JP2013508902A - はんだフリーの電気的接続装置 - Google Patents
はんだフリーの電気的接続装置 Download PDFInfo
- Publication number
- JP2013508902A JP2013508902A JP2012534611A JP2012534611A JP2013508902A JP 2013508902 A JP2013508902 A JP 2013508902A JP 2012534611 A JP2012534611 A JP 2012534611A JP 2012534611 A JP2012534611 A JP 2012534611A JP 2013508902 A JP2013508902 A JP 2013508902A
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- Japan
- Prior art keywords
- insertion member
- electrical connection
- connection device
- coating
- osp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
独国公開第102005005127号明細書から、電気コンタクトおよび電気コンタクトの製造方法が公知である。ここでの電気コンタクトは冷間コンタクト技術のための電気コンタクトであり、コーティングの設けられた金属基板を含む。コーティングは炭素粒子および/またはポリマーを金属中に分散させたものから成っている。この手段により、電気コンタクトが有利には差し込みコンタクトとして形成される。冷間コンタクト技術では2つの挿入部材が圧着されるが、これは、圧接コンタクトの形態で行われるかまたは圧接技術によって行われる。例えば、ピンを、コーティングを備えたクランプ部もしくはスリーブ部に挿入し、所定のチップ形状が発生するようにする。当該の独国公開第102005005127号明細書によれば、コーティングは、1つの挿入部材に設けても双方の挿入部材に設けてもよい。
本発明で提案される解決手段によれば、圧着技術の適用時に端子ピンの大きな領域にOSPコーティングを被着することにより、錫ウィスカの発生のリスクを最小化し、OSPコーティングを有する配線板でこれを完全に回避することができる。本発明で提案される解決手段によれば、錫のチップ形成も回避され、最初の試行によって、錫もしくはニッケルでめっきされた端子ピンに比べ、小さな圧着力で、一定特性の圧着力を達成することができる。これにより、配線板の孔の金属化部の損傷も最小化される。
以下において、OSPコーティングとは、配線板技術で通常用いられる、有機パシベーション層(オーガニックソルダラビリティプリザバティブ)のことであると理解されたい。OSPコーティングは特に選択的に作用するCu配位化合物であり、例えば、フェニルイミドアゾール、ベンズイミドアゾール、アミノチオール、アセテート、ポリアルコール、ジケトン、または、その他の物質である。
Claims (12)
- 電気素子もしくは打ち抜き板の接続のために、第1の挿入部材(10,46)と第2の挿入部材(24,26;44)とをはんだ無しで電気的に接続する
電気的接続装置(42)において、
前記第1の挿入部材(10,46)もしくは前記第2の挿入部材(24,44)、または、前記第1の挿入部材および前記第2の挿入部材双方(10,44;24,26,46)において、該挿入部材のコンタクト面(14,48,54;32,34,50)に、OSPコーティング(56)が設けられる
ことを特徴とする電気的接続装置(42)。 - 前記第1の挿入部材は、端子ピン(10)であるか、または、金属化部(54)を有する圧接部(46)もしくは金属化部を有さない圧接部(46)である、請求項1記載の電気的接続装置(42)。
- 前記第1の挿入部材(10,46)は、CuもしくはCu合金から形成されており、さらに金属化層(54)を有する、請求項2記載の電気的接続装置(42)。
- 前記第2の挿入部材は、配線板(26)内のコーティング(34)を有する孔(24)であるか、または、配線板(26)内のコーティングなしのCu金属化部を有する孔(24)である、請求項1記載の電気的接続装置(42)。
- 前記第2の挿入部材はワイヤ(44)であり、さらに酸化防止層(50)を有する、請求項1記載の電気的接続装置(42)。
- 前記配線板(26)内の孔(24)はスリーブ状のCuから成る金属化部(32)を有しており、該金属化部は、電解によって堆積されており、かつ、その上に、例えばNi,Au,Sn,Agから成るコーティング(34)を有するかまたは有機パシベーション層OSP(56)を有する、請求項4記載の電気的接続装置(42)。
- 前記第1の挿入部材(10,46)の前記OSPコーティング(56)は電解プレ銅めっきされている、請求項2記載の電気的接続装置(42)。
- 前記第1の挿入部材(10,46)、または、前記第1の挿入部材および前記第2の挿入部材の双方(10,44;24,26,46)は、前記OSPコーティング(56)の設けられたコンタクト面(14,48,54,32,34,44,50)で、電解プレ銅めっきされている、請求項1記載の電気的接続装置(42)。
- 前記第1の挿入部材(46)は、弾性の切欠領域(48)、例えばV字状ノッチを有し、該切欠領域のコンタクト面は電解プレ銅めっきされている、請求項5記載の電気的接続装置(42)。
- 前記第1の挿入部材(10,46)の箇所もしくは前記第2の挿入部材(24,26,44)の箇所の前記酸化防止層(50,54)は前記OSPコーティング(56)である、請求項3記載の電気的接続装置(42)。
- 前記OSPコーティング(56)は選択的に作用する少なくとも1つのCu配位化合物を含む、請求項1記載の電気的接続装置(42)。
