SG10201602863SA - Method and system related to semiconductor processing equipment - Google Patents

Method and system related to semiconductor processing equipment

Info

Publication number
SG10201602863SA
SG10201602863SA SG10201602863SA SG10201602863SA SG10201602863SA SG 10201602863S A SG10201602863S A SG 10201602863SA SG 10201602863S A SG10201602863S A SG 10201602863SA SG 10201602863S A SG10201602863S A SG 10201602863SA SG 10201602863S A SG10201602863S A SG 10201602863SA
Authority
SG
Singapore
Prior art keywords
processing equipment
semiconductor processing
system related
semiconductor
equipment
Prior art date
Application number
SG10201602863SA
Inventor
W Mooring Benjamin
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201602863SA publication Critical patent/SG10201602863SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
SG10201602863SA 2012-09-12 2013-09-12 Method and system related to semiconductor processing equipment SG10201602863SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (1)

Publication Number Publication Date
SG10201602863SA true SG10201602863SA (en) 2016-05-30

Family

ID=50233440

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201602863SA SG10201602863SA (en) 2012-09-12 2013-09-12 Method and system related to semiconductor processing equipment
SG2013069463A SG2013069463A (en) 2012-09-12 2013-09-12 Method and system related to semiconductor processing equipment

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013069463A SG2013069463A (en) 2012-09-12 2013-09-12 Method and system related to semiconductor processing equipment

Country Status (6)

Country Link
US (2) US9293317B2 (en)
JP (1) JP2014068009A (en)
KR (1) KR20140035280A (en)
CN (1) CN103681419A (en)
SG (2) SG10201602863SA (en)
TW (1) TWI606539B (en)

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US9558974B2 (en) * 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
US9236257B2 (en) * 2013-03-13 2016-01-12 Varian Semiconductor Equipment Associates, Inc. Techniques to mitigate straggle damage to sensitive structures
JP2014216519A (en) * 2013-04-26 2014-11-17 株式会社ディスコ Processing device and transportation method of wafer
CN203601454U (en) 2013-10-28 2014-05-21 久鼎金属实业股份有限公司 Adjustable seat tube assembly of bicycle
CN105321844A (en) * 2014-07-29 2016-02-10 盛美半导体设备（上海）有限公司 Stacked-layout semiconductor equipment
US9818633B2 (en) 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
KR101736855B1 (en) * 2015-05-29 2017-05-18 세메스 주식회사 Apparatus for Processing Substrate
US10014196B2 (en) 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
JP2018006534A (en) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 Deposition device, deposition method and storage medium
JP2018006533A (en) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 Vacuum processing device, vacuum processing method and storage medium
JP6747136B2 (en) * 2016-07-22 2020-08-26 東京エレクトロン株式会社 Substrate processing equipment
JP7158133B2 (en) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド Atmosphere-controlled transfer module and processing system
JP2018174186A (en) 2017-03-31 2018-11-08 東京エレクトロン株式会社 Substrate processing apparatus
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
CN108044355B (en) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 Laser grinding wheel scribing machine and composite material cutting method
TWI735895B (en) * 2018-06-22 2021-08-11 瑞士商Ｇ射線工業公司 Covalently bonded semiconductor interfaces
WO2020214785A1 (en) * 2019-04-18 2020-10-22 Lam Research Corporation High density, controlled integrated circuits factory
EP4102550A4 (en) * 2020-02-05 2023-02-01 Kabushiki Kaisha Yaskawa Denki Transport system, transport method, and transport device
WO2021234928A1 (en) * 2020-05-21 2021-11-25 株式会社安川電機 Transport device, transport method, and transport system
JP2022018359A (en) * 2020-07-15 2022-01-27 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus
US11721583B2 (en) * 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
CN114823426B (en) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 Semiconductor processing equipment

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US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
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Also Published As

Publication number Publication date
US10256124B2 (en) 2019-04-09
SG2013069463A (en) 2014-04-28
KR20140035280A (en) 2014-03-21
CN103681419A (en) 2014-03-26
US20140072397A1 (en) 2014-03-13
JP2014068009A (en) 2014-04-17
US20160163572A1 (en) 2016-06-09
US9293317B2 (en) 2016-03-22
TWI606539B (en) 2017-11-21
TW201417209A (en) 2014-05-01

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