JP2014124701A - 負圧生成装置 - Google Patents
負圧生成装置 Download PDFInfo
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- JP2014124701A JP2014124701A JP2012281825A JP2012281825A JP2014124701A JP 2014124701 A JP2014124701 A JP 2014124701A JP 2012281825 A JP2012281825 A JP 2012281825A JP 2012281825 A JP2012281825 A JP 2012281825A JP 2014124701 A JP2014124701 A JP 2014124701A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 122
- 239000007788 liquid Substances 0.000 claims abstract description 113
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000002699 waste material Substances 0.000 claims description 77
- 238000003754 machining Methods 0.000 claims description 39
- 239000012530 fluid Substances 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 12
- 239000000428 dust Substances 0.000 abstract 4
- 238000003860 storage Methods 0.000 description 32
- 239000000203 mixture Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 28
- 238000012423 maintenance Methods 0.000 description 17
- 238000001514 detection method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 101000911772 Homo sapiens Hsc70-interacting protein Proteins 0.000 description 1
- 101001139126 Homo sapiens Krueppel-like factor 6 Proteins 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C19/00—Rotary-piston pumps with fluid ring or the like, specially adapted for elastic fluids
Abstract
【解決手段】負圧生成装置1は、水封式バキュームポンプ10と、被加工物Wに加工液Lを供給しながら研削又は切削する加工手段101を備える加工装置100のチャックテーブル102に吸引力を作用せしめて前記チャックテーブル102を通じて空気と加工液Lとを吸引する吸引経路20と、水封式バキュームポンプ10の封水と吸引された加工液Lとの混合液L2を貯留する排水タンク30と、排水タンク30に貯留された混合液L2を水封式バキュームポンプ10に封水として供給する供給経路40と、排水タンク30から送出された混合液L2に含まれる加工屑を除去する加工屑除去手段50と、加工屑除去手段50から排出される加工屑が除去された処理水L3を排水タンク30に戻す戻り経路60と、を有する。
【選択図】図1
Description
図1は、実施形態に係る負圧生成装置の概略構成例を示す図である。図1に示す実施形態に係る負圧生成装置1は、被加工物Wに研削加工や切削加工を施す加工装置100において、加工手段101のチャックテーブル102に被加工物Wを吸引保持する吸引力を作用せしめる吸引源である。負圧生成装置1は、水封式バキュームポンプ10と、吸引経路20と、排水タンク30と、供給経路40と、加工屑除去手段50と、戻り経路60と、受水手段70と、排水手段80と、制御手段90と、を含んで構成されている。
10 水封式バキュームポンプ
11 吸引口
12 排出口
13 水供給口
16 排出経路
20 吸引経路
30 排水タンク
40 供給経路
50 加工屑除去手段
51 送出経路
60 戻り経路
100 加工装置
101 加工手段
102 チャックテーブル
L 加工液
L2、L4 混合液
L3 処理水
W 被加工物
Claims (1)
- 被加工物を保持するチャックテーブルと、前記チャックテーブルに保持された前記被加工物に加工液を供給しながら研削又は切削する加工手段と、を備える加工装置の前記チャックテーブルに吸引力を作用せしめる負圧生成装置であって、
吸引口と排出口と水供給口とを有する水封式バキュームポンプと、
前記吸引口と前記チャックテーブルとを連通し前記チャックテーブルを通じて空気と、前記被加工物から加工によって発生した加工屑を含む前記加工液とを吸引する吸引経路と、
前記排出口と排出経路を介して連通し、前記排出口から排出される前記水封式バキュームポンプの封水と吸引された前記加工液との混合液を貯留する排水タンクと、
前記排水タンクと前記水供給口と連通し前記排水タンクに貯留された前記混合液を前記水封式バキュームポンプに封水として供給する供給経路と、
前記排水タンクと送出経路を介して連通し、前記排水タンクから送出された前記混合液に含まれる前記加工屑を除去する加工屑除去手段と、
前記加工屑除去手段から排出される前記加工屑が除去された処理水を前記排水タンクに戻す戻り経路と、を有する負圧生成装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012281825A JP6132547B2 (ja) | 2012-12-25 | 2012-12-25 | 負圧生成装置 |
KR1020130142729A KR102062405B1 (ko) | 2012-12-25 | 2013-11-22 | 부압 생성 장치 |
CN201310718850.0A CN103894924A (zh) | 2012-12-25 | 2013-12-24 | 负压生成装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012281825A JP6132547B2 (ja) | 2012-12-25 | 2012-12-25 | 負圧生成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014124701A true JP2014124701A (ja) | 2014-07-07 |
JP6132547B2 JP6132547B2 (ja) | 2017-05-24 |
Family
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JP2012281825A Active JP6132547B2 (ja) | 2012-12-25 | 2012-12-25 | 負圧生成装置 |
Country Status (3)
Country | Link |
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JP (1) | JP6132547B2 (ja) |
KR (1) | KR102062405B1 (ja) |
CN (1) | CN103894924A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108296935A (zh) * | 2017-01-11 | 2018-07-20 | 株式会社迪思科 | 卡盘工作台和磨削装置 |
