2020-11-16 |
2023-07-17 |
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관통 유리 비아가 있는 3d 인터포저 - 구리와 유리 표면 사이의 접착력을 높이는 방법 및 그 물품
|
|
CN113292236A
(zh)
*
|
2021-05-21 |
2021-08-24 |
江西沃格光电股份有限公司 |
一种Mini-LED基板通孔的形成方法及电子设备
|
|
KR102605271B1
(ko)
*
|
2021-07-13 |
2023-11-27 |
주식회사 중우나라 |
유리기판의 관통홀 형성방법
|
|
WO2024118449A1
(en)
*
|
2022-11-30 |
2024-06-06 |
Corning Incorporated |
Systems and methods for laser micromachining substrates using a liquid-assist medium and articles fabricated by the same
|
|
CN117263520A
(zh)
*
|
2023-08-29 |
2023-12-22 |
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|
|
WO2025164391A1
(ja)
*
|
2024-01-30 |
2025-08-07 |
Ａｇｃ株式会社 |
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|