JP2019514207A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019514207A5 JP2019514207A5 JP2018551419A JP2018551419A JP2019514207A5 JP 2019514207 A5 JP2019514207 A5 JP 2019514207A5 JP 2018551419 A JP2018551419 A JP 2018551419A JP 2018551419 A JP2018551419 A JP 2018551419A JP 2019514207 A5 JP2019514207 A5 JP 2019514207A5
- Authority
- JP
- Japan
- Prior art keywords
- energy beam
- workpiece
- laser energy
- laser
- seed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022164917A JP2023011656A (ja) | 2016-03-31 | 2022-10-13 | 導電めっきのためのレーザシーディング |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662315913P | 2016-03-31 | 2016-03-31 | |
| US62/315,913 | 2016-03-31 | ||
| US201662407848P | 2016-10-13 | 2016-10-13 | |
| US62/407,848 | 2016-10-13 | ||
| PCT/US2017/025392 WO2017173281A1 (en) | 2016-03-31 | 2017-03-31 | Laser-seeding for electro-conductive plating |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022164917A Division JP2023011656A (ja) | 2016-03-31 | 2022-10-13 | 導電めっきのためのレーザシーディング |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019514207A JP2019514207A (ja) | 2019-05-30 |
| JP2019514207A5 true JP2019514207A5 (enExample) | 2020-04-30 |
Family
ID=59966483
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018551419A Ceased JP2019514207A (ja) | 2016-03-31 | 2017-03-31 | 導電めっきのためのレーザシーディング |
| JP2022164917A Pending JP2023011656A (ja) | 2016-03-31 | 2022-10-13 | 導電めっきのためのレーザシーディング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022164917A Pending JP2023011656A (ja) | 2016-03-31 | 2022-10-13 | 導電めっきのためのレーザシーディング |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10957615B2 (enExample) |
| EP (1) | EP3437127A4 (enExample) |
| JP (2) | JP2019514207A (enExample) |
| KR (1) | KR102437034B1 (enExample) |
| CN (1) | CN108604575B (enExample) |
| TW (2) | TW202224211A (enExample) |
| WO (1) | WO2017173281A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018207181B4 (de) * | 2018-05-08 | 2023-06-29 | Hegla Boraident Gmbh & Co. Kg | Verfahren zum Markieren von Glastafeln, vorzugsweise von Einscheiben-Sicherheitsglastafeln |
| KR102391800B1 (ko) * | 2018-06-15 | 2022-04-29 | 주식회사 엘지화학 | 비정질 박막의 제조방법 |
| US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
| US11780210B2 (en) * | 2019-09-18 | 2023-10-10 | Intel Corporation | Glass dielectric layer with patterning |
| DE102019133955B4 (de) * | 2019-12-11 | 2021-08-19 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zur Herstellung einer Verbundstruktur aus mindestens einer leitfähigen Struktur |
| WO2021217056A1 (en) * | 2020-04-23 | 2021-10-28 | Akash Systems, Inc. | High-efficiency structures for improved wireless communications |
| LU102294B1 (en) * | 2020-12-17 | 2022-06-21 | Fyzikalni Ustav Av Cr V V I | A method and a device for assembly of a nanomaterial structure |
| US11877398B2 (en) * | 2021-02-11 | 2024-01-16 | Io Tech Group Ltd. | PCB production by laser systems |
| WO2022172200A1 (en) * | 2021-02-11 | 2022-08-18 | Io Tech Group Ltd. | Pcb production by laser systems |
