KR20140035280A - 반도체 프로세싱 장비에 관련된 방법 및 시스템 - Google Patents

반도체 프로세싱 장비에 관련된 방법 및 시스템 Download PDF

Info

Publication number
KR20140035280A
KR20140035280A KR1020130109707A KR20130109707A KR20140035280A KR 20140035280 A KR20140035280 A KR 20140035280A KR 1020130109707 A KR1020130109707 A KR 1020130109707A KR 20130109707 A KR20130109707 A KR 20130109707A KR 20140035280 A KR20140035280 A KR 20140035280A
Authority
KR
South Korea
Prior art keywords
processing
robot
cluster
chamber
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130109707A
Other languages
English (en)
Korean (ko)
Inventor
벤자민 더블유. 무어링
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20140035280A publication Critical patent/KR20140035280A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
KR1020130109707A 2012-09-12 2013-09-12 반도체 프로세싱 장비에 관련된 방법 및 시스템 Ceased KR20140035280A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/610,990 2012-09-12
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (1)

Publication Number Publication Date
KR20140035280A true KR20140035280A (ko) 2014-03-21

Family

ID=50233440

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130109707A Ceased KR20140035280A (ko) 2012-09-12 2013-09-12 반도체 프로세싱 장비에 관련된 방법 및 시스템

Country Status (6)

Country Link
US (2) US9293317B2 (enExample)
JP (1) JP2014068009A (enExample)
KR (1) KR20140035280A (enExample)
CN (1) CN103681419A (enExample)
SG (2) SG2013069463A (enExample)
TW (1) TWI606539B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190020042A (ko) * 2016-07-22 2019-02-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US12598929B2 (en) 2020-03-06 2026-04-07 Lam Research Corporation Atomic layer etching of molybdenum

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9558974B2 (en) * 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
US9236257B2 (en) * 2013-03-13 2016-01-12 Varian Semiconductor Equipment Associates, Inc. Techniques to mitigate straggle damage to sensitive structures
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
CN203601454U (zh) 2013-10-28 2014-05-21 久鼎金属实业股份有限公司 自行车的可调式座管总成
CN105321844A (zh) * 2014-07-29 2016-02-10 盛美半导体设备（上海）有限公司 堆叠布局的半导体设备
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
KR101736855B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
JP2018006533A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
JP2018006534A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP2018174186A (ja) 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
CN108044355B (zh) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
WO2019246122A1 (en) * 2018-06-18 2019-12-26 Lam Research Corporation Reduced footprint wafer handling platform
TWI735895B (zh) * 2018-06-22 2021-08-11 瑞士商Ｇ射線工業公司 共價接合之半導體界面
US12112959B2 (en) * 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
DE102018217471A1 (de) * 2018-10-12 2020-04-16 Krones Ag Modulares Robotersystem für eine Behälterverarbeitungsanlage
KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
JP7578429B2 (ja) * 2020-07-15 2024-11-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11721583B2 (en) 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
JP7764277B2 (ja) * 2022-02-28 2025-11-05 株式会社安川電機 ドア開閉ロボット、及び、ドア開閉システム
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
US20240153803A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
US20240290644A1 (en) * 2023-02-27 2024-08-29 Applied Materials, Inc. Two level vacuum wafer transfer system with robots on each level
TWI840262B (zh) * 2023-06-26 2024-04-21 友威科技股份有限公司 一站式電漿製程系統及其製程方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
USD1118552S1 (en) 2023-10-24 2026-03-17 Applied Materials, Inc. Substrate carrier
US12628612B2 (en) 2024-06-06 2026-05-12 Applied Materials, Inc. Magnetic sensor assembly for a substrate process station

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274852A (ja) * 1985-09-26 1987-04-06 Toshiba Corp 搬送装置
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
TW295677B (enExample) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
JP2001053125A (ja) * 1999-08-13 2001-02-23 Tokyo Electron Ltd 処理システム
US6779962B2 (en) * 2002-03-22 2004-08-24 Brooks Automation, Inc. Device for handling flat panels in a vacuum
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
KR100576150B1 (ko) * 2004-08-12 2006-05-03 세메스 주식회사 기판 이송 장치
MX2009000899A (es) * 2006-07-31 2009-04-22 Fki Logistex Inc Sistemas y metodos de banda transportadora.
US8350024B2 (en) * 2006-11-22 2013-01-08 Tatsuo Kaneko Sugar derivatives and application of same
WO2008088109A1 (en) * 2007-01-16 2008-07-24 Tes Co., Ltd A loadlock chamber having dual-arm and a transportation system for processing semiconductor material using a loadlock chamber having dual-arm
JP4816662B2 (ja) * 2008-03-06 2011-11-16 株式会社安川電機 リニア軸のケーブル処理機構およびそれを用いた基板搬送装置
JP2009218384A (ja) * 2008-03-11 2009-09-24 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
KR101181560B1 (ko) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
WO2010092128A1 (en) 2009-02-13 2010-08-19 Micronic Laser Systems Ab Multi-table lithographic systems
JP5836594B2 (ja) * 2011-01-06 2015-12-24 大森機械工業株式会社 搬送装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190020042A (ko) * 2016-07-22 2019-02-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치
US12598929B2 (en) 2020-03-06 2026-04-07 Lam Research Corporation Atomic layer etching of molybdenum

Also Published As

Publication number Publication date
CN103681419A (zh) 2014-03-26
JP2014068009A (ja) 2014-04-17
SG2013069463A (en) 2014-04-28
US10256124B2 (en) 2019-04-09
SG10201602863SA (en) 2016-05-30
US20140072397A1 (en) 2014-03-13
TW201417209A (zh) 2014-05-01
TWI606539B (zh) 2017-11-21
US9293317B2 (en) 2016-03-22
US20160163572A1 (en) 2016-06-09

Similar Documents

Publication Publication Date Title
US9293317B2 (en) Method and system related to semiconductor processing equipment
TWI684234B (zh) 基材運送
KR101331288B1 (ko) 기판 처리 시스템, 반송 모듈, 기판 처리 방법 및 반도체 소자의 제조 방법
KR101744372B1 (ko) 진공 처리 장치
JP5212165B2 (ja) 基板処理装置
EP1965409A2 (en) Apparatus and methods for transporting and processing substrates
KR20140089517A (ko) 로드 포트, ｅｆｅｍ
KR102227066B1 (ko) 웨이퍼 이송 장치
US6568896B2 (en) Transfer chamber with side wall port
JP5610009B2 (ja) 基板処理装置
CN113644005A (zh) 一种半导体处理系统
KR20090064587A (ko) 기판 보관고
US10229847B2 (en) Substrate transfer chamber and container connecting mechanism with lid opening mechanisms
TW201123340A (en) Vacuum processing system and vacuum processing method of semiconductor processing substrate
CN109841552B (zh) 模块加压工作站及利用其处理半导体的方法
JP2008100802A (ja) 基板保管庫
JP2008100801A (ja) 基板保管庫
KR20080069051A (ko) 기판 이송 장치

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000