CN103894924A - 负压生成装置 - Google Patents

负压生成装置 Download PDF

Info

Publication number
CN103894924A
CN103894924A CN201310718850.0A CN201310718850A CN103894924A CN 103894924 A CN103894924 A CN 103894924A CN 201310718850 A CN201310718850 A CN 201310718850A CN 103894924 A CN103894924 A CN 103894924A
Authority
CN
China
Prior art keywords
water
processing
path
discharge casing
mixed liquor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310718850.0A
Other languages
English (en)
Chinese (zh)
Inventor
石黑裕隆
藤田敦史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN103894924A publication Critical patent/CN103894924A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042Devices for removing chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C19/00Rotary-piston pumps with fluid ring or the like, specially adapted for elastic fluids

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Rotary Pumps (AREA)
CN201310718850.0A 2012-12-25 2013-12-24 负压生成装置 Pending CN103894924A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-281825 2012-12-25
JP2012281825A JP6132547B2 (ja) 2012-12-25 2012-12-25 負圧生成装置

Publications (1)

Publication Number Publication Date
CN103894924A true CN103894924A (zh) 2014-07-02

Family

ID=50986665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310718850.0A Pending CN103894924A (zh) 2012-12-25 2013-12-24 负压生成装置

Country Status (3)

Country Link
JP (1) JP6132547B2 (ja)
KR (1) KR102062405B1 (ja)
CN (1) CN103894924A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269705A (zh) * 2014-07-18 2016-01-27 株式会社迪思科 加工装置
CN106166692A (zh) * 2015-05-20 2016-11-30 株式会社迪思科 切削装置
CN106334967A (zh) * 2016-10-12 2017-01-18 广东长盈精密技术有限公司 真空回油系统
CN106392754A (zh) * 2016-11-15 2017-02-15 广东长盈精密技术有限公司 一种机床的溶液回收装置以及机床
CN106914640A (zh) * 2017-02-07 2017-07-04 江西理工大学应用科学学院 智能钢管钻孔装置
CN107756238A (zh) * 2016-08-18 2018-03-06 株式会社迪思科 研磨装置
CN109676515A (zh) * 2018-12-26 2019-04-26 江苏纳沛斯半导体有限公司 一种带清洗功能的半导体晶圆研磨装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920063B2 (ja) * 2017-01-11 2021-08-18 株式会社ディスコ 板状ワークの保持方法
JP7339049B2 (ja) * 2019-07-26 2023-09-05 株式会社ディスコ 廃液処理装置
CN112091452B (zh) * 2020-10-21 2021-06-01 淄博水环真空泵厂有限公司 特大型高压水环真空泵异形内壁衬套及其加工装配方法
JP2024000232A (ja) 2022-06-20 2024-01-05 株式会社ディスコ 加工装置ユニット