| US20220266382A1 (en) * | 2021-02-25 | 2022-08-25 | Electro Scientific Industries, Inc. | Laser-seeding for electro-conductive plating |
| US11705365B2 (en) | 2021-05-18 | 2023-07-18 | Applied Materials, Inc. | Methods of micro-via formation for advanced packaging |
| US20220399206A1 (en) * | 2021-06-11 | 2022-12-15 | V-Finity Inc. | Method for building conductive through-hole vias in glass substrates |
| US20220406725A1 (en) * | 2021-06-17 | 2022-12-22 | Intel Corporation | Glass package core with planar structures |
| CN113410339B (zh) * | 2021-06-18 | 2023-08-15 | 中科检测技术服务(重庆)有限公司 | 一种高稳定性纳米铜导电薄膜的制备及其应用 |
| EP4120023A1 (en) | 2021-07-15 | 2023-01-18 | Wuhan Dr Laser Technology Corp., Ltd. | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
| IL297544A (en) | 2021-10-22 | 2023-05-01 | Wuhan Dr Laser Tech Corp Ltd | Sheets and methods for transferring a pattern with a release layer and/or paste mixtures |
| US12349497B2 (en) * | 2021-12-27 | 2025-07-01 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing of multi-layered features |
| EP4201574A1 (en) * | 2021-12-27 | 2023-06-28 | Wuhan Dr Laser Technology Corp., Ltd. | Pattern transfer printing of multi-layered features |
| IL289428B2 (en) * | 2021-12-27 | 2025-10-01 | Wuhan Dr Laser Tech Corp Ltd | Transfer printing of multi-layered details |
| TWI846031B (zh) * | 2022-08-25 | 2024-06-21 | 華龍國際科技股份有限公司 | 可吸收電路板變形量的均熱片及形成該均熱片的製造方法 |
| KR20240031738A (ko) * | 2022-09-01 | 2024-03-08 | 주식회사 익스톨 | 관통 비아 금속 배선 형성방법 |
| US20240312888A1 (en) * | 2023-03-14 | 2024-09-19 | Intel Corporation | Via structures in bonded glass substrates |
| US20240332155A1 (en) * | 2023-03-31 | 2024-10-03 | Intel Corporation | Substrates with a glass core and glass buildup layers |
| EP4537935A1 (en) * | 2023-10-10 | 2025-04-16 | Johnson Matthey Public Limited Company | Method of coating a catalyst on flat or textured substrates |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5266446A (en) * | 1990-11-15 | 1993-11-30 | International Business Machines Corporation | Method of making a multilayer thin film structure |
| US6805918B2 (en) * | 1999-01-27 | 2004-10-19 | The United States Of America As Represented By The Secretary Of The Navy | Laser forward transfer of rheological systems |
| US6815015B2 (en) | 1999-01-27 | 2004-11-09 | The United States Of America As Represented By The Secretary Of The Navy | Jetting behavior in the laser forward transfer of rheological systems |
| JP2001102724A (ja) * | 1999-09-30 | 2001-04-13 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| JPWO2003007370A1 (ja) * | 2001-07-12 | 2004-11-04 | 株式会社日立製作所 | 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法 |
| WO2003011479A1 (en) * | 2001-08-02 | 2003-02-13 | Mykrolis Corporation | Selective electroless deposition and interconnects made therefrom |
| GB2381274A (en) * | 2001-10-29 | 2003-04-30 | Qinetiq Ltd | High resolution patterning method |
| CN1195397C (zh) * | 2002-06-06 | 2005-03-30 | 华中科技大学 | 一种电路板制作和修复方法 |
| JP4031704B2 (ja) * | 2002-12-18 | 2008-01-09 | 東京エレクトロン株式会社 | 成膜方法 |
