JP2015523296A5 - - Google Patents

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Publication number
JP2015523296A5
JP2015523296A5 JP2015504561A JP2015504561A JP2015523296A5 JP 2015523296 A5 JP2015523296 A5 JP 2015523296A5 JP 2015504561 A JP2015504561 A JP 2015504561A JP 2015504561 A JP2015504561 A JP 2015504561A JP 2015523296 A5 JP2015523296 A5 JP 2015523296A5
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Japan
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panel
substrate
crack
laser
starting
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JP2015504561A
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Japanese (ja)
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JP6378167B2 (ja
JP2015523296A (ja
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Priority claimed from PCT/US2013/029871 external-priority patent/WO2013151660A1/en
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Publication of JP2015523296A5 publication Critical patent/JP2015523296A5/ja
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Publication of JP6378167B2 publication Critical patent/JP6378167B2/ja
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JP2015504561A 2012-04-05 2013-03-08 エレクトロクロミック素子を製造するためのサーマルレーザースクライブ切断の方法及び装置、並びに対応する切断されたガラスパネル Expired - Fee Related JP6378167B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261620713P 2012-04-05 2012-04-05
US61/620,713 2012-04-05
PCT/US2013/029871 WO2013151660A1 (en) 2012-04-05 2013-03-08 Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel

Publications (3)

Publication Number Publication Date
JP2015523296A JP2015523296A (ja) 2015-08-13
JP2015523296A5 true JP2015523296A5 (enExample) 2016-04-07
JP6378167B2 JP6378167B2 (ja) 2018-08-22

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JP2015504561A Expired - Fee Related JP6378167B2 (ja) 2012-04-05 2013-03-08 エレクトロクロミック素子を製造するためのサーマルレーザースクライブ切断の方法及び装置、並びに対応する切断されたガラスパネル

Country Status (6)

Country Link
US (1) US9272941B2 (enExample)
EP (1) EP2834036B1 (enExample)
JP (1) JP6378167B2 (enExample)
CN (1) CN104661787A (enExample)
IN (1) IN2014DN08858A (enExample)
WO (1) WO2013151660A1 (enExample)

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JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
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US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
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JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
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US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108519709A (zh) * 2018-06-01 2018-09-11 Oppo广东移动通信有限公司 电致变色母板、电致变色单元、壳体以及电子设备
CN112222631B (zh) * 2020-09-24 2022-08-09 中国航空制造技术研究院 一种非晶零件激光切割方法
CN112589225A (zh) * 2020-11-11 2021-04-02 鞍钢股份有限公司 一种降低导电钢盘条轧制事故率的切割方法
CN116457721A (zh) * 2020-12-21 2023-07-18 Sage电致变色显示有限公司 用于制造包括一个或多个电致变色装置的母板的设备和方法
CN116282876B (zh) * 2023-03-24 2023-11-14 江苏朗晟激光科技有限公司 一种钢化玻璃激光切割装置
CN119407546A (zh) * 2025-01-07 2025-02-11 中电科风华信息装备股份有限公司 基于裂纹扩展的显示面板切割方法

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