|
CN1019720B
(zh)
|
1991-03-19 |
1992-12-30 |
电子科技大学 |
半导体功率器件
|
|
US5374843A
(en)
*
|
1991-05-06 |
1994-12-20 |
Silinconix, Inc. |
Lightly-doped drain MOSFET with improved breakdown characteristics
|
|
US5386136A
(en)
*
|
1991-05-06 |
1995-01-31 |
Siliconix Incorporated |
Lightly-doped drain MOSFET with improved breakdown characteristics
|
|
US5923071A
(en)
|
1992-06-12 |
1999-07-13 |
Seiko Instruments Inc. |
Semiconductor device having a semiconductor film of low oxygen concentration
|
|
DE4309764C2
(de)
|
1993-03-25 |
1997-01-30 |
Siemens Ag |
Leistungs-MOSFET
|
|
BE1007283A3
(nl)
*
|
1993-07-12 |
1995-05-09 |
Philips Electronics Nv |
Halfgeleiderinrichting met een most voorzien van een extended draingebied voor hoge spanningen.
|
|
US6831331B2
(en)
|
1995-11-15 |
2004-12-14 |
Denso Corporation |
Power MOS transistor for absorbing surge current
|
|
JP3315356B2
(ja)
|
1997-10-15 |
2002-08-19 |
株式会社東芝 |
高耐圧半導体装置
|
|
US6137140A
(en)
|
1997-11-26 |
2000-10-24 |
Texas Instruments Incorporated |
Integrated SCR-LDMOS power device
|
|
JP3940518B2
(ja)
*
|
1999-03-10 |
2007-07-04 |
株式会社東芝 |
高耐圧半導体素子
|
|
US6211552B1
(en)
|
1999-05-27 |
2001-04-03 |
Texas Instruments Incorporated |
Resurf LDMOS device with deep drain region
|
|
JP4357127B2
(ja)
|
2000-03-03 |
2009-11-04 |
株式会社東芝 |
半導体装置
|
|
JP4231612B2
(ja)
|
2000-04-26 |
2009-03-04 |
株式会社ルネサステクノロジ |
半導体集積回路
|
|
JP2003007843A
(ja)
|
2001-06-20 |
2003-01-10 |
Toshiba Corp |
半導体装置
|
|
US7667268B2
(en)
|
2002-08-14 |
2010-02-23 |
Advanced Analogic Technologies, Inc. |
Isolated transistor
|
|
US7719054B2
(en)
|
2006-05-31 |
2010-05-18 |
Advanced Analogic Technologies, Inc. |
High-voltage lateral DMOS device
|
|
US6882023B2
(en)
|
2002-10-31 |
2005-04-19 |
Motorola, Inc. |
Floating resurf LDMOSFET and method of manufacturing same
|
|
US7635621B2
(en)
|
2002-11-22 |
2009-12-22 |
Micrel, Inc. |
Lateral double-diffused metal oxide semiconductor (LDMOS) device with an enhanced drift region that has an improved Ron area product
|
|
JP2005093775A
(ja)
*
|
2003-09-18 |
2005-04-07 |
Fuji Electric Device Technology Co Ltd |
半導体装置およびその製造方法
|
|
US7329922B2
(en)
|
2004-11-30 |
2008-02-12 |
Agere Systems Inc. |
Dual-gate metal-oxide semiconductor device
|
|
KR100669597B1
(ko)
|
2004-12-30 |
2007-01-15 |
동부일렉트로닉스 주식회사 |
균일한 채널 농도 분포를 갖는 수평형 디모스 트랜지스터
|
|
US7466006B2
(en)
|
2005-05-19 |
2008-12-16 |
Freescale Semiconductor, Inc. |
Structure and method for RESURF diodes with a current diverter
|
|
US7535057B2
(en)
|
2005-05-24 |
2009-05-19 |
Robert Kuo-Chang Yang |
DMOS transistor with a poly-filled deep trench for improved performance
|
|
US8692324B2
(en)
|
2005-07-13 |
2014-04-08 |
Ciclon Semiconductor Device Corp. |
Semiconductor devices having charge balanced structure
|
|
US7282765B2
(en)
|
2005-07-13 |
2007-10-16 |
Ciclon Semiconductor Device Corp. |
Power LDMOS transistor
|
|
JP2007049039A
(ja)
|
2005-08-11 |
2007-02-22 |
Toshiba Corp |
半導体装置
|
|
US7511319B2
(en)
|
2006-02-24 |
2009-03-31 |
Freescale Semiconductor, Inc. |
Methods and apparatus for a stepped-drift MOSFET
|
|
CN200969352Y
(zh)
|
2006-04-24 |
2007-10-31 |
Bcd半导体制造有限公司 |
横向dmos结构
|
|
KR100859486B1
(ko)
|
2006-09-18 |
2008-09-24 |
동부일렉트로닉스 주식회사 |
고전압용 정전기 방전 보호 소자 및 그 제조 방법
|
|
US7476591B2
(en)
|
2006-10-13 |
