JP2014017478A - 自動車用電装部品筐体 - Google Patents
自動車用電装部品筐体 Download PDFInfo
- Publication number
- JP2014017478A JP2014017478A JP2013124083A JP2013124083A JP2014017478A JP 2014017478 A JP2014017478 A JP 2014017478A JP 2013124083 A JP2013124083 A JP 2013124083A JP 2013124083 A JP2013124083 A JP 2013124083A JP 2014017478 A JP2014017478 A JP 2014017478A
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- Prior art keywords
- housing
- electrical component
- automotive electrical
- plating layer
- cover
- Prior art date
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- 238000001816 cooling Methods 0.000 claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010960 cold rolled steel Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKBJVIVEFXPEOU-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl OKBJVIVEFXPEOU-UHFFFAOYSA-N 0.000 description 1
- AJKLKINFZLWHQE-UHFFFAOYSA-N 2,2',3,3',5,5'-hexachlorobiphenyl Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C=C(Cl)C=2)Cl)=C1 AJKLKINFZLWHQE-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
【解決手段】本発明の実施例による自動車用電装部品筐体は、射出成形により製造されるプラスチック材質からなり上面が開口されるハウジングと、射出成形により製造されるプラスチック材質からなりハウジングの開口面を覆うトップカバーと、ハウジングの底面に安着されるベースカバーと、ベースカバーの上面に安着される電装部品セットと、少なくともハウジングの内周面とトップカバーの背面に形成されて電磁波を遮蔽する鍍金層と、を含む。
【選択図】図3
Description
11 ハウジング
12 トップカバー
13 電装部品セット
14 ベースカバー
15 第1シーラー
16 第2シーラー
17 パワーアウトコネクタ
18 パワーインコネクタ
19 シグナルコネクタ
111 冷却流路
112 冷却水流入ポート
113 冷却水流出ポート
114 インコネクタホール
115 シグナルコネクタホール
116 アウトコネクタホール
131 スイッチング素子
132 パワーPCB
133 DCリンクキャップ
141 カバー本体
142 冷却フィン
Claims (11)
- 自動車用電装部品筐体において、
射出成形により製造されるプラスチック材質からなり、上面が開口されるハウジングと、
射出成形により製造されるプラスチック材質からなり、前記ハウジングの開口面を覆うトップカバーと、
前記ハウジングの底面に安着されるベースカバーと、
前記ベースカバーの上面に安着される電装部品セットと、
少なくとも前記ハウジングの内周面と前記トップカバーの背面に形成され、電磁波を遮蔽する鍍金層と、
を含むことを特徴とする自動車用電装部品筐体。 - 前記鍍金層は、銅鍍金層にクロム及びニッケルのうちいずれか一つ又は全てが塗布された金属鍍金層である、請求項1に記載の自動車用電装部品筐体。
- 前記銅鍍金層の厚さは15〜20マイクロメートルの範囲内である、請求項2に記載の自動車用電装部品筐体。
- 前記クロムの鍍金層の厚さは0.2〜0.3マイクロメートルの範囲内である、請求項3に記載の自動車用電装部品筐体。
- 前記ニッケルの鍍金層の厚さは10〜15マイクロメートルの範囲内である、請求項2に記載の自動車用電装部品筐体。
- 前記クロムの鍍金層の厚さは0.2〜0.3マイクロメートルの範囲内である、請求項5に記載の自動車用電装部品筐体。
- 前記ハウジングの内側底面に所定の深さで形成されて上面が開口される冷却流路が形成され、
前記ベースカバーによって前記冷却流路の開口面が遮蔽される、請求項1に記載の自動車用電装部品筐体。 - 前記ベースカバーは、熱伝導率が高いアルミニウム又は鉄を含む金属板である、請求項7に記載の自動車用電装部品筐体。
- 前記ベースカバーは、
前記冷却流路を遮蔽するカバー本体と、
前記カバー本体の底面に突出されて前記冷却流路の上に置かれる多数の冷却フィンと、を含む、請求項8に記載の自動車用電装部品筐体。 - 前記冷却流路の外郭ラインに沿って置かれ、前記ベースカバーによって圧着されるシーラーをさらに含む、請求項7に記載の自動車用電装部品筐体。
- 前記ハウジングの縁に沿って置かれ、前記トップカバーによって圧着されるシーラーを更に含む、請求項1に記載の自動車用電装部品筐体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0073174 | 2012-07-05 | ||
KR1020120073174A KR101375956B1 (ko) | 2012-07-05 | 2012-07-05 | 자동차용 전장부품 박스 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014017478A true JP2014017478A (ja) | 2014-01-30 |
JP5735583B2 JP5735583B2 (ja) | 2015-06-17 |
Family
ID=48747900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013124083A Expired - Fee Related JP5735583B2 (ja) | 2012-07-05 | 2013-06-12 | 自動車用電装部品筐体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140009890A1 (ja) |
EP (1) | EP2683229A3 (ja) |
JP (1) | JP5735583B2 (ja) |
KR (1) | KR101375956B1 (ja) |
CN (1) | CN103533790A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190081441A (ko) * | 2017-12-29 | 2019-07-09 | 주식회사 유라코퍼레이션 | 전기자동차용 충전장치의 냉각구조 |
