CN102648246B - 用于向金属或合金层涂覆碳/锡混合物的方法 - Google Patents

用于向金属或合金层涂覆碳/锡混合物的方法 Download PDF

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Publication number
CN102648246B
CN102648246B CN201080053385.8A CN201080053385A CN102648246B CN 102648246 B CN102648246 B CN 102648246B CN 201080053385 A CN201080053385 A CN 201080053385A CN 102648246 B CN102648246 B CN 102648246B
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CN
China
Prior art keywords
coating composition
substrate
application
carried out
out partially
Prior art date
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Active
Application number
CN201080053385.8A
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English (en)
Chinese (zh)
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CN102648246A (zh
Inventor
U.阿德勒
D.罗德
I.布里什
王建
D.弗莱克曼
H.施米特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
TE Connectivity Germany GmbH
Cunova GmbH
Original Assignee
Tyco Electronics AMP GmbH
KME Germany GmbH and Co KG
Wieland Werke AG
TE Connectivity Germany GmbH
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Publication of CN102648246A publication Critical patent/CN102648246A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Materials For Medical Uses (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
CN201080053385.8A 2009-11-25 2010-10-01 用于向金属或合金层涂覆碳/锡混合物的方法 Active CN102648246B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200910054427 DE102009054427B4 (de) 2009-11-25 2009-11-25 Verfahren zum Aufbringen von Gemengen aus Kohlenstoff und Metallpartikeln auf ein Substrat, nach dem Verfahren erhältliches Substrat und dessen Verwendung
DE102009054427.5 2009-11-25
PCT/DE2010/001165 WO2011063778A1 (de) 2009-11-25 2010-10-01 Verfahren zum aufbringen von kohlenstoff/zinn-gemengen auf metall- oder legierungsschichten

Publications (2)

Publication Number Publication Date
CN102648246A CN102648246A (zh) 2012-08-22
CN102648246B true CN102648246B (zh) 2016-08-03

Family

ID=43502912

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080053385.8A Active CN102648246B (zh) 2009-11-25 2010-10-01 用于向金属或合金层涂覆碳/锡混合物的方法

Country Status (12)

Country Link
US (1) US20130004752A1 (https=)
EP (1) EP2504398A1 (https=)
JP (2) JP2013512167A (https=)
KR (1) KR20120098810A (https=)
CN (1) CN102648246B (https=)
AR (1) AR080618A1 (https=)
BR (1) BR112012012488A2 (https=)
DE (1) DE102009054427B4 (https=)
MX (1) MX2012005640A (https=)
RU (1) RU2525176C2 (https=)
TW (1) TW201134561A (https=)
WO (1) WO2011063778A1 (https=)

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US20120273255A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Corporation Electrical Conductors Having Organic Compound Coatings
KR101386362B1 (ko) * 2012-09-27 2014-04-16 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극
CN103897446B (zh) * 2014-04-21 2016-04-06 江苏同创节能科技有限公司 一种高性能的复合石墨烯导电涂料
KR101591454B1 (ko) * 2014-10-07 2016-02-03 주식회사 동희홀딩스 금속 및 산화물로 하이브리드 코팅된 나노카본의 제조방법
DE102014114721B4 (de) 2014-10-10 2019-08-29 Harting Electric Gmbh & Co. Kg Elektrischer Steckverbinder und Verfahren zur Überwachung des Zustands einer Kontaktoberfläche eines elektrischen Steckverbinder-kontaktes
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CN104357788B (zh) * 2014-10-30 2017-01-25 安徽鼎恒再制造产业技术研究院有限公司 一种Ni‑Gr‑B纳米涂层及其制备方法
LU92758B1 (en) * 2015-06-29 2016-12-30 Luxembourg Inst Of Science And Tech (List) Carbon-nanotube-based composite coating and production method thereof
CN107849395A (zh) * 2015-08-24 2018-03-27 松下知识产权经营株式会社 导电性涂料组合物、导电性材料、导电性涂料组合物的制造方法、导电性材料的制造方法
DE102017201159A1 (de) * 2017-01-25 2018-07-26 Kjellberg-Stiftung Bauelement oder Halteelement, das für die Plasmabearbeitung von Werkstücken einsetzbar ist und ein Verfahren zu seiner Herstellung
CN108892507A (zh) * 2018-06-28 2018-11-27 滁州市经纬装备科技有限公司 一种用于户外避雷装置的表面涂层材料的制备方法
KR20200005454A (ko) * 2018-07-05 2020-01-15 어메이징 쿨 테크놀로지 코포레이션 그래핀 금속 복합재료의 제조방법
CN109852924B (zh) * 2019-02-28 2021-10-22 贾春德 一种纳米、纳微米碳材料增强超细晶粒表层组织的渗剂、制备方法和具有该表层组织的钢材
GB201908011D0 (en) 2019-06-05 2019-07-17 Silberline Ltd New product
CN110885976A (zh) * 2019-11-15 2020-03-17 唐山市兆寰冶金装备制造有限公司 一种激光带状纳米复合强化工艺
CN116745062A (zh) * 2021-02-05 2023-09-12 新加坡贺利氏材料私人有限公司 经涂覆的线材
CN113223773B (zh) * 2021-05-06 2022-07-01 上海超导科技股份有限公司 第二代高温超导带材及其制备方法
JP7837216B2 (ja) * 2021-05-21 2026-03-30 公益財団法人電磁材料研究所 ２次元構造複合材料およびその製造方法
WO2023053168A1 (ja) * 2021-09-28 2023-04-06 国立大学法人東北大学 カーボンナノチューブ組成物、カーボンナノチューブ製造用の触媒、カーボンナノチューブの製造方法およびカーボンナノチューブ
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
TW200815545A (en) * 2006-08-03 2008-04-01 Basf Ag Dispersion for application of a metal layer
CN101474899A (zh) * 2009-01-16 2009-07-08 南开大学 石墨烯-无机材料复合多层薄膜及其制备方法

Also Published As

Publication number Publication date
RU2525176C2 (ru) 2014-08-10
EP2504398A1 (de) 2012-10-03
CN102648246A (zh) 2012-08-22
JP2013512167A (ja) 2013-04-11
BR112012012488A2 (pt) 2018-10-16
JP2015164896A (ja) 2015-09-17
TW201134561A (en) 2011-10-16
US20130004752A1 (en) 2013-01-03
DE102009054427B4 (de) 2014-02-13
MX2012005640A (es) 2012-09-07
JP6180457B2 (ja) 2017-08-16
DE102009054427A1 (de) 2011-09-22
RU2012126142A (ru) 2013-12-27
AR080618A1 (es) 2012-04-25
KR20120098810A (ko) 2012-09-05
WO2011063778A1 (de) 2011-06-03

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