KR20120098810A - 금속 또는 합금층에 탄소/주석 혼합물을 도포하기 위한 방법 - Google Patents

금속 또는 합금층에 탄소/주석 혼합물을 도포하기 위한 방법 Download PDF

Info

Publication number
KR20120098810A
KR20120098810A KR20127016548A KR20127016548A KR20120098810A KR 20120098810 A KR20120098810 A KR 20120098810A KR 20127016548 A KR20127016548 A KR 20127016548A KR 20127016548 A KR20127016548 A KR 20127016548A KR 20120098810 A KR20120098810 A KR 20120098810A
Authority
KR
South Korea
Prior art keywords
substrate
coating composition
metal particles
alloys
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR20127016548A
Other languages
English (en)
Korean (ko)
Inventor
우도 아들러
디르크 로데
이자벨 부레쉬
지안 왕
도미니크 프렉크만
헬게 슈미트
Original Assignee
케엠이 저머니 아게 운트 코. 카게
빌란트-베르케악티엔게젤샤프트
타이코 일렉트로닉스 에이엠피 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케엠이 저머니 아게 운트 코. 카게, 빌란트-베르케악티엔게젤샤프트, 타이코 일렉트로닉스 에이엠피 게엠베하 filed Critical 케엠이 저머니 아게 운트 코. 카게
Publication of KR20120098810A publication Critical patent/KR20120098810A/ko
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Materials For Medical Uses (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
KR20127016548A 2009-11-25 2010-10-01 금속 또는 합금층에 탄소/주석 혼합물을 도포하기 위한 방법 Abandoned KR20120098810A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910054427 DE102009054427B4 (de) 2009-11-25 2009-11-25 Verfahren zum Aufbringen von Gemengen aus Kohlenstoff und Metallpartikeln auf ein Substrat, nach dem Verfahren erhältliches Substrat und dessen Verwendung
DE102009054427.5 2009-11-25

Publications (1)

Publication Number Publication Date
KR20120098810A true KR20120098810A (ko) 2012-09-05

Family

ID=43502912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20127016548A Abandoned KR20120098810A (ko) 2009-11-25 2010-10-01 금속 또는 합금층에 탄소/주석 혼합물을 도포하기 위한 방법

Country Status (12)

