JP2014068009A5 - - Google Patents

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Publication number
JP2014068009A5
JP2014068009A5 JP2013188116A JP2013188116A JP2014068009A5 JP 2014068009 A5 JP2014068009 A5 JP 2014068009A5 JP 2013188116 A JP2013188116 A JP 2013188116A JP 2013188116 A JP2013188116 A JP 2013188116A JP 2014068009 A5 JP2014068009 A5 JP 2014068009A5
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JP
Japan
Prior art keywords
processing
cluster
robot
wafer
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013188116A
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English (en)
Japanese (ja)
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JP2014068009A (ja
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Publication date
Priority claimed from US13/610,990 external-priority patent/US9293317B2/en
Application filed filed Critical
Publication of JP2014068009A publication Critical patent/JP2014068009A/ja
Publication of JP2014068009A5 publication Critical patent/JP2014068009A5/ja
Pending legal-status Critical Current

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JP2013188116A 2012-09-12 2013-09-11 半導体処理装置に関する方法およびシステム Pending JP2014068009A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/610,990 2012-09-12
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (2)

Publication Number Publication Date
JP2014068009A JP2014068009A (ja) 2014-04-17
JP2014068009A5 true JP2014068009A5 (enExample) 2016-09-23

Family

ID=50233440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013188116A Pending JP2014068009A (ja) 2012-09-12 2013-09-11 半導体処理装置に関する方法およびシステム

Country Status (6)

Country Link
US (2) US9293317B2 (enExample)
JP (1) JP2014068009A (enExample)
KR (1) KR20140035280A (enExample)
CN (1) CN103681419A (enExample)
SG (2) SG2013069463A (enExample)
TW (1) TWI606539B (enExample)

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JP2018174186A (ja) 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
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US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
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US12112959B2 (en) * 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
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KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021178399A1 (en) 2020-03-06 2021-09-10 Lam Research Corporation Atomic layer etching of molybdenum
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
JP7578429B2 (ja) * 2020-07-15 2024-11-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11721583B2 (en) 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
JP7764277B2 (ja) * 2022-02-28 2025-11-05 株式会社安川電機 ドア開閉ロボット、及び、ドア開閉システム
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
US20240153803A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
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TWI840262B (zh) * 2023-06-26 2024-04-21 友威科技股份有限公司 一站式電漿製程系統及其製程方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
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