JP2014072418A5 - - Google Patents
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- JP2014072418A5 JP2014072418A5 JP2012218000A JP2012218000A JP2014072418A5 JP 2014072418 A5 JP2014072418 A5 JP 2014072418A5 JP 2012218000 A JP2012218000 A JP 2012218000A JP 2012218000 A JP2012218000 A JP 2012218000A JP 2014072418 A5 JP2014072418 A5 JP 2014072418A5
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- JP
- Japan
- Prior art keywords
- electrode
- insulating film
- semiconductor
- semiconductor device
- connection region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012218000A JP6074985B2 (ja) | 2012-09-28 | 2012-09-28 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
| US14/017,816 US9093575B2 (en) | 2012-09-28 | 2013-09-04 | Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
| CN201310429001.3A CN103715175B (zh) | 2012-09-28 | 2013-09-18 | 半导体器件、半导体器件制造方法以及固体摄像装置 |
| CN201710447901.9A CN107275354B (zh) | 2012-09-28 | 2013-09-18 | 半导体器件 |
| US14/743,299 US9577005B2 (en) | 2012-09-28 | 2015-06-18 | Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
| US15/403,359 US9947710B2 (en) | 2012-09-28 | 2017-01-11 | Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
| US15/918,103 US10319775B2 (en) | 2012-09-28 | 2018-03-12 | Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
| US16/137,600 US10615214B2 (en) | 2012-09-28 | 2018-09-21 | Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
| US16/830,618 US10930697B2 (en) | 2012-09-28 | 2020-03-26 | Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012218000A JP6074985B2 (ja) | 2012-09-28 | 2012-09-28 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014072418A JP2014072418A (ja) | 2014-04-21 |
| JP2014072418A5 true JP2014072418A5 (enExample) | 2015-04-16 |
| JP6074985B2 JP6074985B2 (ja) | 2017-02-08 |
Family
ID=50384336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012218000A Expired - Fee Related JP6074985B2 (ja) | 2012-09-28 | 2012-09-28 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (6) | US9093575B2 (enExample) |
| JP (1) | JP6074985B2 (enExample) |
| CN (2) | CN107275354B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6074985B2 (ja) | 2012-09-28 | 2017-02-08 | ソニー株式会社 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
| JP2014194976A (ja) * | 2013-03-28 | 2014-10-09 | Nippon Hoso Kyokai <Nhk> | 設計装置、設計方法及びプログラム |
| KR101729378B1 (ko) * | 2014-05-30 | 2017-04-21 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스 및 반도체 디바이스 제조 방법 |
| WO2016073049A1 (en) * | 2014-08-11 | 2016-05-12 | Massachusetts Institute Of Technology | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure |
| JP6766808B2 (ja) * | 2015-05-18 | 2020-10-14 | ソニー株式会社 | 半導体装置および撮像装置 |
| KR102653044B1 (ko) * | 2015-09-01 | 2024-04-01 | 소니그룹주식회사 | 적층체 |
| US10020336B2 (en) | 2015-12-28 | 2018-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device using three dimentional (3D) integration |
| WO2017169480A1 (ja) | 2016-03-31 | 2017-10-05 | 株式会社ニコン | 撮像素子および撮像装置 |
| US10277227B2 (en) * | 2016-05-31 | 2019-04-30 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device layout |
| JP2018101699A (ja) * | 2016-12-20 | 2018-06-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、固体撮像装置の製造方法および電子機器 |
| WO2018150830A1 (en) * | 2017-02-17 | 2018-08-23 | Canon Kabushiki Kaisha | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
| JP2019160833A (ja) * | 2018-03-07 | 2019-09-19 | 東芝メモリ株式会社 | 半導体装置 |
| JP7221286B2 (ja) * | 2018-06-21 | 2023-02-13 | 株式会社半導体エネルギー研究所 | 撮像装置及びその動作方法、並びに電子機器 |
| JP7186540B2 (ja) * | 2018-08-06 | 2022-12-09 | キヤノン株式会社 | 液体吐出ヘッド用基板、液体吐出ヘッド、および、液体吐出装置 |
| US11437376B2 (en) * | 2019-05-31 | 2022-09-06 | Tokyo Electron Limited | Compact 3D stacked-CFET architecture for complex logic cells |
| WO2021001719A1 (ja) | 2019-07-04 | 2021-01-07 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
| EP4123709A4 (en) * | 2020-03-17 | 2023-11-22 | Sony Semiconductor Solutions Corporation | IMAGING DEVICE AND ELECTRONIC INSTRUMENT |
| JP2023016007A (ja) | 2021-07-20 | 2023-02-01 | 株式会社半導体エネルギー研究所 | 表示装置および電子装置 |
