JP2013518432A5 - - Google Patents

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Publication number
JP2013518432A5
JP2013518432A5 JP2012551156A JP2012551156A JP2013518432A5 JP 2013518432 A5 JP2013518432 A5 JP 2013518432A5 JP 2012551156 A JP2012551156 A JP 2012551156A JP 2012551156 A JP2012551156 A JP 2012551156A JP 2013518432 A5 JP2013518432 A5 JP 2013518432A5
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JP
Japan
Prior art keywords
tsv
wafer
die
stacked
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012551156A
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English (en)
Japanese (ja)
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JP2013518432A (ja
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Publication date
Priority claimed from US12/694,012 external-priority patent/US8017439B2/en
Application filed filed Critical
Publication of JP2013518432A publication Critical patent/JP2013518432A/ja
Publication of JP2013518432A5 publication Critical patent/JP2013518432A5/ja
Pending legal-status Critical Current

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JP2012551156A 2010-01-26 2010-12-17 Ｉｃダイ又はウエハをｔｓｖウエハに接合するためのデュアルキャリア Pending JP2013518432A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/694,012 US8017439B2 (en) 2010-01-26 2010-01-26 Dual carrier for joining IC die or wafers to TSV wafers
US12/694,012 2010-01-26
PCT/US2010/060927 WO2011093955A2 (en) 2010-01-26 2010-12-17 Dual carrier for joining ic die or wafers to tsv wafers

Publications (2)

Publication Number Publication Date
JP2013518432A JP2013518432A (ja) 2013-05-20
JP2013518432A5 true JP2013518432A5 (enExample) 2014-02-06

Family

ID=44309261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012551156A Pending JP2013518432A (ja) 2010-01-26 2010-12-17 Ｉｃダイ又はウエハをｔｓｖウエハに接合するためのデュアルキャリア

Country Status (4)

Country Link
US (1) US8017439B2 (enExample)
JP (1) JP2013518432A (enExample)
CN (1) CN102844859A (enExample)
WO (1) WO2011093955A2 (enExample)

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