JP6017263B2 - ウェーハの形状測定装置 - Google Patents

ウェーハの形状測定装置 Download PDF

Info

Publication number
JP6017263B2
JP6017263B2 JP2012236483A JP2012236483A JP6017263B2 JP 6017263 B2 JP6017263 B2 JP 6017263B2 JP 2012236483 A JP2012236483 A JP 2012236483A JP 2012236483 A JP2012236483 A JP 2012236483A JP 6017263 B2 JP6017263 B2 JP 6017263B2
Authority
JP
Japan
Prior art keywords
wafer
light
notch
notch portion
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012236483A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014085295A5 (enExample
JP2014085295A (ja
Inventor
勇一 平山
勇一 平山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2012236483A priority Critical patent/JP6017263B2/ja
Publication of JP2014085295A publication Critical patent/JP2014085295A/ja
Publication of JP2014085295A5 publication Critical patent/JP2014085295A5/ja
Application granted granted Critical
Publication of JP6017263B2 publication Critical patent/JP6017263B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012236483A 2012-10-26 2012-10-26 ウェーハの形状測定装置 Active JP6017263B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012236483A JP6017263B2 (ja) 2012-10-26 2012-10-26 ウェーハの形状測定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012236483A JP6017263B2 (ja) 2012-10-26 2012-10-26 ウェーハの形状測定装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016024994A Division JP6016150B2 (ja) 2016-02-12 2016-02-12 研削スリップ条痕観察装置及び研削スリップ条痕観察方法

Publications (3)

Publication Number Publication Date
JP2014085295A JP2014085295A (ja) 2014-05-12
JP2014085295A5 JP2014085295A5 (enExample) 2015-07-23
JP6017263B2 true JP6017263B2 (ja) 2016-10-26

Family

ID=50788470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012236483A Active JP6017263B2 (ja) 2012-10-26 2012-10-26 ウェーハの形状測定装置

Country Status (1)

Country Link
JP (1) JP6017263B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110411378B (zh) * 2019-08-06 2021-02-09 杭州众硅电子科技有限公司 一种晶圆检测装置及其检测方法
CN110608686B (zh) * 2019-10-31 2021-03-26 大连理工大学 一种有倒角零件的视觉测量方法和装置
JP2021143990A (ja) * 2020-03-13 2021-09-24 株式会社東京精密 検査装置及び加工装置
JP7537893B2 (ja) * 2020-03-24 2024-08-21 株式会社東京精密 エッジ部のチッピング検出装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3338080B2 (ja) * 1992-06-02 2002-10-28 株式会社神戸製鋼所 ディスク外周部検査装置
JP3282786B2 (ja) * 1996-07-29 2002-05-20 東芝セラミックス株式会社 ウエハの形状認識装置
JP2001004341A (ja) * 1999-06-16 2001-01-12 Toshiba Ceramics Co Ltd ウェーハ形状測定装置
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP4441823B2 (ja) * 2003-11-26 2010-03-31 株式会社東京精密 面取り砥石のツルーイング方法及び面取り装置
JP2005268530A (ja) * 2004-03-18 2005-09-29 Olympus Corp 半導体ウエハのアライメント装置
JP2007303853A (ja) * 2006-05-09 2007-11-22 Nikon Corp 端部検査装置
JP2008014697A (ja) * 2006-07-04 2008-01-24 Nikon Corp 表面検査装置
JP2009020038A (ja) * 2007-07-13 2009-01-29 Nikon Corp 欠陥検査装置
JP2009267306A (ja) * 2008-04-30 2009-11-12 Nikon Corp 検査装置
JP2010181249A (ja) * 2009-02-05 2010-08-19 Kobelco Kaken:Kk 形状測定装置
JP2011145171A (ja) * 2010-01-14 2011-07-28 Nikon Corp 形状検出装置
JP2011196897A (ja) * 2010-03-23 2011-10-06 Nikon Corp 検査装置

Also Published As

Publication number Publication date
JP2014085295A (ja) 2014-05-12

Similar Documents

Publication Publication Date Title
TWI672739B (zh) 產品製造裝置和製造方法
JP6017263B2 (ja) ウェーハの形状測定装置
CN110293480A (zh) 磨削装置
CN101337400A (zh) 切削装置
JP6905357B2 (ja) ウエーハのうねり検出方法及び研削装置
CN108500842A (zh) 被加工物的检査方法、被加工物的检査装置和加工装置
JP6020869B2 (ja) ウェーハ形状測定装置及び方法、並びにウェーハ面取り装置
KR102867095B1 (ko) 중심 검출 방법
JP2007147433A (ja) セラミック板の欠陥検出方法と装置
JP6065343B2 (ja) エッジ検出装置
JP2017090080A (ja) 検査装置
JP6016150B2 (ja) 研削スリップ条痕観察装置及び研削スリップ条痕観察方法
TW202040676A (zh) 分割加工裝置
JP2014085296A (ja) ウェーハ形状測定装置
JP6283971B2 (ja) エッジ検出装置
JP7045167B2 (ja) 切削装置
JP7034797B2 (ja) 貼り合せ基板の測定方法および加工方法並びにそれらに用いる装置
KR102557511B1 (ko) 검사 장치
JP6817798B2 (ja) ウエーハの研削方法及び研削装置
JP5505790B2 (ja) ダイシング装置による検査方法
JP2014154708A (ja) ウエーハの割れ検出方法及びウエーハの割れ検出装置
JP6767849B2 (ja) ウエーハ加工装置及びウエーハの加工方法
JP2024144705A (ja) エッジ部のチッピング検出装置
JP2023083014A (ja) ウェーハの製造方法および研削装置
JP6989392B2 (ja) 板状物の加工方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150605

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150605

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150605

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150731

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150916

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20151111

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160212

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20160218

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20160318

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160928

R150 Certificate of patent or registration of utility model

Ref document number: 6017263

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250