| CN114093973B (zh) * | 2021-10-15 | 2024-09-06 | 华南理工大学 | 一种火焰修饰碳纳米管/氧化镍/砷化镓太阳电池及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130059A (ja) * | 1984-07-20 | 1986-02-12 | Nec Corp | 半導体装置の製造方法 |
| KR900008647B1 (ko) * | 1986-03-20 | 1990-11-26 | 후지쓰 가부시끼가이샤 | 3차원 집적회로와 그의 제조방법 |
| JP2879894B2 (ja) * | 1996-10-08 | 1999-04-05 | 川崎製鉄株式会社 | アンチフューズ素子を具備した半導体集積回路装置及びその製造方法 |
| US6489952B1 (en) * | 1998-11-17 | 2002-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type semiconductor display device |
| JP2003060056A (ja) * | 2001-08-10 | 2003-02-28 | Seiko Epson Corp | 半導体集積回路の製造方法及びレチクル及び半導体集積回路装置 |
| JP4526771B2 (ja) * | 2003-03-14 | 2010-08-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2005056985A (ja) * | 2003-08-01 | 2005-03-03 | Seiko Epson Corp | 半導体装置の製造方法、半導体装置および電子機器 |
| KR101111995B1 (ko) * | 2003-12-02 | 2012-03-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터, 디스플레이 장치 및 액정 디스플레이장치, 그리고 그 제조방법 |
| JP2005268662A (ja) | 2004-03-19 | 2005-09-29 | Seiko Epson Corp | 3次元デバイスの製造方法 |
| US20060292823A1 (en) * | 2005-06-28 | 2006-12-28 | Shriram Ramanathan | Method and apparatus for bonding wafers |
| US20070145367A1 (en) * | 2005-12-27 | 2007-06-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three-dimensional integrated circuit structure |
| JP5512102B2 (ja) * | 2007-08-24 | 2014-06-04 | 本田技研工業株式会社 | 半導体装置 |
| US8044464B2 (en) | 2007-09-21 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7872357B2 (en) * | 2008-03-05 | 2011-01-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protection for bonding pads and methods of formation |
| JP5347381B2 (ja) * | 2008-08-28 | 2013-11-20 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| WO2010109746A1 (ja) * | 2009-03-27 | 2010-09-30 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| WO2011065183A1 (en) * | 2009-11-24 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including memory cell |
| US8759166B2 (en) * | 2009-12-14 | 2014-06-24 | Sharp Kabushiki Kaisha | Method for manufacturing thin film transistor device |
| KR101411800B1 (ko) * | 2009-12-26 | 2014-06-24 | 캐논 가부시끼가이샤 | 고체 촬상 장치 및 촬상 시스템 |
| WO2011081009A1 (en) * | 2009-12-28 | 2011-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8859390B2 (en) * | 2010-02-05 | 2014-10-14 | International Business Machines Corporation | Structure and method for making crack stop for 3D integrated circuits |
| JP2011210744A (ja) * | 2010-03-26 | 2011-10-20 | Toshiba Corp | 半導体装置及びその製造方法 |
| US9329443B2 (en) * | 2010-03-29 | 2016-05-03 | Seiko Epson Corporation | Liquid crystal display device having first and second dielectric films with different thicknesses |
| JP5651986B2 (ja) * | 2010-04-02 | 2015-01-14 | ソニー株式会社 | 固体撮像装置とその製造方法、並びに電子機器及びカメラモジュール |
| JP2012054321A (ja) * | 2010-08-31 | 2012-03-15 | Sony Corp | 固体撮像素子及びその製造方法、並びに固体撮像装置及び撮像装置 |
| JP2012064657A (ja) * | 2010-09-14 | 2012-03-29 | Toshiba Corp | 半導体装置 |
| US8921976B2 (en) * | 2011-01-25 | 2014-12-30 | Stmicroelectronics, Inc. | Using backside passive elements for multilevel 3D wafers alignment applications |
| JP5291746B2 (ja) | 2011-03-22 | 2013-09-18 | 株式会社荏原製作所 | 研磨装置 |
| JP6074985B2 (ja) * | 2012-09-28 | 2017-02-08 | ソニー株式会社 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
-
2012
- 2012-09-28 JP JP2012218000A patent/JP6074985B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-04 US US14/017,816 patent/US9093575B2/en active Active
- 2013-09-18 CN CN201710447901.9A patent/CN107275354B/zh not_active Expired - Fee Related
- 2013-09-18 CN CN201310429001.3A patent/CN103715175B/zh not_active Expired - Fee Related
-
2015
- 2015-06-18 US US14/743,299 patent/US9577005B2/en not_active Expired - Fee Related
-
2017
- 2017-01-11 US US15/403,359 patent/US9947710B2/en active Active
-
2018
- 2018-03-12 US US15/918,103 patent/US10319775B2/en active Active
- 2018-09-21 US US16/137,600 patent/US10615214B2/en not_active Expired - Fee Related
-
2020
- 2020-03-26 US US16/830,618 patent/US10930697B2/en not_active Expired - Fee Related
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