JP2014068009A - 半導体処理装置に関する方法およびシステム - Google Patents

半導体処理装置に関する方法およびシステム Download PDF

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Publication number
JP2014068009A
JP2014068009A JP2013188116A JP2013188116A JP2014068009A JP 2014068009 A JP2014068009 A JP 2014068009A JP 2013188116 A JP2013188116 A JP 2013188116A JP 2013188116 A JP2013188116 A JP 2013188116A JP 2014068009 A JP2014068009 A JP 2014068009A
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JP
Japan
Prior art keywords
processing
robot
cluster
wafer
chamber
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Pending
Application number
JP2013188116A
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English (en)
Japanese (ja)
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JP2014068009A5 (enExample
Inventor
Benjamin W Mooring
ベンジャミン・ダブリュ．・ムアリング
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Lam Research Corp
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Lam Research Corp
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Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2014068009A publication Critical patent/JP2014068009A/ja
Publication of JP2014068009A5 publication Critical patent/JP2014068009A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
JP2013188116A 2012-09-12 2013-09-11 半導体処理装置に関する方法およびシステム Pending JP2014068009A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/610,990 2012-09-12
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (2)

Publication Number Publication Date
JP2014068009A true JP2014068009A (ja) 2014-04-17
JP2014068009A5 JP2014068009A5 (enExample) 2016-09-23

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Family Applications (1)

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JP2013188116A Pending JP2014068009A (ja) 2012-09-12 2013-09-11 半導体処理装置に関する方法およびシステム

Country Status (6)

Country Link
US (2) US9293317B2 (enExample)
JP (1) JP2014068009A (enExample)
KR (1) KR20140035280A (enExample)
CN (1) CN103681419A (enExample)
SG (2) SG2013069463A (enExample)
TW (1) TWI606539B (enExample)

Cited By (9)

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JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
WO2018003331A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
WO2018003330A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
WO2018016257A1 (ja) * 2016-07-22 2018-01-25 東京エレクトロン株式会社 基板処理装置
KR20180111592A (ko) 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JPWO2021234928A1 (enExample) * 2020-05-21 2021-11-25
JP2022018359A (ja) * 2020-07-15 2022-01-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2022153414A (ja) * 2017-03-03 2022-10-12 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP2025024654A (ja) * 2023-08-07 2025-02-20 ヴイエム インコーポレイテッド マルチ層ｅｆｅｍを含む基板移送装置

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US9558974B2 (en) * 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
US9236257B2 (en) * 2013-03-13 2016-01-12 Varian Semiconductor Equipment Associates, Inc. Techniques to mitigate straggle damage to sensitive structures
CN203601454U (zh) 2013-10-28 2014-05-21 久鼎金属实业股份有限公司 自行车的可调式座管总成
CN105321844A (zh) * 2014-07-29 2016-02-10 盛美半导体设备（上海）有限公司 堆叠布局的半导体设备
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
KR101736855B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
CN108044355B (zh) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
WO2019246122A1 (en) * 2018-06-18 2019-12-26 Lam Research Corporation Reduced footprint wafer handling platform
TWI735895B (zh) * 2018-06-22 2021-08-11 瑞士商Ｇ射線工業公司 共價接合之半導體界面
US12112959B2 (en) * 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
DE102018217471A1 (de) * 2018-10-12 2020-04-16 Krones Ag Modulares Robotersystem für eine Behälterverarbeitungsanlage
KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021178399A1 (en) 2020-03-06 2021-09-10 Lam Research Corporation Atomic layer etching of molybdenum
US11721583B2 (en) 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
JP7764277B2 (ja) * 2022-02-28 2025-11-05 株式会社安川電機 ドア開閉ロボット、及び、ドア開閉システム
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
US20240153803A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
US20240290644A1 (en) * 2023-02-27 2024-08-29 Applied Materials, Inc. Two level vacuum wafer transfer system with robots on each level
TWI840262B (zh) * 2023-06-26 2024-04-21 友威科技股份有限公司 一站式電漿製程系統及其製程方法
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
USD1118552S1 (en) 2023-10-24 2026-03-17 Applied Materials, Inc. Substrate carrier
US12628612B2 (en) 2024-06-06 2026-05-12 Applied Materials, Inc. Magnetic sensor assembly for a substrate process station

