JP2013512167A - 金属または合金コーティングへの炭素／錫混合物の適用方法 - Google Patents

金属または合金コーティングへの炭素／錫混合物の適用方法 Download PDF

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Publication number
JP2013512167A
JP2013512167A JP2012540282A JP2012540282A JP2013512167A JP 2013512167 A JP2013512167 A JP 2013512167A JP 2012540282 A JP2012540282 A JP 2012540282A JP 2012540282 A JP2012540282 A JP 2012540282A JP 2013512167 A JP2013512167 A JP 2013512167A
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Prior art keywords
substrate
coating composition
metal particles
metal
coating
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Pending
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JP2012540282A
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English (en)
Japanese (ja)
Inventor
ウド・アドラー
ディルク・ローデ
イザベル・ブレシュ
ワン・ジャン
ドミニク・フレックマン
ヘルゲ・シュミット
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TE Connectivity Germany GmbH
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TE Connectivity Germany GmbH
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Publication of JP2013512167A publication Critical patent/JP2013512167A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Materials For Medical Uses (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
JP2012540282A 2009-11-25 2010-10-01 金属または合金コーティングへの炭素／錫混合物の適用方法 Pending JP2013512167A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200910054427 DE102009054427B4 (de) 2009-11-25 2009-11-25 Verfahren zum Aufbringen von Gemengen aus Kohlenstoff und Metallpartikeln auf ein Substrat, nach dem Verfahren erhältliches Substrat und dessen Verwendung
DE102009054427.5 2009-11-25
PCT/DE2010/001165 WO2011063778A1 (de) 2009-11-25 2010-10-01 Verfahren zum aufbringen von kohlenstoff/zinn-gemengen auf metall- oder legierungsschichten

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015075413A Division JP6180457B2 (ja) 2009-11-25 2015-04-01 金属または合金コーティングへの炭素／錫混合物の適用方法

Publications (1)

Publication Number Publication Date
JP2013512167A true JP2013512167A (ja) 2013-04-11

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JP2012540282A Pending JP2013512167A (ja) 2009-11-25 2010-10-01 金属または合金コーティングへの炭素／錫混合物の適用方法
JP2015075413A Active JP6180457B2 (ja) 2009-11-25 2015-04-01 金属または合金コーティングへの炭素／錫混合物の適用方法

Family Applications After (1)

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Country Status (12)

Country Link
US (1) US20130004752A1 (https=)
EP (1) EP2504398A1 (https=)
JP (2) JP2013512167A (https=)
KR (1) KR20120098810A (https=)
CN (1) CN102648246B (https=)
AR (1) AR080618A1 (https=)
BR (1) BR112012012488A2 (https=)
DE (1) DE102009054427B4 (https=)
MX (1) MX2012005640A (https=)
RU (1) RU2525176C2 (https=)
TW (1) TW201134561A (https=)
WO (1) WO2011063778A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074578A (ja) * 2014-10-07 2016-05-12 ドンイー ホールディングス カンパニー リミテッド 金属および酸化物でハイブリッドコーティングされたナノカーボンの製造方法
JPWO2017033374A1 (ja) * 2015-08-24 2018-05-24 パナソニックＩｐマネジメント株式会社 導電性塗料組成物、導電性材料、導電性塗料組成物の製造方法、導電性材料の製造方法
JP2022179429A (ja) * 2021-05-21 2022-12-02 公益財団法人電磁材料研究所 ２次元構造複合材料およびその製造方法
WO2023054332A1 (ja) * 2021-09-28 2023-04-06 国立大学法人東北大学 カーボンナノチューブ組成物、カーボンナノチューブ製造用の触媒、カーボンナノチューブの製造方法およびカーボンナノチューブ