2009-01-13 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Lateral power MOSFET with high breakdown voltage and low on-resistance
|
|
US20090020813A1
(en)
|
2007-07-16 |
2009-01-22 |
Steven Howard Voldman |
Formation of lateral trench fets (field effect transistors) using steps of ldmos (lateral double-diffused metal oxide semiconductor) technology
|
|
US7977715B2
(en)
|
2008-03-17 |
2011-07-12 |
Fairchild Semiconductor Corporation |
LDMOS devices with improved architectures
|
|
JP2010010408A
(ja)
*
|
2008-06-27 |
2010-01-14 |
Sanyo Electric Co Ltd |
半導体装置及びその製造方法
|
|
US8029611B2
(en)
|
2008-07-03 |
2011-10-04 |
Silverbrook Research Pty Ltd |
Inkjet dyes exhibiting reduced kogation
|
|
US8350327B2
(en)
|
2008-08-29 |
2013-01-08 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High voltage device with reduced leakage
|
|
US8159029B2
(en)
|
2008-10-22 |
2012-04-17 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High voltage device having reduced on-state resistance
|
|
KR101561059B1
(ko)
|
2008-11-20 |
2015-10-16 |
삼성전자주식회사 |
반도체 소자 및 그 제조 방법
|
|
US8138049B2
(en)
|
2009-05-29 |
2012-03-20 |
Silergy Technology |
Fabrication of lateral double-diffused metal oxide semiconductor (LDMOS) devices
|
|
US8269275B2
(en)
|
2009-10-21 |
2012-09-18 |
Broadcom Corporation |
Method for fabricating a MOS transistor with reduced channel length variation and related structure
|
|
US8193585B2
(en)
|
2009-10-29 |
2012-06-05 |
Freescale Semiconductor, Inc. |
Semiconductor device with increased snapback voltage
|
|
US8362557B2
(en)
|
2009-12-02 |
2013-01-29 |
Fairchild Semiconductor Corporation |
Stepped-source LDMOS architecture
|
|
US8304831B2
(en)
|
2010-02-08 |
2012-11-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus of forming a gate
|
|
US8247869B2
(en)
|
2010-04-26 |
2012-08-21 |
Freescale Semiconductor, Inc. |
LDMOS transistors with a split gate
|
|
US8330220B2
(en)
|
2010-04-29 |
2012-12-11 |
Freescale Semiconductor, Inc. |
LDMOS with enhanced safe operating area (SOA) and method therefor
|
|
US8525261B2
(en)
*
|
2010-11-23 |
2013-09-03 |
Macronix International Co., Ltd. |
Semiconductor device having a split gate and a super-junction structure
|
|
JP5715804B2
(ja)
|
2010-11-24 |
2015-05-13 |
セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー |
半導体装置及びその製造方法
|
|
US9123807B2
(en)
|
2010-12-28 |
2015-09-01 |
Broadcom Corporation |
Reduction of parasitic capacitance in a semiconductor device
|
|
US8575692B2
(en)
|
2011-02-11 |
2013-11-05 |
Freescale Semiconductor, Inc. |
Near zero channel length field drift LDMOS
|
|
TWI408811B
(zh)
*
|
2011-02-25 |
2013-09-11 |
Richtek Technology Corp |
高壓元件及其製造方法
|
|
US8716791B1
(en)
|
2011-08-11 |
2014-05-06 |
Maxim Integrated Products, Inc. |
LDMOS with corrugated drift region
|
|
DE102011087845B4
(de)
|
2011-12-06 |
2015-07-02 |
Infineon Technologies Ag |
Laterales transistorbauelement und verfahren zu dessen herstellung
|
|
US8853780B2
(en)
|
2012-05-07 |
2014-10-07 |
Freescale Semiconductor, Inc. |
Semiconductor device with drain-end drift diminution
|
|
US9490322B2
(en)
|
2013-01-23 |
2016-11-08 |
Freescale Semiconductor, Inc. |
Semiconductor device with enhanced 3D resurf
|
|
US20140264588A1
(en)
|
2013-03-14 |
2014-09-18 |
Taiwan Semiconductor Manufacturing Co. Ltd. |
Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) with Step Oxide
|