IN2014DN08858A - - Google Patents

Info

Publication number
IN2014DN08858A
IN2014DN08858A IN8858DEN2014A IN2014DN08858A IN 2014DN08858 A IN2014DN08858 A IN 2014DN08858A IN 8858DEN2014 A IN8858DEN2014 A IN 8858DEN2014A IN 2014DN08858 A IN2014DN08858 A IN 2014DN08858A
Authority
IN
India
Prior art keywords
cutting
smaller
cutting process
starter crack
panel
Prior art date
Application number
Other languages
English (en)
Inventor
Jean Christophe Giron
Harvey Kalweit
Michael A Mccoy
Li Ya Yeh
Jean Pierre Douche
Original Assignee
Sage Electrochromics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sage Electrochromics Inc filed Critical Sage Electrochromics Inc
Publication of IN2014DN08858A publication Critical patent/IN2014DN08858A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
IN8858DEN2014 2012-04-05 2013-03-08 IN2014DN08858A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261620713P 2012-04-05 2012-04-05
PCT/US2013/029871 WO2013151660A1 (en) 2012-04-05 2013-03-08 Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel

Publications (1)

Publication Number Publication Date
IN2014DN08858A true IN2014DN08858A (enExample) 2015-05-22

Family

ID=47997842

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8858DEN2014 IN2014DN08858A (enExample) 2012-04-05 2013-03-08

Country Status (6)

Country Link
US (1) US9272941B2 (enExample)
EP (1) EP2834036B1 (enExample)
JP (1) JP6378167B2 (enExample)
CN (1) CN104661787A (enExample)
IN (1) IN2014DN08858A (enExample)
WO (1) WO2013151660A1 (enExample)

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US9478429B2 (en) * 2012-03-13 2016-10-25 Massachusetts Institute Of Technology Removable templates for directed self assembly
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US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108519709A (zh) * 2018-06-01 2018-09-11 Oppo广东移动通信有限公司 电致变色母板、电致变色单元、壳体以及电子设备
CN112222631B (zh) * 2020-09-24 2022-08-09 中国航空制造技术研究院 一种非晶零件激光切割方法
CN112589225A (zh) * 2020-11-11 2021-04-02 鞍钢股份有限公司 一种降低导电钢盘条轧制事故率的切割方法
CN116457721A (zh) * 2020-12-21 2023-07-18 Sage电致变色显示有限公司 用于制造包括一个或多个电致变色装置的母板的设备和方法
CN116282876B (zh) * 2023-03-24 2023-11-14 江苏朗晟激光科技有限公司 一种钢化玻璃激光切割装置
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US20130266757A1 (en) 2013-10-10
EP2834036A1 (en) 2015-02-11
WO2013151660A1 (en) 2013-10-10
JP6378167B2 (ja) 2018-08-22
CN104661787A (zh) 2015-05-27
US9272941B2 (en) 2016-03-01
EP2834036B1 (en) 2020-04-29

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