| US7259443B2 (en) * | 2003-06-26 | 2007-08-21 | E.I. Du Pont De Nemours And Company | Methods for forming patterns on a filled dielectric material on substrates |
| JP4235945B2 (ja) * | 2003-08-29 | 2009-03-11 | 独立行政法人理化学研究所 | 金属配線形成方法および金属配線形成装置 |
| EP1863327A1 (en) * | 2005-03-22 | 2007-12-05 | Cluster Technology Co., Ltd | Process for producing wiring board, and wiring board |
| US7358169B2 (en) | 2005-04-13 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Laser-assisted deposition |
| US7994021B2 (en) * | 2006-07-28 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| CN101121575B (zh) | 2007-07-06 | 2010-11-03 | 中国科学院上海光学精密机械研究所 | 利用飞秒激光实现玻璃表面选择性金属化的方法 |
| US7927454B2 (en) * | 2007-07-17 | 2011-04-19 | Samsung Mobile Display Co., Ltd. | Method of patterning a substrate |
| JP4682285B2 (ja) * | 2007-08-30 | 2011-05-11 | 日立電線株式会社 | 配線及び層間接続ビアの形成方法 |
| US8728589B2 (en) * | 2007-09-14 | 2014-05-20 | Photon Dynamics, Inc. | Laser decal transfer of electronic materials |
| US7666568B2 (en) * | 2007-10-23 | 2010-02-23 | E. I. Du Pont De Nemours And Company | Composition and method for providing a patterned metal layer having high conductivity |
| US7998857B2 (en) * | 2007-10-24 | 2011-08-16 | Intel Corporation | Integrated circuit and process for fabricating thereof |
| US8017022B2 (en) * | 2007-12-28 | 2011-09-13 | Intel Corporation | Selective electroless plating for electronic substrates |
| JP5238544B2 (ja) * | 2008-03-07 | 2013-07-17 | 株式会社半導体エネルギー研究所 | 成膜方法及び発光装置の作製方法 |
| EP2197253A1 (en) * | 2008-12-12 | 2010-06-16 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method for electric circuit deposition |
| US20110089429A1 (en) * | 2009-07-23 | 2011-04-21 | Venkatraman Prabhakar | Systems, methods and materials involving crystallization of substrates using a seed layer, as well as products produced by such processes |
| JP2011129345A (ja) * | 2009-12-17 | 2011-06-30 | Fujifilm Corp | 光熱変換シート、並びに、それを用いた有機電界発光素材シート、及び有機電界発光装置の製造方法 |
| JP2011178642A (ja) | 2010-03-03 | 2011-09-15 | Nippon Sheet Glass Co Ltd | 貫通電極付きガラス板の製造方法および電子部品 |
| FR2957916B1 (fr) | 2010-03-29 | 2018-02-09 | Universite Des Sciences Et Technologies De Lille | Procede de metallisation selective d'un monolithe de verre a base de silice, et produit obtenu par ce procede |
| TW201205761A (en) | 2010-05-17 | 2012-02-01 | Tno | Through silicon via treatment device and method arranged for treatment of TSVs in a chip manufacturing process |
| US8552564B2 (en) * | 2010-12-09 | 2013-10-08 | Intel Corporation | Hybrid-core through holes and vias |
| EP2660352A1 (en) | 2012-05-02 | 2013-11-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Donor sheet and method for light induced forward transfer manufacturing |
| US9526184B2 (en) * | 2012-06-29 | 2016-12-20 | Viasystems, Inc. | Circuit board multi-functional hole system and method |
| EP2685515A1 (en) | 2012-07-12 | 2014-01-15 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and system for dividing a barrier foil |
| US10023955B2 (en) * | 2012-08-31 | 2018-07-17 | Fei Company | Seed layer laser-induced deposition |
