TWI606539B - 有關半導體處理設備之方法與系統 - Google Patents

有關半導體處理設備之方法與系統 Download PDF

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Publication number
TWI606539B
TWI606539B TW102132992A TW102132992A TWI606539B TW I606539 B TWI606539 B TW I606539B TW 102132992 A TW102132992 A TW 102132992A TW 102132992 A TW102132992 A TW 102132992A TW I606539 B TWI606539 B TW I606539B
Authority
TW
Taiwan
Prior art keywords
processing
robot
wafer
chamber
linear
Prior art date
Application number
TW102132992A
Other languages
English (en)
Chinese (zh)
Other versions
TW201417209A (zh
Inventor
班傑明Ｗ 穆林
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201417209A publication Critical patent/TW201417209A/zh
Application granted granted Critical
Publication of TWI606539B publication Critical patent/TWI606539B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
TW102132992A 2012-09-12 2013-09-12 有關半導體處理設備之方法與系統 TWI606539B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (2)

Publication Number Publication Date
TW201417209A TW201417209A (zh) 2014-05-01
TWI606539B true TWI606539B (zh) 2017-11-21

Family

ID=50233440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102132992A TWI606539B (zh) 2012-09-12 2013-09-12 有關半導體處理設備之方法與系統

Country Status (6)

Country Link
US (2) US9293317B2 (enExample)
JP (1) JP2014068009A (enExample)
KR (1) KR20140035280A (enExample)
CN (1) CN103681419A (enExample)
SG (2) SG2013069463A (enExample)
TW (1) TWI606539B (enExample)

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CN105321844A (zh) * 2014-07-29 2016-02-10 盛美半导体设备（上海）有限公司 堆叠布局的半导体设备
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
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US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
JP2018006533A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
JP2018006534A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6747136B2 (ja) * 2016-07-22 2020-08-26 東京エレクトロン株式会社 基板処理装置
JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP2018174186A (ja) 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
CN108044355B (zh) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
WO2019246122A1 (en) * 2018-06-18 2019-12-26 Lam Research Corporation Reduced footprint wafer handling platform
TWI735895B (zh) * 2018-06-22 2021-08-11 瑞士商Ｇ射線工業公司 共價接合之半導體界面
US12112959B2 (en) * 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
DE102018217471A1 (de) * 2018-10-12 2020-04-16 Krones Ag Modulares Robotersystem für eine Behälterverarbeitungsanlage
KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021178399A1 (en) 2020-03-06 2021-09-10 Lam Research Corporation Atomic layer etching of molybdenum
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
JP7578429B2 (ja) * 2020-07-15 2024-11-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11721583B2 (en) 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
JP7764277B2 (ja) * 2022-02-28 2025-11-05 株式会社安川電機 ドア開閉ロボット、及び、ドア開閉システム
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TWI840262B (zh) * 2023-06-26 2024-04-21 友威科技股份有限公司 一站式電漿製程系統及其製程方法

Also Published As

Publication number Publication date
CN103681419A (zh) 2014-03-26
JP2014068009A (ja) 2014-04-17
SG2013069463A (en) 2014-04-28
US10256124B2 (en) 2019-04-09
KR20140035280A (ko) 2014-03-21
SG10201602863SA (en) 2016-05-30
US20140072397A1 (en) 2014-03-13
TW201417209A (zh) 2014-05-01
US9293317B2 (en) 2016-03-22
US20160163572A1 (en) 2016-06-09

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