JP2017504553A5 - - Google Patents

Download PDF

Info

Publication number
JP2017504553A5
JP2017504553A5 JP2016541161A JP2016541161A JP2017504553A5 JP 2017504553 A5 JP2017504553 A5 JP 2017504553A5 JP 2016541161 A JP2016541161 A JP 2016541161A JP 2016541161 A JP2016541161 A JP 2016541161A JP 2017504553 A5 JP2017504553 A5 JP 2017504553A5
Authority
JP
Japan
Prior art keywords
glass
laser
glass substrate
glass article
micrometers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016541161A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017504553A (ja
JP6588911B2 (ja
Filing date
Publication date
Priority claimed from US14/154,525 external-priority patent/US10421683B2/en
Application filed filed Critical
Priority claimed from PCT/US2014/070724 external-priority patent/WO2015095264A2/en
Publication of JP2017504553A publication Critical patent/JP2017504553A/ja
Publication of JP2017504553A5 publication Critical patent/JP2017504553A5/ja
Application granted granted Critical
Publication of JP6588911B2 publication Critical patent/JP6588911B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016541161A 2013-12-17 2014-12-17 ガラスの3d形成 Expired - Fee Related JP6588911B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201361917127P 2013-12-17 2013-12-17
US61/917,127 2013-12-17
US14/154,525 2014-01-14
US14/154,525 US10421683B2 (en) 2013-01-15 2014-01-14 Method and device for the laser-based machining of sheet-like substrates
US201462024724P 2014-07-15 2014-07-15
US201462024581P 2014-07-15 2014-07-15
US62/024,724 2014-07-15
US62/024,581 2014-07-15
PCT/US2014/070724 WO2015095264A2 (en) 2013-12-17 2014-12-17 3-d forming of glass

Publications (3)

Publication Number Publication Date
JP2017504553A JP2017504553A (ja) 2017-02-09
JP2017504553A5 true JP2017504553A5 (enExample) 2018-03-22
JP6588911B2 JP6588911B2 (ja) 2019-10-09

Family

ID=53403875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016541161A Expired - Fee Related JP6588911B2 (ja) 2013-12-17 2014-12-17 ガラスの3d形成

Country Status (7)

Country Link
US (1) US20160311717A1 (enExample)
EP (1) EP3083514B1 (enExample)
JP (1) JP6588911B2 (enExample)
KR (1) KR20160100332A (enExample)
CN (1) CN107241904B (enExample)
TW (1) TWI653200B (enExample)
WO (1) WO2015095264A2 (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079747B (zh) 2010-07-12 2016-08-03 罗芬-西纳技术有限公司 由激光成丝作用进行材料处理的方法
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9102011B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016010954A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
FR3024137B1 (fr) * 2014-07-24 2016-07-29 Saint Gobain Procede de fabrication de feuilles de verre de forme complexe
CN104310779A (zh) * 2014-09-29 2015-01-28 合肥鑫晟光电科技有限公司 一种激光切割基板的方法及激光切割设备
US10391588B2 (en) 2015-01-13 2019-08-27 Rofin-Sinar Technologies Llc Method and system for scribing brittle material followed by chemical etching
WO2016138054A1 (en) 2015-02-27 2016-09-01 Corning Incorporated Optical assembly having microlouvers
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
DE102015111490A1 (de) 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
DE102015116848A1 (de) * 2015-10-05 2017-04-06 Schott Ag Dielektrisches Werkstück mit einer Zone definiert ausgebildeter Festigkeit sowie Verfahren zu dessen Herstellung und dessen Verwendung
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) * 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
JP2018065188A (ja) * 2016-10-21 2018-04-26 日本電気硝子株式会社 レーザー加工方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP6981806B2 (ja) * 2017-08-09 2021-12-17 株式会社ディスコ 分割方法
TW201919805A (zh) * 2017-08-25 2019-06-01 美商康寧公司 使用遠焦光束調整組件以雷射處理透明工件的設備與方法
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US12151962B2 (en) * 2018-03-06 2024-11-26 Corning Incorporated Apparatus and method for controlling substrate thickness
US11059131B2 (en) 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
TWI841629B (zh) 2018-11-29 2024-05-11 美商康寧公司 用於抬頭顯示系統之反曲率非球面鏡及其形成方法
CN110732789A (zh) * 2019-10-23 2020-01-31 中南大学 一种热辅助的飞秒激光加工方法
KR102819808B1 (ko) * 2020-06-15 2025-06-16 삼성디스플레이 주식회사 윈도우 성형 장치 및 이를 이용한 윈도우 성형 방법
JP7451047B2 (ja) * 2020-08-28 2024-03-18 株式会社ディスコ 板状物の製造方法及び板状物
EP4204206B1 (en) * 2020-08-31 2025-01-08 The Cooper Group, LLC Historically accurate simulated divided light glass unit and methods of making the same
CN114644448A (zh) * 2020-12-21 2022-06-21 余姚舜宇智能光学技术有限公司 曲面玻璃和曲面玻璃的开孔方法
JP7458511B2 (ja) * 2021-01-28 2024-03-29 Hoya株式会社 ガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、およびガラス板の処理装置
CN114477738A (zh) * 2021-09-28 2022-05-13 新沂市铭达玻璃有限公司 一种汽车玻璃加工的热成型工艺
CN114772940A (zh) * 2022-05-25 2022-07-22 武汉理工大学 一种激光直写微纳结构制造可折叠玻璃的方法
CN116040953A (zh) * 2022-10-27 2023-05-02 芜湖东信光电科技有限公司 一种柔性可折叠玻璃及其制备方法
CN115448586A (zh) * 2022-10-27 2022-12-09 芜湖东信光电科技有限公司 一种可折叠玻璃及其制备方法
CN119038861A (zh) * 2024-08-19 2024-11-29 福耀玻璃工业集团股份有限公司 玻璃成型方法、玻璃及车辆
CN119954378B (zh) * 2025-04-11 2025-07-15 赣州明智达特种玻璃科技有限公司 一种适用于特种玻璃局部弯曲加工的玻璃成型模具

