JP2014085295A5 - - Google Patents
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- Publication number
- JP2014085295A5 JP2014085295A5 JP2012236483A JP2012236483A JP2014085295A5 JP 2014085295 A5 JP2014085295 A5 JP 2014085295A5 JP 2012236483 A JP2012236483 A JP 2012236483A JP 2012236483 A JP2012236483 A JP 2012236483A JP 2014085295 A5 JP2014085295 A5 JP 2014085295A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- wafer
- measuring apparatus
- shape measuring
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005286 illumination Methods 0.000 claims description 11
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012236483A JP6017263B2 (ja) | 2012-10-26 | 2012-10-26 | ウェーハの形状測定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012236483A JP6017263B2 (ja) | 2012-10-26 | 2012-10-26 | ウェーハの形状測定装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016024994A Division JP6016150B2 (ja) | 2016-02-12 | 2016-02-12 | 研削スリップ条痕観察装置及び研削スリップ条痕観察方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014085295A JP2014085295A (ja) | 2014-05-12 |
| JP2014085295A5 true JP2014085295A5 (enExample) | 2015-07-23 |
| JP6017263B2 JP6017263B2 (ja) | 2016-10-26 |
Family
ID=50788470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012236483A Active JP6017263B2 (ja) | 2012-10-26 | 2012-10-26 | ウェーハの形状測定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6017263B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411378B (zh) * | 2019-08-06 | 2021-02-09 | 杭州众硅电子科技有限公司 | 一种晶圆检测装置及其检测方法 |
| CN110608686B (zh) * | 2019-10-31 | 2021-03-26 | 大连理工大学 | 一种有倒角零件的视觉测量方法和装置 |
| JP2021143990A (ja) * | 2020-03-13 | 2021-09-24 | 株式会社東京精密 | 検査装置及び加工装置 |
| JP7537893B2 (ja) * | 2020-03-24 | 2024-08-21 | 株式会社東京精密 | エッジ部のチッピング検出装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3338080B2 (ja) * | 1992-06-02 | 2002-10-28 | 株式会社神戸製鋼所 | ディスク外周部検査装置 |
| JP3282786B2 (ja) * | 1996-07-29 | 2002-05-20 | 東芝セラミックス株式会社 | ウエハの形状認識装置 |
| JP2001004341A (ja) * | 1999-06-16 | 2001-01-12 | Toshiba Ceramics Co Ltd | ウェーハ形状測定装置 |
| JP3629244B2 (ja) * | 2002-02-19 | 2005-03-16 | 本多エレクトロン株式会社 | ウエーハ用検査装置 |
| JP4441823B2 (ja) * | 2003-11-26 | 2010-03-31 | 株式会社東京精密 | 面取り砥石のツルーイング方法及び面取り装置 |
| JP2005268530A (ja) * | 2004-03-18 | 2005-09-29 | Olympus Corp | 半導体ウエハのアライメント装置 |
| JP2007303853A (ja) * | 2006-05-09 | 2007-11-22 | Nikon Corp | 端部検査装置 |
| JP2008014697A (ja) * | 2006-07-04 | 2008-01-24 | Nikon Corp | 表面検査装置 |
| JP2009020038A (ja) * | 2007-07-13 | 2009-01-29 | Nikon Corp | 欠陥検査装置 |
| JP2009267306A (ja) * | 2008-04-30 | 2009-11-12 | Nikon Corp | 検査装置 |
| JP2010181249A (ja) * | 2009-02-05 | 2010-08-19 | Kobelco Kaken:Kk | 形状測定装置 |
| JP2011145171A (ja) * | 2010-01-14 | 2011-07-28 | Nikon Corp | 形状検出装置 |
| JP2011196897A (ja) * | 2010-03-23 | 2011-10-06 | Nikon Corp | 検査装置 |
-
2012
- 2012-10-26 JP JP2012236483A patent/JP6017263B2/ja active Active
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