JP2020526154A (ja) * | 2017-06-23 | 2020-08-27 | メタ システム エス.ピー.エー.Meta System S.P.A. | 電気自動車又はハイブリッド車用電子パワー装置及び関連する実現プロセス |
JPWO2020008843A1 (ja) * | 2018-07-04 | 2021-05-13 | 日立Astemo株式会社 | 電力変換装置 |
WO2022064754A1 (ja) * | 2020-09-28 | 2022-03-31 | 愛三工業株式会社 | 電子制御ユニット |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014111786A1 (de) * | 2014-08-19 | 2016-02-25 | Infineon Technologies Ag | Kühlplatte, Bauelement, das eine Kühlplatte umfasst, und Verfahren zum Herstellen einer Kühlplatte |
KR102445246B1 (ko) * | 2015-11-04 | 2022-09-20 | 엘지이노텍 주식회사 | 전력 변환 장치 |
KR101835954B1 (ko) * | 2016-02-24 | 2018-04-19 | 엘에스산전 주식회사 | 전동기 구동 장치 |
CN106793682B (zh) * | 2016-12-05 | 2019-01-01 | 章晓晓 | 一种电动车控制器的散热装置 |
JP6885126B2 (ja) * | 2017-03-22 | 2021-06-09 | 富士電機株式会社 | インバータ装置 |
DE102017003854A1 (de) * | 2017-04-20 | 2018-10-25 | Leopold Kostal Gmbh & Co. Kg | Gehäuse für ein elektrisches oder elektronisches Gerät |
DE102017220105A1 (de) * | 2017-11-10 | 2019-05-16 | Mahle International Gmbh | Elektromagnetisches Steuerungssystem |
DE102017221745B4 (de) * | 2017-12-03 | 2024-02-08 | Audi Ag | Leistungselektroniksystem zur Steuerung eines elektrischen Antriebes mit einem Zwischenkreiskondensator |
KR20200093258A (ko) | 2019-01-28 | 2020-08-05 | 주식회사 만도 | 전기 자동차용 배터리 충전 장치 |
US11523550B2 (en) * | 2019-10-08 | 2022-12-06 | Lear Corporation | Electrical assembly enclosure |
EP3960525A1 (en) * | 2020-08-31 | 2022-03-02 | Ningbo Geely Automobile Research & Development Co. Ltd. | Cooling system for an electric vehicle |
CN114302634B (zh) * | 2021-12-30 | 2022-11-22 | 徐州科亚机电有限公司 | 一种电动车控制器的防磁结构 |
DE102022109797A1 (de) | 2022-04-22 | 2023-10-26 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Antriebssystem für ein wenigstens teilweise elektrisch angetriebenes Kraftfahrzeug |
DE102022207986A1 (de) | 2022-08-02 | 2024-02-08 | Zf Friedrichshafen Ag | Kühlvorrichtung für ein Kraftfahrzeug und Kraftfahrzeug |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07240590A (ja) * | 1994-02-28 | 1995-09-12 | Idemitsu Petrochem Co Ltd | 通信器機用ハウジング |
JPH09331178A (ja) * | 1996-06-10 | 1997-12-22 | Nec Corp | シールド機能付きプラスチック筐体 |
JP2003243870A (ja) * | 2002-02-13 | 2003-08-29 | Maruichi Rubber Kogyo Kk | 電磁波シールド層を有する部品及びその製造方法 |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3558290A (en) * | 1968-04-02 | 1971-01-26 | Union Carbide Corp | Plated plastic printing plates |
US3524497A (en) * | 1968-04-04 | 1970-08-18 | Ibm | Heat transfer in a liquid cooling system |
US4455448A (en) * | 1981-12-02 | 1984-06-19 | Watkins-Johnson Company | Housing for microwave electronic devices |
US4599680A (en) * | 1983-09-26 | 1986-07-08 | Southwest Research Institute | Packaging arrangement for spacecraft computer |
JP2612339B2 (ja) * | 1989-04-18 | 1997-05-21 | 三菱電機株式会社 | 電子機器筐体 |
CN2116946U (zh) * | 1992-01-07 | 1992-09-23 | 宁海县调度自动化成套设备厂 | 电磁显示单元 |
DE69317035T2 (de) * | 1992-11-09 | 1998-06-10 | Chugai Ings Co | Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer Abschirmung |
US5520976A (en) * | 1993-06-30 | 1996-05-28 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