| JP2014165263A (ja) * | 2013-02-22 | 2014-09-08 | Seiren Co Ltd | 透明電極材の製造方法 |
| US9130016B2 (en) * | 2013-04-15 | 2015-09-08 | Schott Corporation | Method of manufacturing through-glass vias |
| EP2824699A1 (en) | 2013-07-08 | 2015-01-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Providing a chip die with electrically conductive elements |
| CN105705671B (zh) * | 2013-10-14 | 2019-10-29 | 奥宝科技股份有限公司 | 多组成材料结构的lift印刷 |
| JP6665386B2 (ja) * | 2013-12-15 | 2020-03-13 | オーボテック リミテッド | プリント回路配線の修復 |
| JP2015138921A (ja) * | 2014-01-24 | 2015-07-30 | 日本ゼオン株式会社 | 電子材料用基板 |
| US9646854B2 (en) * | 2014-03-28 | 2017-05-09 | Intel Corporation | Embedded circuit patterning feature selective electroless copper plating |
| US20150309600A1 (en) * | 2014-04-23 | 2015-10-29 | Uni-Pixel Displays, Inc. | Method of fabricating a conductive pattern with high optical transmission, low reflectance, and low visibility |
| JP2017528902A (ja) * | 2014-05-27 | 2017-09-28 | オーボテック リミテッド | レーザ誘起前方転写法による3d構造印刷 |
| JP5859075B1 (ja) * | 2014-08-07 | 2016-02-10 | 株式会社 M&M研究所 | 配線基板の製造方法、配線基板及び配線基板製造用の分散液 |
-
2017
- 2017-03-31 EP EP17776782.9A patent/EP3437127A4/en not_active Withdrawn
- 2017-03-31 CN CN201780011096.3A patent/CN108604575B/zh not_active Expired - Fee Related
- 2017-03-31 US US16/067,693 patent/US10957615B2/en not_active Expired - Fee Related
- 2017-03-31 WO PCT/US2017/025392 patent/WO2017173281A1/en not_active Ceased
- 2017-03-31 JP JP2018551419A patent/JP2019514207A/ja not_active Ceased
- 2017-03-31 TW TW111105458A patent/TW202224211A/zh unknown
- 2017-03-31 TW TW106111099A patent/TWI757279B/zh not_active IP Right Cessation
- 2017-03-31 KR KR1020187030972A patent/KR102437034B1/ko active Active
-
2022
- 2022-10-13 JP JP2022164917A patent/JP2023011656A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019514207A5 (enExample) | ||
| CN108604575B (zh) | 用于导电电镀的镭射种晶 | |
| KR101805743B1 (ko) | 프린트 배선판의 제조 방법 및 레이저 가공용 동박 | |
| KR102804325B1 (ko) | 초고속 레이저를 사용한 회로 보드 재료의 패턴화 및 제거 | |
| JP2014501686A5 (enExample) | ||
| TW201246448A (en) | Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies | |
| CN107111233B (zh) | 用于细线制造的方法 | |
| JPWO2019102701A1 (ja) | 電子部品の製造方法及び電子部品 | |
| Lv et al. | Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating | |
| JP2015046570A (ja) | 多層印刷回路基板の製造方法 | |
| JP2009094191A (ja) | 多層配線基板の製造方法 | |
| CN101699935B (zh) | 一种可定位高导热陶瓷电路板的生产方法 | |
| CN108617102A (zh) | 一种陶瓷电路板的制作方法 | |
| WO2024055448A1 (zh) | 一种激光钻孔并以图形轨迹粗化绝缘基材的电路板制造方法 | |
| JP2019026879A (ja) | 電子部品の製造方法及び電子部品 | |
| JP2016504494A (ja) | 媒体上に金属パターンを堆積する方法 | |
| JP6458285B2 (ja) | デバイスの製造方法 | |
| JP2021175583A (ja) | レーザー加工品の製造方法 | |
| JP5750686B2 (ja) | プリント配線板の製造方法及びこれに用いる表面処理剤 | |
| CN107567197A (zh) | 一种自清洁柔性导电线路及其制备方法 | |
| US20220266382A1 (en) | Laser-seeding for electro-conductive plating | |
| KR102356407B1 (ko) | 레이저 가공용 구리 박, 캐리어 박 구비 레이저 가공용 구리 박, 구리클래드 적층체 및 프린트 배선판의 제조 방법 | |
| TWI698401B (zh) | 玻璃基板之穿孔製作方法 | |
| KR101184430B1 (ko) | 도금방지막을 이용한 부분 도금 장치 및 부분 도금 방법 | |
| WO2015178101A1 (ja) | 樹脂基材の表面改質処理方法、金属皮膜形成方法及び積層体 |