JP5139739B2 - 積層体の割断方法 - Google Patents
積層体の割断方法 Download PDFInfo
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- JP5139739B2 JP5139739B2 JP2007188511A JP2007188511A JP5139739B2 JP 5139739 B2 JP5139739 B2 JP 5139739B2 JP 2007188511 A JP2007188511 A JP 2007188511A JP 2007188511 A JP2007188511 A JP 2007188511A JP 5139739 B2 JP5139739 B2 JP 5139739B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Description
11 透光性材料層
12 結晶性材料層
13 表面
20a 改質部
20b 改質部
L 割断予定線
LBa レーザビーム
LBb レーザビーム
Claims (7)
- ガラス基板からなる透光性材料層とSi基板からなる結晶性材料層との積層構造を有する積層体を割断する積層体の割断方法であって、所望の割断予定線に沿って結晶性材料層における透光性材料層側の表面および透光性材料層の内部それぞれに各別にレーザビームを照射することによって改質部を結晶性材料層における透光性材料層側の表面および透光性材料層の内部それぞれに形成する改質部形成工程と、改質部形成工程の後で積層体に局所的に温度変化を与えることにより生じる熱応力によって改質部を割断起点として積層体を割断予定線に沿って割断する割断工程とを備え、結晶性材料層の表面に改質部を形成する過程と、透光性材料層の内部に改質部を形成する過程とで共通のレーザを用いることを特徴とする積層体の割断方法。
- 改質部形成工程では、透光性材料層の内部に改質部を形成するにあたって、改質部を割断予定線に沿ってミシン目状に形成することを特徴とする請求項1記載の積層体の割断方法。
- 改質部形成工程では、透光性材料層の内部に改質部を形成するにあたって、積層体の厚み方向において異なる複数の位置に改質部を形成することを特徴とする請求項1または請求項2記載の積層体の割断方法。
- 改質部形成工程では、結晶性材料層における透光性材料層側の表面に改質部を形成するにあたって、改質部を割断予定線に沿ってミシン目状に形成することを特徴とする請求項1ないし請求項3のいずれか1項に記載の積層体の割断方法。
- 改質部形成工程では、透光性材料層の内部に改質部を形成するにあたって、格子状の割断予定線の各交差点ごとに改質部を十字状に形成することを特徴とする請求項1ないし請求項4のいずれか1項に記載の積層体の割断方法。
- 改質部形成工程では、レーザビームのパルス幅を20fs〜20nsの範囲で設定することを特徴とする請求項1ないし請求項5のいずれか1項に記載の積層体の割断方法。
- 割断工程では、透光性材料層の表面にレーザビームを照射することにより温度変化を与えることを特徴とする請求項1ないし請求項6のいずれか1項に記載の積層体の割断方法。
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JP2007188511A JP5139739B2 (ja) | 2007-07-19 | 2007-07-19 | 積層体の割断方法 |
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JP2007188511A JP5139739B2 (ja) | 2007-07-19 | 2007-07-19 | 積層体の割断方法 |
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JP2009023215A JP2009023215A (ja) | 2009-02-05 |
JP5139739B2 true JP5139739B2 (ja) | 2013-02-06 |
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Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9035216B2 (en) | 2009-04-07 | 2015-05-19 | Hamamatsu Photonics K.K. | Method and device for controlling interior fractures by controlling the laser pulse width |
JP5537081B2 (ja) | 2009-07-28 | 2014-07-02 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
JP5379604B2 (ja) * | 2009-08-21 | 2013-12-25 | 浜松ホトニクス株式会社 | レーザ加工方法及びチップ |
BR112012022488A2 (pt) * | 2010-03-05 | 2016-10-25 | Sage Electrochromics Inc | laminação de dispositivo eletrocrômico em substratos de vidro |
CN102858489B (zh) * | 2010-04-12 | 2014-12-31 | 三菱电机株式会社 | 激光切割方法及激光切割装置 |
KR101704028B1 (ko) * | 2010-06-21 | 2017-02-07 | 엘지이노텍 주식회사 | 발광 소자 |
CN103079747B (zh) * | 2010-07-12 | 2016-08-03 | 罗芬-西纳技术有限公司 | 由激光成丝作用进行材料处理的方法 |
FR2962682B1 (fr) | 2010-07-16 | 2015-02-27 | Saint Gobain | Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables |
WO2013151660A1 (en) | 2012-04-05 | 2013-10-10 | Sage Electrochromics, Inc. | Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel |
EP3024616B1 (de) * | 2013-07-23 | 2019-04-10 | 3D-Micromac AG | Verfahren und vorrichtung zur trennung eines flachen werkstücks in mehrere teilstücke |
JP6925718B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP6925719B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP6925717B2 (ja) * | 2017-06-05 | 2021-08-25 | 株式会社ディスコ | チップの製造方法 |
JP2019177410A (ja) * | 2018-03-30 | 2019-10-17 | Dgshape株式会社 | 加工方法、加工システム、加工プログラム。 |
JPWO2022162768A1 (ja) * | 2021-01-27 | 2022-08-04 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3935189B2 (ja) * | 2002-03-12 | 2007-06-20 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP2006035710A (ja) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | レーザによるガラス加工方法ならびに装置 |
JP4809632B2 (ja) * | 2005-06-01 | 2011-11-09 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2007015169A (ja) * | 2005-07-06 | 2007-01-25 | Seiko Epson Corp | スクライブ形成方法、スクライブ形成装置、多層基板 |
JP2007118009A (ja) * | 2005-10-25 | 2007-05-17 | Seiko Epson Corp | 積層体の加工方法 |
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