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000327349A (ja) * 1999-05-24 2000-11-28 China Glaze Co Ltd 結晶化ガラス板の曲げ加工方法
KR100693934B1 (ko) * 2006-03-24 2007-03-12 케이 이엔지(주) 벤딩부가 장착된 유리절단 장치 및 이를 이용한 유리의절단방법
DE102006035555A1 (de) * 2006-07-27 2008-01-31 Eliog-Kelvitherm Industrieofenbau Gmbh Anordnung und Verfahren zur Verformung von Glasscheiben
WO2009042212A2 (en) * 2007-09-26 2009-04-02 Aradigm Corporation Impinging jet nozzles in stretched or deformed substrates
JP5096903B2 (ja) * 2007-12-18 2012-12-12 国立大学法人埼玉大学 ガラス箔の3次元加工方法
CN103079747B (zh) * 2010-07-12 2016-08-03 罗芬-西纳技术有限公司 由激光成丝作用进行材料处理的方法
EP2457881B1 (en) * 2010-11-30 2019-05-08 Corning Incorporated Method and apparatus for bending a sheet of material into a shaped article
US20120151760A1 (en) * 2010-12-15 2012-06-21 Sony Ericsson Mobile Communications Ab Non-planar display glass for mobile device
WO2012108316A1 (ja) * 2011-02-08 2012-08-16 株式会社フジクラ 微細孔を有する基体の製造方法、及び基体
CN103182894A (zh) * 2011-12-29 2013-07-03 深圳富泰宏精密工业有限公司 玻璃件及其制作方法
JPWO2013129165A1 (ja) * 2012-02-27 2015-07-30 旭硝子株式会社 ガラス基板を製造する方法、およびガラス基板
JP2015511571A (ja) * 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
CN102962583A (zh) * 2012-11-28 2013-03-13 江苏大学 一种基于激光加热的塑料件微结构成形方法和装置
US9346706B2 (en) * 2012-11-29 2016-05-24 Corning Incorporated Methods of fabricating glass articles by laser damage and etching
US20150034613A1 (en) * 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US11053156B2 (en) * 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US9815730B2 (en) * 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9757815B2 (en) * 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
DE102014110920C5 (de) * 2014-07-31 2023-08-03 Schott Ag Geformter Glasartikel mit vorbestimmter Geometrie
KR20170006900A (ko) * 2015-07-10 2017-01-18 삼성전자주식회사 성형장치 및 이를 이용한 성형방법

Similar Documents

Publication Publication Date Title
JP2017504553A5 (enExample)
JP2017501884A5 (enExample)
MY188444A (en) Wafer producing method
MY181116A (en) Wafer producing method
JP2017521259A5 (enExample)
JP2014501686A5 (enExample)
JP2018528078A5 (enExample)
MY175831A (en) Wafer producing method
JP2019513558A (ja) サファイアを切断するための方法及び装置
JP2015511571A5 (enExample)
MX2007001159A (es) Metodo para formar una grieta media en un sustrato y aparato para formar una grieta media en un sustrato.
JP2013522511A5 (enExample)
JP2017122046A (ja) 透明ワークを分離する方法
MY180541A (en) Wafer producing method
MY177233A (en) Wafer producing method
JP2009049387A5 (enExample)
JP2013528109A5 (enExample)
WO2015095264A3 (en) 3-d forming of glass
JP2013529137A5 (enExample)
JP2009296008A5 (enExample)
JP2013537114A5 (enExample)
SG11201906985QA (en) Bonding apparatus and bonding method
JP2011000755A5 (enExample)
JP2015212994A5 (enExample)
EP4591925A3 (en) Controlled photomechanical and photothermal tissue treatment in the picosecond regime