WO1996022008A1 (fr) * | 1995-01-10 | 1996-07-18 | Hitachi, Ltd. | Appareil electronique a faible interference electromagnetique, carte de circuit a faible interference electromagnetique et procede de fabrication de la carte de circuit a faible interference |
JP3052843B2 (ja) * | 1996-07-03 | 2000-06-19 | 住友電装株式会社 | 電気接続箱 |
JPH10233585A (ja) * | 1997-02-19 | 1998-09-02 | Fujitsu Ltd | 筐体及びそれを使用した電子機器 |
US5841634A (en) * | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
US6262364B1 (en) * | 1997-06-24 | 2001-07-17 | Bridgestone Corporation | Electromagnetic-wave shielding and light transmitting plate |
US6086979A (en) * | 1997-11-11 | 2000-07-11 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
DE19812042A1 (de) * | 1998-03-19 | 1999-09-30 | Harting Kgaa | Gehäuse zur Aufnahme von elektrischen und/oder elektronischen Bauteilen |
JP3886696B2 (ja) * | 1999-04-27 | 2007-02-28 | アイシン・エィ・ダブリュ株式会社 | 駆動装置 |
JP2000349486A (ja) * | 1999-06-07 | 2000-12-15 | Mitsubishi Rayon Co Ltd | 機器ハウジング |
US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
US20020162673A1 (en) * | 2001-05-03 | 2002-11-07 | Cook Derrick E. | Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module |
US6965071B2 (en) * | 2001-05-10 | 2005-11-15 | Parker-Hannifin Corporation | Thermal-sprayed metallic conformal coatings used as heat spreaders |
KR100521911B1 (ko) * | 2001-07-09 | 2005-10-13 | 다이니폰 인사츠 가부시키가이샤 | 전자파 차폐용 부재 및 그 제조방법 |
JP3882994B2 (ja) * | 2001-12-27 | 2007-02-21 | アイシン・エィ・ダブリュ株式会社 | 電動機制御ユニット冷却装置 |
US6965514B2 (en) * | 2002-01-16 | 2005-11-15 | Rockwell Automation Technologies, Inc. | Fluid cooled vehicle drive module |
US6972957B2 (en) * | 2002-01-16 | 2005-12-06 | Rockwell Automation Technologies, Inc. | Modular power converter having fluid cooled support |
US6909607B2 (en) * | 2002-01-16 | 2005-06-21 | Rockwell Automation Technologies, Inc. | Thermally matched fluid cooled power converter |
US6865080B2 (en) * | 2002-01-16 | 2005-03-08 | Rockwell Automation Technologies, Inc. | Compact fluid cooled power converter supporting multiple circuit boards |
US7187548B2 (en) * | 2002-01-16 | 2007-03-06 | Rockwell Automation Technologies, Inc. | Power converter having improved fluid cooling |
DE60321928D1 (de) * | 2002-09-13 | 2008-08-14 | Aisin Aw Co | Antriebseinrichtung |
US6839235B2 (en) * | 2002-12-19 | 2005-01-04 | Dy 4 Systems Inc. | Embedded heat pipe for a conduction cooled circuit card assembly |
JP4289924B2 (ja) * | 2003-04-07 | 2009-07-01 | 大日本印刷株式会社 | パターン形成体 |
WO2005071824A1 (ja) * | 2004-01-26 | 2005-08-04 | Hitachi, Ltd. | 半導体装置 |
CN2720576Y (zh) * | 2004-04-07 | 2005-08-24 | 长沙鑫邦工程新材料技术有限公司 | 一种电磁屏蔽布 |
DE102005001148B3 (de) * | 2005-01-10 | 2006-05-18 | Siemens Ag | Elektronikeinheit mit EMV-Schirmung |
US7724516B2 (en) * | 2005-08-26 | 2010-05-25 | The Boeing Company | Cooling enclosure for maintaining commercial-off-the-shelf (COTS) equipment in vehicles |
JP2007227598A (ja) * | 2006-02-23 | 2007-09-06 | Toyota Industries Corp | 回路基板及び半導体装置 |
CA2606637A1 (en) * | 2006-10-16 | 2008-04-16 | Projects Unlimited, Inc. | Static inverter with hardened environmental housing |
CN101175394A (zh) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | 一种防电磁干扰的多层复合材料及其制备方法 |
JP4861840B2 (ja) * | 2007-01-26 | 2012-01-25 | アイシン・エィ・ダブリュ株式会社 | 発熱体冷却構造及び駆動装置 |
