CN103894924A - 负压生成装置 - Google Patents
负压生成装置 Download PDFInfo
- Publication number
- CN103894924A CN103894924A CN201310718850.0A CN201310718850A CN103894924A CN 103894924 A CN103894924 A CN 103894924A CN 201310718850 A CN201310718850 A CN 201310718850A CN 103894924 A CN103894924 A CN 103894924A
- Authority
- CN
- China
- Prior art keywords
- water
- processing
- path
- discharge casing
- mixed liquor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C19/00—Rotary-piston pumps with fluid ring or the like, specially adapted for elastic fluids
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Rotary Pumps (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-281825 | 2012-12-25 | ||
JP2012281825A JP6132547B2 (ja) | 2012-12-25 | 2012-12-25 | 負圧生成装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103894924A true CN103894924A (zh) | 2014-07-02 |
Family
ID=50986665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310718850.0A Pending CN103894924A (zh) | 2012-12-25 | 2013-12-24 | 负压生成装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6132547B2 (ja) |
KR (1) | KR102062405B1 (ja) |
CN (1) | CN103894924A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269705A (zh) * | 2014-07-18 | 2016-01-27 | 株式会社迪思科 | 加工装置 |
CN106166692A (zh) * | 2015-05-20 | 2016-11-30 | 株式会社迪思科 | 切削装置 |
CN106334967A (zh) * | 2016-10-12 | 2017-01-18 | 广东长盈精密技术有限公司 | 真空回油系统 |
CN106392754A (zh) * | 2016-11-15 | 2017-02-15 | 广东长盈精密技术有限公司 | 一种机床的溶液回收装置以及机床 |
CN106914640A (zh) * | 2017-02-07 | 2017-07-04 | 江西理工大学应用科学学院 | 智能钢管钻孔装置 |
CN107756238A (zh) * | 2016-08-18 | 2018-03-06 | 株式会社迪思科 | 研磨装置 |
CN109676515A (zh) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6920063B2 (ja) * | 2017-01-11 | 2021-08-18 | 株式会社ディスコ | 板状ワークの保持方法 |
JP7339049B2 (ja) * | 2019-07-26 | 2023-09-05 | 株式会社ディスコ | 廃液処理装置 |
CN112091452B (zh) * | 2020-10-21 | 2021-06-01 | 淄博水环真空泵厂有限公司 | 特大型高压水环真空泵异形内壁衬套及其加工装配方法 |
JP2024000232A (ja) | 2022-06-20 | 2024-01-05 | 株式会社ディスコ | 加工装置ユニット |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283086A (ja) * | 1985-10-07 | 1987-04-16 | Nec Kyushu Ltd | 研削排水回収装置 |
CN2218627Y (zh) * | 1994-10-19 | 1996-01-31 | 张允清 | 真空吸盘式多孔码片机 |
JP2002144181A (ja) * | 2000-11-10 | 2002-05-21 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
CN101138908A (zh) * | 2007-10-24 | 2008-03-12 | 北大方正集团有限公司 | 一种负压生成装置、方法及喷墨印刷机 |
US20090042368A1 (en) * | 2007-08-09 | 2009-02-12 | Disco Corporation | Wafer processing method |
CN101412194A (zh) * | 2007-10-17 | 2009-04-22 | 株式会社迪思科 | 加工废液处理装置 |
JP2009135174A (ja) * | 2007-11-29 | 2009-06-18 | Sumco Corp | 研磨装置とその方法、及び研磨液再生装置とその方法 |
JP2012020365A (ja) * | 2010-07-14 | 2012-02-02 | Tomoe Engineering Co Ltd | クーラント回収システム |
CN102615589A (zh) * | 2012-04-12 | 2012-08-01 | 浙江金瑞泓科技股份有限公司 | 一种使用抛光盘接引盘的抛光系统和方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3149079B2 (ja) * | 1997-04-25 | 2001-03-26 | ヤマハ発動機株式会社 | 加工液の浄化装置 |
JP2002151449A (ja) * | 2000-11-10 | 2002-05-24 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
JP4851282B2 (ja) | 2006-09-21 | 2012-01-11 | 株式会社ディスコ | 切削装置 |
-
2012
- 2012-12-25 JP JP2012281825A patent/JP6132547B2/ja active Active
-
2013
- 2013-11-22 KR KR1020130142729A patent/KR102062405B1/ko active IP Right Grant
- 2013-12-24 CN CN201310718850.0A patent/CN103894924A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283086A (ja) * | 1985-10-07 | 1987-04-16 | Nec Kyushu Ltd | 研削排水回収装置 |
CN2218627Y (zh) * | 1994-10-19 | 1996-01-31 | 张允清 | 真空吸盘式多孔码片机 |
JP2002144181A (ja) * | 2000-11-10 | 2002-05-21 | Disco Abrasive Syst Ltd | 加工装置のバキューム生成機構 |
US20090042368A1 (en) * | 2007-08-09 | 2009-02-12 | Disco Corporation | Wafer processing method |
CN101412194A (zh) * | 2007-10-17 | 2009-04-22 | 株式会社迪思科 | 加工废液处理装置 |
CN101138908A (zh) * | 2007-10-24 | 2008-03-12 | 北大方正集团有限公司 | 一种负压生成装置、方法及喷墨印刷机 |
JP2009135174A (ja) * | 2007-11-29 | 2009-06-18 | Sumco Corp | 研磨装置とその方法、及び研磨液再生装置とその方法 |
JP2012020365A (ja) * | 2010-07-14 | 2012-02-02 | Tomoe Engineering Co Ltd | クーラント回収システム |
CN102615589A (zh) * | 2012-04-12 | 2012-08-01 | 浙江金瑞泓科技股份有限公司 | 一种使用抛光盘接引盘的抛光系统和方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269705A (zh) * | 2014-07-18 | 2016-01-27 | 株式会社迪思科 | 加工装置 |
CN105269705B (zh) * | 2014-07-18 | 2019-11-29 | 株式会社迪思科 | 加工装置 |
CN106166692A (zh) * | 2015-05-20 | 2016-11-30 | 株式会社迪思科 | 切削装置 |
CN107756238A (zh) * | 2016-08-18 | 2018-03-06 | 株式会社迪思科 | 研磨装置 |
CN107756238B (zh) * | 2016-08-18 | 2021-03-26 | 株式会社迪思科 | 研磨装置 |
CN106334967A (zh) * | 2016-10-12 | 2017-01-18 | 广东长盈精密技术有限公司 | 真空回油系统 |
CN106334967B (zh) * | 2016-10-12 | 2019-01-04 | 广东长盈精密技术有限公司 | 真空回油系统 |
CN106392754A (zh) * | 2016-11-15 | 2017-02-15 | 广东长盈精密技术有限公司 | 一种机床的溶液回收装置以及机床 |
CN106392754B (zh) * | 2016-11-15 | 2019-07-09 | 广东长盈精密技术有限公司 | 一种机床的溶液回收装置以及机床 |
CN106914640A (zh) * | 2017-02-07 | 2017-07-04 | 江西理工大学应用科学学院 | 智能钢管钻孔装置 |
CN109676515A (zh) * | 2018-12-26 | 2019-04-26 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
CN109676515B (zh) * | 2018-12-26 | 2020-09-11 | 江苏纳沛斯半导体有限公司 | 一种带清洗功能的半导体晶圆研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20140082919A (ko) | 2014-07-03 |
JP6132547B2 (ja) | 2017-05-24 |
JP2014124701A (ja) | 2014-07-07 |
KR102062405B1 (ko) | 2020-01-03 |
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Legal Events
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---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140702 |