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009026655B3 (de) * 2009-06-03 2011-06-30 Linde Aktiengesellschaft, 80331 Verfahren zur Herstellung eines Metallmatrix-Verbundwerkstoffs, Metallmatrix-Verbundwerkstoff und seine Verwendung
US20120273255A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Corporation Electrical Conductors Having Organic Compound Coatings
KR101386362B1 (ko) * 2012-09-27 2014-04-16 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극
CN103897446B (zh) * 2014-04-21 2016-04-06 江苏同创节能科技有限公司 一种高性能的复合石墨烯导电涂料
DE102014114721B4 (de) 2014-10-10 2019-08-29 Harting Electric Gmbh & Co. Kg Elektrischer Steckverbinder und Verfahren zur Überwachung des Zustands einer Kontaktoberfläche eines elektrischen Steckverbinder-kontaktes
CN104312391A (zh) * 2014-10-14 2015-01-28 江苏华光粉末有限公司 一种石墨烯抗静电粉末涂料及其制备方法
CN104357788B (zh) * 2014-10-30 2017-01-25 安徽鼎恒再制造产业技术研究院有限公司 一种Ni‑Gr‑B纳米涂层及其制备方法
LU92758B1 (en) * 2015-06-29 2016-12-30 Luxembourg Inst Of Science And Tech (List) Carbon-nanotube-based composite coating and production method thereof
DE102017201159A1 (de) * 2017-01-25 2018-07-26 Kjellberg-Stiftung Bauelement oder Halteelement, das für die Plasmabearbeitung von Werkstücken einsetzbar ist und ein Verfahren zu seiner Herstellung
CN108892507A (zh) * 2018-06-28 2018-11-27 滁州市经纬装备科技有限公司 一种用于户外避雷装置的表面涂层材料的制备方法
KR20200005454A (ko) * 2018-07-05 2020-01-15 어메이징 쿨 테크놀로지 코포레이션 그래핀 금속 복합재료의 제조방법
CN109852924B (zh) * 2019-02-28 2021-10-22 贾春德 一种纳米、纳微米碳材料增强超细晶粒表层组织的渗剂、制备方法和具有该表层组织的钢材
GB201908011D0 (en) 2019-06-05 2019-07-17 Silberline Ltd New product
CN110885976A (zh) * 2019-11-15 2020-03-17 唐山市兆寰冶金装备制造有限公司 一种激光带状纳米复合强化工艺
CN116745062A (zh) * 2021-02-05 2023-09-12 新加坡贺利氏材料私人有限公司 经涂覆的线材
CN113223773B (zh) * 2021-05-06 2022-07-01 上海超导科技股份有限公司 第二代高温超导带材及其制备方法
DE102022205343A1 (de) * 2022-05-30 2023-11-30 Sms Group Gmbh Verfahren zum Bearbeiten eines metallischen Werkstücks

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007016262A (ja) * 2005-07-06 2007-01-25 Nissan Motor Co Ltd カーボンナノチューブ含有複合材及びその製造方法
WO2008015167A1 (de) * 2006-08-03 2008-02-07 Basf Se Dispersion zum aufbringen einer metallschicht
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
JP2008147169A (ja) * 2006-12-07 2008-06-26 Korea Electronics Telecommun Ｃｎｔエミッタの製造方法
JP2008542980A (ja) * 2005-05-06 2008-11-27 アプライド・ナノテック・ホールディングス・インコーポレーテッド カーボンナノチューブのインクジェット塗布
JP2009043981A (ja) * 2007-08-09 2009-02-26 Nissan Motor Co Ltd 電子部品用セラミックス基板及びその製造方法
JP2009117340A (ja) * 2007-11-07 2009-05-28 Samsung Electro-Mechanics Co Ltd 導電性ペースト及びこれを用いた印刷回路基板
JP2009187676A (ja) * 2008-02-01 2009-08-20 Toyota Motor Corp 負極活物質、リチウム二次電池、および負極活物質の製造方法
US20090242246A1 (en) * 2008-04-01 2009-10-01 Fukui Precision Component (Shenzhen) Co., Ltd. Printed circuit board and method for manufacturing same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116708A (ja) * 1984-11-12 1986-06-04 呉羽化学工業株式会社 導電性フイルムおよびその製造方法
US7138203B2 (en) * 2001-01-19 2006-11-21 World Properties, Inc. Apparatus and method of manufacture of electrochemical cell components
AU2003291133A1 (en) * 2002-11-26 2004-06-18 Carbon Nanotechnologies, Inc. Carbon nanotube particulates, compositions and use thereof
JP4351120B2 (ja) * 2004-08-19 2009-10-28 シナノケンシ株式会社 金属粒子の製造方法
US7886813B2 (en) * 2005-06-29 2011-02-15 Intel Corporation Thermal interface material with carbon nanotubes and particles
US8597453B2 (en) * 2005-12-05 2013-12-03 Manotek Instriments, Inc. Method for producing highly conductive sheet molding compound, fuel cell flow field plate, and bipolar plate
US20070145097A1 (en) * 2005-12-20 2007-06-28 Intel Corporation Carbon nanotubes solder composite for high performance interconnect
KR100748228B1 (ko) * 2006-02-28 2007-08-09 한국과학기술원 전기도금을 이용한 금속/탄소나노튜브 복합재료 제조방법
RU2318851C2 (ru) * 2006-03-24 2008-03-10 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт "Дельфин" Электропроводный лакокрасочный материал для антикоррозионной защиты металлических конструкций
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
GB0622060D0 (en) * 2006-11-06 2006-12-13 Hexcel Composites Ltd Improved composite materials
JP4999072B2 (ja) * 2007-03-22 2012-08-15 古河電気工業株式会社 表面被覆材
KR100915394B1 (ko) * 2007-10-12 2009-09-03 (주)태광테크 전기전도도 및 내마모성이 우수한 소재 및 그 제조방법
KR100974092B1 (ko) * 2008-05-30 2010-08-04 삼성전기주식회사 탄소나노튜브를 포함하는 도전성 페이스트 및 이를 이용한인쇄회로기판
KR101099237B1 (ko) * 2008-12-10 2011-12-27 엘에스전선 주식회사 전도성 페이스트와 이를 이용한 전도성 기판
CN101474899A (zh) * 2009-01-16 2009-07-08 南开大学 石墨烯-无机材料复合多层薄膜及其制备方法
DE102009026655B3 (de) * 2009-06-03 2011-06-30 Linde Aktiengesellschaft, 80331 Verfahren zur Herstellung eines Metallmatrix-Verbundwerkstoffs, Metallmatrix-Verbundwerkstoff und seine Verwendung