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6283086A (ja) * 1985-10-07 1987-04-16 Nec Kyushu Ltd 研削排水回収装置
CN2218627Y (zh) * 1994-10-19 1996-01-31 张允清 真空吸盘式多孔码片机
JP2002144181A (ja) * 2000-11-10 2002-05-21 Disco Abrasive Syst Ltd 加工装置のバキューム生成機構
CN101138908A (zh) * 2007-10-24 2008-03-12 北大方正集团有限公司 一种负压生成装置、方法及喷墨印刷机
US20090042368A1 (en) * 2007-08-09 2009-02-12 Disco Corporation Wafer processing method
CN101412194A (zh) * 2007-10-17 2009-04-22 株式会社迪思科 加工废液处理装置
JP2009135174A (ja) * 2007-11-29 2009-06-18 Sumco Corp 研磨装置とその方法、及び研磨液再生装置とその方法
JP2012020365A (ja) * 2010-07-14 2012-02-02 Tomoe Engineering Co Ltd クーラント回収システム
CN102615589A (zh) * 2012-04-12 2012-08-01 浙江金瑞泓科技股份有限公司 一种使用抛光盘接引盘的抛光系统和方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3149079B2 (ja) * 1997-04-25 2001-03-26 ヤマハ発動機株式会社 加工液の浄化装置
JP2002151449A (ja) * 2000-11-10 2002-05-24 Disco Abrasive Syst Ltd 加工装置のバキューム生成機構
JP4851282B2 (ja) 2006-09-21 2012-01-11 株式会社ディスコ 切削装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6283086A (ja) * 1985-10-07 1987-04-16 Nec Kyushu Ltd 研削排水回収装置
CN2218627Y (zh) * 1994-10-19 1996-01-31 张允清 真空吸盘式多孔码片机
JP2002144181A (ja) * 2000-11-10 2002-05-21 Disco Abrasive Syst Ltd 加工装置のバキューム生成機構
US20090042368A1 (en) * 2007-08-09 2009-02-12 Disco Corporation Wafer processing method
CN101412194A (zh) * 2007-10-17 2009-04-22 株式会社迪思科 加工废液处理装置
CN101138908A (zh) * 2007-10-24 2008-03-12 北大方正集团有限公司 一种负压生成装置、方法及喷墨印刷机
JP2009135174A (ja) * 2007-11-29 2009-06-18 Sumco Corp 研磨装置とその方法、及び研磨液再生装置とその方法
JP2012020365A (ja) * 2010-07-14 2012-02-02 Tomoe Engineering Co Ltd クーラント回収システム
CN102615589A (zh) * 2012-04-12 2012-08-01 浙江金瑞泓科技股份有限公司 一种使用抛光盘接引盘的抛光系统和方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269705A (zh) * 2014-07-18 2016-01-27 株式会社迪思科 加工装置
CN105269705B (zh) * 2014-07-18 2019-11-29 株式会社迪思科 加工装置
CN106166692A (zh) * 2015-05-20 2016-11-30 株式会社迪思科 切削装置
CN107756238A (zh) * 2016-08-18 2018-03-06 株式会社迪思科 研磨装置
CN107756238B (zh) * 2016-08-18 2021-03-26 株式会社迪思科 研磨装置
CN106334967A (zh) * 2016-10-12 2017-01-18 广东长盈精密技术有限公司 真空回油系统
CN106334967B (zh) * 2016-10-12 2019-01-04 广东长盈精密技术有限公司 真空回油系统
CN106392754A (zh) * 2016-11-15 2017-02-15 广东长盈精密技术有限公司 一种机床的溶液回收装置以及机床
CN106392754B (zh) * 2016-11-15 2019-07-09 广东长盈精密技术有限公司 一种机床的溶液回收装置以及机床
CN106914640A (zh) * 2017-02-07 2017-07-04 江西理工大学应用科学学院 智能钢管钻孔装置
CN109676515A (zh) * 2018-12-26 2019-04-26 江苏纳沛斯半导体有限公司 一种带清洗功能的半导体晶圆研磨装置
CN109676515B (zh) * 2018-12-26 2020-09-11 江苏纳沛斯半导体有限公司 一种带清洗功能的半导体晶圆研磨装置

Also Published As

Publication number Publication date
KR20140082919A (ko) 2014-07-03
JP6132547B2 (ja) 2017-05-24
JP2014124701A (ja) 2014-07-07
KR102062405B1 (ko) 2020-01-03

Similar Documents

Publication Publication Date Title
CN103894924A (zh) 负压生成装置
TWI231770B (en) Method for removing foreign matter from a fluid flow
US6746309B2 (en) Method of fabricating a semiconductor device
US6428709B1 (en) Method of filtering a fluid
US6332924B1 (en) Photoresist dispensing device
TWI422457B (zh) Processing waste liquid treatment device
US6299513B1 (en) Method of fabricating a semiconductor device
TWI829849B (zh) 廢液處理裝置
US9975274B2 (en) Processing apparatus
EP1055446B1 (en) Method of fabricating a semiconductor device with process liquid recycling
CN104626376A (zh) 切削装置
CN102001044B (zh) 化学机械抛光的研磨液供给系统
JP3993419B2 (ja) 被加工物の保持装置
JP5266006B2 (ja) 加工廃液処理装置のフィルターユニット
JP2016043421A (ja) 流体吸引装置
US20110180493A1 (en) Device and method for processing a cooling and rinsing liquid
CN201609869U (zh) 化学机械抛光浆液环路系统
KR102580973B1 (ko) 바이트 절삭 장치
JP6408316B2 (ja) 加工装置
CN110293481B (zh) 一种研磨设备和研磨设备的清洁方法
KR20220164428A (ko) 세정 장치
JP4540395B2 (ja) 濾過装置
JP4485888B2 (ja) 高圧液噴射式切断装置
JP2022105895A (ja) 制御装置
JP2024011635A (ja) 気液分離装置と加工装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140702