JP2021020274A (ja) * | 2019-07-26 | 2021-02-18 | 株式会社ディスコ | 廃液処理装置 |
KR20230174166A (ko) | 2022-06-20 | 2023-12-27 | 가부시기가이샤 디스코 | 가공 장치 유닛 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6340277B2 (ja) * | 2014-07-18 | 2018-06-06 | 株式会社ディスコ | 加工装置 |
JP6486770B2 (ja) * | 2015-05-20 | 2019-03-20 | 株式会社ディスコ | 切削装置 |
JP6844970B2 (ja) * | 2016-08-18 | 2021-03-17 | 株式会社ディスコ | 研磨装置 |
CN106334967B (zh) * | 2016-10-12 | 2019-01-04 | 广东长盈精密技术有限公司 | 真空回油系统 |
CN106392754B (zh) * | 2016-11-15 | 2019-07-09 | 广东长盈精密技术有限公司 | 一种机床的溶液回收装置以及机床 |
CN106914640B (zh) * | 2017-02-07 | 2019-01-11 | 江西理工大学应用科学学院 | 智能钢管钻孔装置 |
CN109676515B (zh) * | 2018-12-26 | 2020-09-11 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
CN112091452B (zh) * | 2020-10-21 | 2021-06-01 | 淄博水环真空泵厂有限公司 | 特大型高压水环真空泵异形内壁衬套及其加工装配方法 |
Citations (7)
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JPS6283086A (ja) * | 1985-10-07 | 1987-04-16 | Nec Kyushu Ltd | 研削排水回収装置 |
US6015487A (en) * | 1997-04-19 | 2000-01-18 | Yamaha Hatsudoki Kabushiki Kaisha | Coolant purification system |
JP2002144181A (ja) * | 2000-11-10 | 2002-05-21 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
JP2002151449A (ja) * | 2000-11-10 | 2002-05-24 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
US20090042368A1 (en) * | 2007-08-09 | 2009-02-12 | Disco Corporation | Wafer processing method |
JP2009135174A (ja) * | 2007-11-29 | 2009-06-18 | Sumco Corp | 研磨装置とその方法、及び研磨液再生装置とその方法 |
JP2012020365A (ja) * | 2010-07-14 | 2012-02-02 | Tomoe Engineering Co Ltd | クーラント回収システム |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2218627Y (zh) * | 1994-10-19 | 1996-01-31 | 张允清 | 真空吸盘式多孔码片机 |
JP4851282B2 (ja) | 2006-09-21 | 2012-01-11 | 株式会社ディスコ | 切削装置 |
JP2009095941A (ja) * | 2007-10-17 | 2009-05-07 | Disco Abrasive Syst Ltd | 加工廃液処理装置 |
CN101138908A (zh) * | 2007-10-24 | 2008-03-12 | 北大方正集团有限公司 | 一种负压生成装置、方法及喷墨印刷机 |
CN102615589B (zh) * | 2012-04-12 | 2014-09-24 | 浙江金瑞泓科技股份有限公司 | 一种使用抛光盘接引盘的抛光系统和方法 |
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2012
- 2012-12-25 JP JP2012281825A patent/JP6132547B2/ja active Active
-
2013
- 2013-11-22 KR KR1020130142729A patent/KR102062405B1/ko active IP Right Grant
- 2013-12-24 CN CN201310718850.0A patent/CN103894924A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283086A (ja) * | 1985-10-07 | 1987-04-16 | Nec Kyushu Ltd | 研削排水回収装置 |
US6015487A (en) * | 1997-04-19 | 2000-01-18 | Yamaha Hatsudoki Kabushiki Kaisha | Coolant purification system |
JP2002144181A (ja) * | 2000-11-10 | 2002-05-21 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
JP2002151449A (ja) * | 2000-11-10 | 2002-05-24 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
US20090042368A1 (en) * | 2007-08-09 | 2009-02-12 | Disco Corporation | Wafer processing method |
JP2009135174A (ja) * | 2007-11-29 | 2009-06-18 | Sumco Corp | 研磨装置とその方法、及び研磨液再生装置とその方法 |
JP2012020365A (ja) * | 2010-07-14 | 2012-02-02 | Tomoe Engineering Co Ltd | クーラント回収システム |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108296935A (zh) * | 2017-01-11 | 2018-07-20 | 株式会社迪思科 | 卡盘工作台和磨削装置 |
JP2021020274A (ja) * | 2019-07-26 | 2021-02-18 | 株式会社ディスコ | 廃液処理装置 |
JP7339049B2 (ja) | 2019-07-26 | 2023-09-05 | 株式会社ディスコ | 廃液処理装置 |
KR20230174166A (ko) | 2022-06-20 | 2023-12-27 | 가부시기가이샤 디스코 | 가공 장치 유닛 |
Also Published As
Publication number | Publication date |
---|---|
KR20140082919A (ko) | 2014-07-03 |
JP6132547B2 (ja) | 2017-05-24 |
KR102062405B1 (ko) | 2020-01-03 |
CN103894924A (zh) | 2014-07-02 |
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