- 前記選択的に作用する少なくとも1つのCu配位化合物は、フェニルイミドアゾール、ベンズイミドアゾール、アミノチオール、アセテート、ポリアルコール、および/または、ジケトンのグループから選定される、請求項11記載の電気的接続装置(42)。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009045806 | 2009-10-19 | ||
DE102009045806.9 | 2009-10-19 | ||
DE102009047043A DE102009047043A1 (de) | 2009-10-19 | 2009-11-24 | Lötfreie elektrische Verbindung |
DE102009047043.3 | 2009-11-24 | ||
PCT/EP2010/064726 WO2011047953A1 (de) | 2009-10-19 | 2010-10-04 | Lötfreie elektrische verbindung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013508902A true JP2013508902A (ja) | 2013-03-07 |
JP5599466B2 JP5599466B2 (ja) | 2014-10-01 |
Family
ID=43798723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012534611A Expired - Fee Related JP5599466B2 (ja) | 2009-10-19 | 2010-10-04 | はんだフリーの電気的接続装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8932090B2 (ja) |
EP (1) | EP2491620A1 (ja) |
JP (1) | JP5599466B2 (ja) |
CN (1) | CN102668247B (ja) |
DE (1) | DE102009047043A1 (ja) |
IN (1) | IN2012DN00433A (ja) |
WO (1) | WO2011047953A1 (ja) |
Cited By (1)
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JP2018181735A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社デンソー | プレスフィット端子、電子装置、及びコネクタ |
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DE102011077915A1 (de) * | 2011-06-21 | 2012-12-27 | Robert Bosch Gmbh | Einpresspin für eine elektrische Einpressverbindung zwischen einer elektronischen Komponente und einer Substratplatte |
KR20130007124A (ko) * | 2011-06-29 | 2013-01-18 | 삼성전자주식회사 | 유기 보호막을 갖는 조인트 구조 |
US20140165389A1 (en) * | 2012-12-14 | 2014-06-19 | Byung Tai Do | Integrated circuit packaging system with routable grid array lead frame |
DE102013209407B4 (de) * | 2013-05-22 | 2023-08-31 | Robert Bosch Gmbh | Verfahren zur lötfreien elektrischen Einpresskontaktierung von elektrisch leitfähigen Einpress-Stiften in Leiterplatten |
US8974245B2 (en) | 2013-08-05 | 2015-03-10 | Hubbell Incorporated | Grounding electrical connector |
FR3011691B1 (fr) * | 2013-10-04 | 2017-05-12 | Axon Cable Sa | Procede de fabrication de contact electrique, et contact electrique correspondant |
KR102143890B1 (ko) * | 2013-10-15 | 2020-08-12 | 온세미컨덕터코리아 주식회사 | 파워 모듈 패키지 및 이의 제조 방법 |
DE102014200212A1 (de) | 2014-01-09 | 2015-01-15 | Ifm Electronic Gmbh | Lötfreie elektrische Verbindung und Messgerät mit einer solchen Verbindung |
CN104918417A (zh) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | 一种在线路板表面制作有机保焊膜的方法 |
DE102015119785B4 (de) | 2015-11-04 | 2020-03-26 | ept Holding GmbH & Co. KG | Lochkontur für Einpresstechnik in ein Stanzgitter |
