CN103681419A - 与半导体处理设备相关的方法和系统 - Google Patents

与半导体处理设备相关的方法和系统 Download PDF

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Publication number
CN103681419A
CN103681419A CN201310416017.0A CN201310416017A CN103681419A CN 103681419 A CN103681419 A CN 103681419A CN 201310416017 A CN201310416017 A CN 201310416017A CN 103681419 A CN103681419 A CN 103681419A
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China
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processing
cluster
robot
chamber
linear
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Pending
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CN201310416017.0A
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English (en)
Chinese (zh)
Inventor
本杰明·W·莫瑞
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
CN201310416017.0A 2012-09-12 2013-09-12 与半导体处理设备相关的方法和系统 Pending CN103681419A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/610,990 2012-09-12
US13/610,990 US9293317B2 (en) 2012-09-12 2012-09-12 Method and system related to semiconductor processing equipment

Publications (1)

Publication Number Publication Date
CN103681419A true CN103681419A (zh) 2014-03-26

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Family Applications (1)

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CN201310416017.0A Pending CN103681419A (zh) 2012-09-12 2013-09-12 与半导体处理设备相关的方法和系统

Country Status (6)

Country Link
US (2) US9293317B2 (enExample)
JP (1) JP2014068009A (enExample)
KR (1) KR20140035280A (enExample)
CN (1) CN103681419A (enExample)
SG (2) SG2013069463A (enExample)
TW (1) TWI606539B (enExample)

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CN105529293A (zh) * 2014-10-17 2016-04-27 朗姆研究公司 用于传送晶片的设备前端模块以及传送晶片的方法
CN106206371A (zh) * 2015-05-29 2016-12-07 细美事有限公司 加工衬底的装置
CN108044355A (zh) * 2017-12-22 2018-05-18 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
CN109388108A (zh) * 2017-08-08 2019-02-26 台湾积体电路制造股份有限公司 对efem机器人进行编程的方法及其自动教学元件

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US9558974B2 (en) * 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
US9236257B2 (en) * 2013-03-13 2016-01-12 Varian Semiconductor Equipment Associates, Inc. Techniques to mitigate straggle damage to sensitive structures
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
CN203601454U (zh) 2013-10-28 2014-05-21 久鼎金属实业股份有限公司 自行车的可调式座管总成
CN105321844A (zh) * 2014-07-29 2016-02-10 盛美半导体设备（上海）有限公司 堆叠布局的半导体设备
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
JP2018006533A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
JP2018006534A (ja) * 2016-06-30 2018-01-11 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6747136B2 (ja) * 2016-07-22 2020-08-26 東京エレクトロン株式会社 基板処理装置
JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
JP2018174186A (ja) 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
WO2019246122A1 (en) * 2018-06-18 2019-12-26 Lam Research Corporation Reduced footprint wafer handling platform
TWI735895B (zh) * 2018-06-22 2021-08-11 瑞士商Ｇ射線工業公司 共價接合之半導體界面
US12112959B2 (en) * 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
DE102018217471A1 (de) * 2018-10-12 2020-04-16 Krones Ag Modulares Robotersystem für eine Behälterverarbeitungsanlage
KR20210143917A (ko) * 2019-04-18 2021-11-29 램 리써치 코포레이션 고밀도, 제어된 집적 회로들 공장
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021178399A1 (en) 2020-03-06 2021-09-10 Lam Research Corporation Atomic layer etching of molybdenum
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
JP7578429B2 (ja) * 2020-07-15 2024-11-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11721583B2 (en) 2020-08-10 2023-08-08 Applied Materials, Inc. Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
JP7764277B2 (ja) * 2022-02-28 2025-11-05 株式会社安川電機 ドア開閉ロボット、及び、ドア開閉システム
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
US20240153803A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
US20240290644A1 (en) * 2023-02-27 2024-08-29 Applied Materials, Inc. Two level vacuum wafer transfer system with robots on each level
TWI840262B (zh) * 2023-06-26 2024-04-21 友威科技股份有限公司 一站式電漿製程系統及其製程方法
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
USD1118552S1 (en) 2023-10-24 2026-03-17 Applied Materials, Inc. Substrate carrier
US12628612B2 (en) 2024-06-06 2026-05-12 Applied Materials, Inc. Magnetic sensor assembly for a substrate process station

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Cited By (8)

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Publication number Priority date Publication date Assignee Title
CN105529293A (zh) * 2014-10-17 2016-04-27 朗姆研究公司 用于传送晶片的设备前端模块以及传送晶片的方法
CN105529293B (zh) * 2014-10-17 2020-10-02 朗姆研究公司 用于传送晶片的设备前端模块以及传送晶片的方法
CN106206371A (zh) * 2015-05-29 2016-12-07 细美事有限公司 加工衬底的装置
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CN109388108A (zh) * 2017-08-08 2019-02-26 台湾积体电路制造股份有限公司 对efem机器人进行编程的方法及其自动教学元件
CN108044355A (zh) * 2017-12-22 2018-05-18 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法
CN108044355B (zh) * 2017-12-22 2024-01-23 沈阳芯嘉科技有限公司 一种激光砂轮划片机及复合材料切割方法

Also Published As

Publication number Publication date
JP2014068009A (ja) 2014-04-17
SG2013069463A (en) 2014-04-28
US10256124B2 (en) 2019-04-09
KR20140035280A (ko) 2014-03-21
SG10201602863SA (en) 2016-05-30
US20140072397A1 (en) 2014-03-13
TW201417209A (zh) 2014-05-01
TWI606539B (zh) 2017-11-21
US9293317B2 (en) 2016-03-22
US20160163572A1 (en) 2016-06-09

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Application publication date: 20140326