Country Link
US (1) US20130004752A1 (https=)
EP (1) EP2504398A1 (https=)
JP (2) JP2013512167A (https=)
KR (1) KR20120098810A (https=)
CN (1) CN102648246B (https=)
AR (1) AR080618A1 (https=)
BR (1) BR112012012488A2 (https=)
DE (1) DE102009054427B4 (https=)
MX (1) MX2012005640A (https=)
RU (1) RU2525176C2 (https=)
TW (1) TW201134561A (https=)
WO (1) WO2011063778A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101386362B1 (ko) * 2012-09-27 2014-04-16 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009026655B3 (de) * 2009-06-03 2011-06-30 Linde Aktiengesellschaft, 80331 Verfahren zur Herstellung eines Metallmatrix-Verbundwerkstoffs, Metallmatrix-Verbundwerkstoff und seine Verwendung
US20120273255A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Corporation Electrical Conductors Having Organic Compound Coatings
CN103897446B (zh) * 2014-04-21 2016-04-06 江苏同创节能科技有限公司 一种高性能的复合石墨烯导电涂料
KR101591454B1 (ko) * 2014-10-07 2016-02-03 주식회사 동희홀딩스 금속 및 산화물로 하이브리드 코팅된 나노카본의 제조방법
DE102014114721B4 (de) 2014-10-10 2019-08-29 Harting Electric Gmbh & Co. Kg Elektrischer Steckverbinder und Verfahren zur Überwachung des Zustands einer Kontaktoberfläche eines elektrischen Steckverbinder-kontaktes
CN104312391A (zh) * 2014-10-14 2015-01-28 江苏华光粉末有限公司 一种石墨烯抗静电粉末涂料及其制备方法
CN104357788B (zh) * 2014-10-30 2017-01-25 安徽鼎恒再制造产业技术研究院有限公司 一种Ni‑Gr‑B纳米涂层及其制备方法
LU92758B1 (en) * 2015-06-29 2016-12-30 Luxembourg Inst Of Science And Tech (List) Carbon-nanotube-based composite coating and production method thereof
CN107849395A (zh) * 2015-08-24 2018-03-27 松下知识产权经营株式会社 导电性涂料组合物、导电性材料、导电性涂料组合物的制造方法、导电性材料的制造方法
DE102017201159A1 (de) * 2017-01-25 2018-07-26 Kjellberg-Stiftung Bauelement oder Halteelement, das für die Plasmabearbeitung von Werkstücken einsetzbar ist und ein Verfahren zu seiner Herstellung
CN108892507A (zh) * 2018-06-28 2018-11-27 滁州市经纬装备科技有限公司 一种用于户外避雷装置的表面涂层材料的制备方法
KR20200005454A (ko) * 2018-07-05 2020-01-15 어메이징 쿨 테크놀로지 코포레이션 그래핀 금속 복합재료의 제조방법
CN109852924B (zh) * 2019-02-28 2021-10-22 贾春德 一种纳米、纳微米碳材料增强超细晶粒表层组织的渗剂、制备方法和具有该表层组织的钢材
GB201908011D0 (en) 2019-06-05 2019-07-17 Silberline Ltd New product
CN110885976A (zh) * 2019-11-15 2020-03-17 唐山市兆寰冶金装备制造有限公司 一种激光带状纳米复合强化工艺
CN116745062A (zh) * 2021-02-05 2023-09-12 新加坡贺利氏材料私人有限公司 经涂覆的线材
CN113223773B (zh) * 2021-05-06 2022-07-01 上海超导科技股份有限公司 第二代高温超导带材及其制备方法
JP7837216B2 (ja) * 2021-05-21 2026-03-30 公益財団法人電磁材料研究所 ２次元構造複合材料およびその製造方法
WO2023053168A1 (ja) * 2021-09-28 2023-04-06 国立大学法人東北大学 カーボンナノチューブ組成物、カーボンナノチューブ製造用の触媒、カーボンナノチューブの製造方法およびカーボンナノチューブ
DE102022205343A1 (de) * 2022-05-30 2023-11-30 Sms Group Gmbh Verfahren zum Bearbeiten eines metallischen Werkstücks

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116708A (ja) * 1984-11-12 1986-06-04 呉羽化学工業株式会社 導電性フイルムおよびその製造方法
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US7138203B2 (en) * 2001-01-19 2006-11-21 World Properties, Inc. Apparatus and method of manufacture of electrochemical cell components
US8062697B2 (en) * 2001-10-19 2011-11-22 Applied Nanotech Holdings, Inc. Ink jet application for carbon nanotubes
AU2003291133A1 (en) * 2002-11-26 2004-06-18 Carbon Nanotechnologies, Inc. Carbon nanotube particulates, compositions and use thereof
JP4351120B2 (ja) * 2004-08-19 2009-10-28 シナノケンシ株式会社 金属粒子の製造方法
US7886813B2 (en) * 2005-06-29 2011-02-15 Intel Corporation Thermal interface material with carbon nanotubes and particles
JP2007016262A (ja) * 2005-07-06 2007-01-25 Nissan Motor Co Ltd カーボンナノチューブ含有複合材及びその製造方法
US8597453B2 (en) * 2005-12-05 2013-12-03 Manotek Instriments, Inc. Method for producing highly conductive sheet molding compound, fuel cell flow field plate, and bipolar plate
US20070145097A1 (en) * 2005-12-20 2007-06-28 Intel Corporation Carbon nanotubes solder composite for high performance interconnect
KR100748228B1 (ko) * 2006-02-28 2007-08-09 한국과학기술원 전기도금을 이용한 금속/탄소나노튜브 복합재료 제조방법
RU2318851C2 (ru) * 2006-03-24 2008-03-10 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт "Дельфин" Электропроводный лакокрасочный материал для антикоррозионной защиты металлических конструкций
WO2008015167A1 (de) * 2006-08-03 2008-02-07 Basf Se Dispersion zum aufbringen einer metallschicht
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
GB0622060D0 (en) * 2006-11-06 2006-12-13 Hexcel Composites Ltd Improved composite materials
KR100777113B1 (ko) * 2006-12-07 2007-11-19 한국전자통신연구원 미세패터닝이 가능한 고 신뢰성의 ｃｎｔ 에미터 제조 방법
JP4999072B2 (ja) * 2007-03-22 2012-08-15 古河電気工業株式会社 表面被覆材
JP2009043981A (ja) * 2007-08-09 2009-02-26 Nissan Motor Co Ltd 電子部品用セラミックス基板及びその製造方法
KR100915394B1 (ko) * 2007-10-12 2009-09-03 (주)태광테크 전기전도도 및 내마모성이 우수한 소재 및 그 제조방법
KR20090047328A (ko) * 2007-11-07 2009-05-12 삼성전기주식회사 도전성 페이스트 및 이를 이용한 인쇄회로기판
JP4725585B2 (ja) * 2008-02-01 2011-07-13 トヨタ自動車株式会社 負極活物質、リチウム二次電池、および負極活物質の製造方法
CN101553084B (zh) * 2008-04-01 2010-12-08 富葵精密组件(深圳)有限公司 线路基板及线路基板的制作方法
KR100974092B1 (ko) * 2008-05-30 2010-08-04 삼성전기주식회사 탄소나노튜브를 포함하는 도전성 페이스트 및 이를 이용한인쇄회로기판
KR101099237B1 (ko) * 2008-12-10 2011-12-27 엘에스전선 주식회사 전도성 페이스트와 이를 이용한 전도성 기판
CN101474899A (zh) * 2009-01-16 2009-07-08 南开大学 石墨烯-无机材料复合多层薄膜及其制备方法
DE102009026655B3 (de) * 2009-06-03 2011-06-30 Linde Aktiengesellschaft, 80331 Verfahren zur Herstellung eines Metallmatrix-Verbundwerkstoffs, Metallmatrix-Verbundwerkstoff und seine Verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101386362B1 (ko) * 2012-09-27 2014-04-16 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극