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
JP2008542980A (ja) * 2005-05-06 2008-11-27 アプライド・ナノテック・ホールディングス・インコーポレーテッド カーボンナノチューブのインクジェット塗布
JP2007016262A (ja) * 2005-07-06 2007-01-25 Nissan Motor Co Ltd カーボンナノチューブ含有複合材及びその製造方法
WO2008015167A1 (de) * 2006-08-03 2008-02-07 Basf Se Dispersion zum aufbringen einer metallschicht
JP2008147169A (ja) * 2006-12-07 2008-06-26 Korea Electronics Telecommun Ｃｎｔエミッタの製造方法
JP2009043981A (ja) * 2007-08-09 2009-02-26 Nissan Motor Co Ltd 電子部品用セラミックス基板及びその製造方法
JP2009117340A (ja) * 2007-11-07 2009-05-28 Samsung Electro-Mechanics Co Ltd 導電性ペースト及びこれを用いた印刷回路基板
JP2009187676A (ja) * 2008-02-01 2009-08-20 Toyota Motor Corp 負極活物質、リチウム二次電池、および負極活物質の製造方法
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JPWO2017033374A1 (ja) * 2015-08-24 2018-05-24 パナソニックＩｐマネジメント株式会社 導電性塗料組成物、導電性材料、導電性塗料組成物の製造方法、導電性材料の製造方法
JP2022179429A (ja) * 2021-05-21 2022-12-02 公益財団法人電磁材料研究所 ２次元構造複合材料およびその製造方法
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WO2023054332A1 (ja) * 2021-09-28 2023-04-06 国立大学法人東北大学 カーボンナノチューブ組成物、カーボンナノチューブ製造用の触媒、カーボンナノチューブの製造方法およびカーボンナノチューブ
WO2023053168A1 (ja) * 2021-09-28 2023-04-06 国立大学法人東北大学 カーボンナノチューブ組成物、カーボンナノチューブ製造用の触媒、カーボンナノチューブの製造方法およびカーボンナノチューブ

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JP2015164896A (ja) 2015-09-17
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US20130004752A1 (en) 2013-01-03
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MX2012005640A (es) 2012-09-07
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CN102648246B (zh) 2016-08-03
DE102009054427A1 (de) 2011-09-22
RU2012126142A (ru) 2013-12-27
AR080618A1 (es) 2012-04-25
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