SI2143139T1 (sl) * | 2007-04-26 | 2019-11-29 | Ceram Gmbh | Hladilna doza za komponente ali vezja |
JP5099417B2 (ja) * | 2007-05-22 | 2012-12-19 | アイシン・エィ・ダブリュ株式会社 | 半導体モジュール及びインバータ装置 |
KR100873821B1 (ko) * | 2007-08-07 | 2008-12-11 | 엘에스산전 주식회사 | 전기 자동차용 수냉 인버터 구조물 |
JP4452953B2 (ja) * | 2007-08-09 | 2010-04-21 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US7911806B2 (en) * | 2007-09-28 | 2011-03-22 | Hitachi, Ltd | Method and apparatus for reducing EMI emissions from a power inverter |
CN101410001B (zh) * | 2007-10-10 | 2010-11-17 | 中国钢铁股份有限公司 | 兼具有表面装饰及电磁波遮蔽的非金属基材 |
JP5030228B2 (ja) * | 2007-11-30 | 2012-09-19 | 矢崎総業株式会社 | 電気接続箱 |
JP4466744B2 (ja) * | 2008-02-06 | 2010-05-26 | 株式会社デンソー | 電子装置の放熱構造 |
JP2010069503A (ja) | 2008-09-18 | 2010-04-02 | Calsonic Kansei Corp | 熱交換器の製造方法 |
JP2010192759A (ja) * | 2009-02-19 | 2010-09-02 | Sanyo Electric Co Ltd | 電子機器用筐体の電磁シールド構造 |
FR2944408B1 (fr) * | 2009-04-14 | 2012-09-21 | Eads Europ Aeronautic Defence | Boitier pour carte electronique embarquee |
US8477499B2 (en) * | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
DE102009051864B4 (de) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlvorrichtung für eine elektrische Einrichtung |
EP2544157A1 (en) * | 2011-07-04 | 2013-01-09 | ZF Friedrichshafen AG | Technique for intrusion detection |
WO2013033601A2 (en) * | 2011-09-02 | 2013-03-07 | Wolverine Tube, Inc. | Enhanced clad metal base plate |
US9668388B2 (en) * | 2012-03-01 | 2017-05-30 | Autoliv Development Ab | Electronic unit with a PCB and two housing parts |
JP2014013795A (ja) * | 2012-07-03 | 2014-01-23 | Seiko Epson Corp | ベース基板、電子デバイスおよび電子機器 |
-
2012
- 2012-07-05 KR KR1020120073174A patent/KR101375956B1/ko not_active IP Right Cessation
-
2013
- 2013-05-10 US US13/892,080 patent/US20140009890A1/en not_active Abandoned
- 2013-06-12 JP JP2013124083A patent/JP5735583B2/ja not_active Expired - Fee Related
- 2013-06-17 EP EP13172291.0A patent/EP2683229A3/en not_active Withdrawn
- 2013-07-03 CN CN201310277070.7A patent/CN103533790A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07240590A (ja) * | 1994-02-28 | 1995-09-12 | Idemitsu Petrochem Co Ltd | 通信器機用ハウジング |
JPH09331178A (ja) * | 1996-06-10 | 1997-12-22 | Nec Corp | シールド機能付きプラスチック筐体 |
JP2003243870A (ja) * | 2002-02-13 | 2003-08-29 | Maruichi Rubber Kogyo Kk | 電磁波シールド層を有する部品及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020526154A (ja) * | 2017-06-23 | 2020-08-27 | メタ システム エス.ピー.エー.Meta System S.P.A. | 電気自動車又はハイブリッド車用電子パワー装置及び関連する実現プロセス |
KR20190081441A (ko) * | 2017-12-29 | 2019-07-09 | 주식회사 유라코퍼레이션 | 전기자동차용 충전장치의 냉각구조 |
KR102095915B1 (ko) * | 2017-12-29 | 2020-04-01 | 주식회사 유라코퍼레이션 | 전기자동차용 충전장치의 냉각구조 |
JPWO2020008843A1 (ja) * | 2018-07-04 | 2021-05-13 | 日立Astemo株式会社 | 電力変換装置 |
JP6999034B2 (ja) | 2018-07-04 | 2022-01-18 | 日立Astemo株式会社 | 電力変換装置 |
WO2022064754A1 (ja) * | 2020-09-28 | 2022-03-31 | 愛三工業株式会社 | 電子制御ユニット |
Also Published As
Publication number | Publication date |
---|---|
JP5735583B2 (ja) | 2015-06-17 |
CN103533790A (zh) | 2014-01-22 |
KR20140006393A (ko) | 2014-01-16 |
EP2683229A2 (en) | 2014-01-08 |
US20140009890A1 (en) | 2014-01-09 |
EP2683229A3 (en) | 2016-11-16 |
KR101375956B1 (ko) | 2014-03-18 |
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