Also Published As

Publication number Publication date
RU2525176C2 (ru) 2014-08-10
EP2504398A1 (de) 2012-10-03
CN102648246A (zh) 2012-08-22
JP2013512167A (ja) 2013-04-11
BR112012012488A2 (pt) 2018-10-16
JP2015164896A (ja) 2015-09-17
TW201134561A (en) 2011-10-16
US20130004752A1 (en) 2013-01-03
DE102009054427B4 (de) 2014-02-13
MX2012005640A (es) 2012-09-07
JP6180457B2 (ja) 2017-08-16
CN102648246B (zh) 2016-08-03
DE102009054427A1 (de) 2011-09-22
RU2012126142A (ru) 2013-12-27
AR080618A1 (es) 2012-04-25
WO2011063778A1 (de) 2011-06-03

Similar Documents

Publication Publication Date Title
KR20120098810A (ko) 금속 또는 합금층에 탄소/주석 혼합물을 도포하기 위한 방법
JP2015164896A5 (https=)
JP5542829B2 (ja) カーボンナノチューブ、フラーレン及び／又はグラフェン含有コーティングの製造方法
Milowska et al. Carbon nanotube functionalization as a route to enhancing the electrical and mechanical properties of Cu–CNT composites
JP7397061B2 (ja) 金属－ｃｎｔ複合体、それらの製造方法及び材料
KR101075622B1 (ko) 탄소나노튜브 복합체
JP5270632B2 (ja) ナノカーボンと金属又はセラミックとの複合材料の生産方法
KR20110069820A (ko) 스트립 재료 상의 금속/ｃｎｔ 및/또는 풀러렌 조성물 코팅
Park et al. Enhanced thermal conductivity of epoxy/three-dimensional carbon hybrid filler composites for effective heat dissipation
JP4747839B2 (ja) 金属水素化物微粒子を含有する分散液及びその製造方法、並びに金属質材料
TWI361143B (en) Conductive ink and conductor
JP2016151029A (ja) 伝導性フィラー及びその製造方法並びに伝導性ペースト
US20140083753A1 (en) Method of forming copper wiring, method of manufacturing wiring board, and wiring board
Yaglioglu et al. Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors
KR20070044412A (ko) 반도성 및 금속성 탄소나노튜브의 분리방법
Zilaee et al. Improving the Electrical Conductivity of Multi-walled Carbon Nanotube Thin Films Using Ag-nanowires
Lee et al. Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee

St.27 status event code: A-2-2-U10-U14-oth-PC1904

St.27 status event code: N-2-6-B10-B12-nap-PC1904

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000