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JP2001053125A (ja) * 1999-08-13 2001-02-23 Tokyo Electron Ltd 処理システム
JP2007036284A (ja) * 1998-04-21 2007-02-08 Samsung Electronics Co Ltd 半導体装置素子の製造方法
WO2008088109A1 (en) * 2007-01-16 2008-07-24 Tes Co., Ltd A loadlock chamber having dual-arm and a transportation system for processing semiconductor material using a loadlock chamber having dual-arm
JP2009218384A (ja) * 2008-03-11 2009-09-24 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
JP2012144256A (ja) * 2011-01-06 2012-08-02 Omori Mach Co Ltd 搬送装置
JP2012518271A (ja) * 2009-02-13 2012-08-09 マイクロニック マイデータ アーベー マルチテーブルリソグラフィシステム

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JP2007036284A (ja) * 1998-04-21 2007-02-08 Samsung Electronics Co Ltd 半導体装置素子の製造方法
JP2001053125A (ja) * 1999-08-13 2001-02-23 Tokyo Electron Ltd 処理システム
WO2008088109A1 (en) * 2007-01-16 2008-07-24 Tes Co., Ltd A loadlock chamber having dual-arm and a transportation system for processing semiconductor material using a loadlock chamber having dual-arm
JP2009218384A (ja) * 2008-03-11 2009-09-24 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
JP2012518271A (ja) * 2009-02-13 2012-08-09 マイクロニック マイデータ アーベー マルチテーブルリソグラフィシステム
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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
WO2018003331A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
WO2018003330A1 (ja) * 2016-06-30 2018-01-04 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
WO2018016257A1 (ja) * 2016-07-22 2018-01-25 東京エレクトロン株式会社 基板処理装置
JP2018014469A (ja) * 2016-07-22 2018-01-25 東京エレクトロン株式会社 基板処理装置
KR20190020042A (ko) 2016-07-22 2019-02-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US10906756B2 (en) 2016-07-22 2021-02-02 Tokyo Electron Limited Substrate processing device
JP2022153414A (ja) * 2017-03-03 2022-10-12 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP7492554B2 (ja) 2017-03-03 2024-05-29 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
KR20180111592A (ko) 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US10679878B2 (en) 2017-03-31 2020-06-09 Tokyo Electron Limited Substrate processing apparatus
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
JPWO2021234928A1 (enExample) * 2020-05-21 2021-11-25
JP7279858B2 (ja) 2020-05-21 2023-05-23 株式会社安川電機 搬送装置、搬送方法および搬送システム
US11701785B2 (en) 2020-05-21 2023-07-18 Kabushiki Kaisha Yaskawa Denki Substrate transport with mobile buffer
JP2022018359A (ja) * 2020-07-15 2022-01-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US12106982B2 (en) 2020-07-15 2024-10-01 SCREEN Holdings Co., Ltd. Substrate processing device
JP7578429B2 (ja) 2020-07-15 2024-11-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2025024654A (ja) * 2023-08-07 2025-02-20 ヴイエム インコーポレイテッド マルチ層ｅｆｅｍを含む基板移送装置
JP7736325B2 (ja) 2023-08-07 2025-09-09 ヴイエム インコーポレイテッド マルチ層ｅｆｅｍを含む基板移送装置

Also Published As

Publication number Publication date
CN103681419A (zh) 2014-03-26
SG2013069463A (en) 2014-04-28
US10256124B2 (en) 2019-04-09
KR20140035280A (ko) 2014-03-21
SG10201602863SA (en) 2016-05-30
US20140072397A1 (en) 2014-03-13
TW201417209A (zh) 2014-05-01
TWI606539B (zh) 2017-11-21
US9293317B2 (en) 2016-03-22
US20160163572A1 (en) 2016-06-09

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