DE202015008773U1 (de) | 2015-12-22 | 2016-01-28 | Continental Automotive Gmbh | Steckkontakt mit organischer Beschichtung und Leiterplattenanordnung |
JP6711262B2 (ja) * | 2016-12-26 | 2020-06-17 | 株式会社デンソー | 電子装置 |
WO2019012050A1 (de) | 2017-07-12 | 2019-01-17 | ept Holding GmbH & Co. KG | Einpressstift und verfahren zu dessen herstellung |
DE102017116936A1 (de) * | 2017-07-26 | 2019-01-31 | Ledvance Gmbh | Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels |
DE102018109059B4 (de) | 2018-01-15 | 2020-07-23 | Doduco Solutions Gmbh | Elektrischer Einpress-Kontaktstift |
EP3544121B1 (en) * | 2018-03-19 | 2022-05-04 | Mahle International GmbH | Electrical heating device |
DE102018220773A1 (de) * | 2018-12-03 | 2020-06-04 | Robert Bosch Gmbh | Kontaktelement |
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-
2009
- 2009-11-24 DE DE102009047043A patent/DE102009047043A1/de not_active Withdrawn
-
2010
- 2010-10-04 US US13/502,795 patent/US8932090B2/en not_active Expired - Fee Related
- 2010-10-04 JP JP2012534611A patent/JP5599466B2/ja not_active Expired - Fee Related
- 2010-10-04 CN CN201080047001.1A patent/CN102668247B/zh not_active Expired - Fee Related
- 2010-10-04 IN IN433DEN2012 patent/IN2012DN00433A/en unknown
- 2010-10-04 EP EP10771044A patent/EP2491620A1/de not_active Withdrawn
- 2010-10-04 WO PCT/EP2010/064726 patent/WO2011047953A1/de active Application Filing
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JPS4973691A (ja) * | 1972-10-19 | 1974-07-16 | ||
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WO2002023677A1 (de) * | 2000-09-13 | 2002-03-21 | Robert Bosch Gmbh | Anschlussstift, hülse und elektrisch leitende verbindung |
US20080173470A1 (en) * | 2005-10-03 | 2008-07-24 | Michael Barbetta | Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards |
WO2009005042A1 (ja) * | 2007-06-29 | 2009-01-08 | The Furukawa Electric Co., Ltd. | 金属材料、その製造方法、及びそれを用いた電気電子部品 |
JP2009016064A (ja) * | 2007-07-02 | 2009-01-22 | Alpha- Design Kk | 通電部の腐食とコネクタの脱落を防止する基板とコネクタの端子及びその搭載方法 |
Cited By (1)
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JP2018181735A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社デンソー | プレスフィット端子、電子装置、及びコネクタ |
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EP2491620A1 (de) | 2012-08-29 |
DE102009047043A1 (de) | 2011-04-21 |
WO2011047953A1 (de) | 2011-04-28 |
CN102668247A (zh) | 2012-09-12 |
US8932090B2 (en) | 2015-01-13 |
JP5599466B2 (ja) | 2014-10-01 |
IN2012DN00433A (ja) | 2015-05-15 |
CN102668247B (zh) | 2015-06-10 |
US20120270432A1 (en) | 2012-10-25 |
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