IN2012DN00433A - - Google Patents
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- Publication number
- IN2012DN00433A IN2012DN00433A IN433DEN2012A IN2012DN00433A IN 2012DN00433 A IN2012DN00433 A IN 2012DN00433A IN 433DEN2012 A IN433DEN2012 A IN 433DEN2012A IN 2012DN00433 A IN2012DN00433 A IN 2012DN00433A
- Authority
- IN
- India
- Prior art keywords
- joining partner
- subject matter
- joining
- present subject
- partner
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The present subject matter relates to a solderless electrical connection (42) between a first joining partner (10, 46) and a second joining partner (24, 26; 44) for connecting an electrical component, a connector strip or a lead frame. According to the present subject matter, the first joining partner (10, 46) or both joining partners (10, 46, 24, 26, 44) have an OSP coating (56) on their respective contact surfaces (14, 48, 54, 34, 50).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009045806 | 2009-10-19 | ||
DE102009047043A DE102009047043A1 (en) | 2009-10-19 | 2009-11-24 | Solderless electrical connection |
PCT/EP2010/064726 WO2011047953A1 (en) | 2009-10-19 | 2010-10-04 | Solderless electrical connection |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DN00433A true IN2012DN00433A (en) | 2015-05-15 |
Family
ID=43798723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN433DEN2012 IN2012DN00433A (en) | 2009-10-19 | 2010-10-04 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8932090B2 (en) |
EP (1) | EP2491620A1 (en) |
JP (1) | JP5599466B2 (en) |
CN (1) | CN102668247B (en) |
DE (1) | DE102009047043A1 (en) |
IN (1) | IN2012DN00433A (en) |
WO (1) | WO2011047953A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011077915A1 (en) * | 2011-06-21 | 2012-12-27 | Robert Bosch Gmbh | Press-in pin for an electrical press-fit connection between an electronic component and a substrate plate |
KR20130007124A (en) * | 2011-06-29 | 2013-01-18 | 삼성전자주식회사 | Joint structure having an organic preservative film |
US20140165389A1 (en) * | 2012-12-14 | 2014-06-19 | Byung Tai Do | Integrated circuit packaging system with routable grid array lead frame |
DE102013209407B4 (en) * | 2013-05-22 | 2023-08-31 | Robert Bosch Gmbh | Process for solder-free electrical press-in contacting of electrically conductive press-in pins in printed circuit boards |
US8974245B2 (en) | 2013-08-05 | 2015-03-10 | Hubbell Incorporated | Grounding electrical connector |
FR3011691B1 (en) * | 2013-10-04 | 2017-05-12 | Axon Cable Sa | METHOD FOR MANUFACTURING ELECTRIC CONTACT AND CORRESPONDING ELECTRICAL CONTACT |
KR102143890B1 (en) | 2013-10-15 | 2020-08-12 | 온세미컨덕터코리아 주식회사 | Power module package and method for manufacturing the same |
DE102014200212A1 (en) | 2014-01-09 | 2015-01-15 | Ifm Electronic Gmbh | Solderless electrical connection and measuring device with such a connection |
CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
DE102015119785B4 (en) | 2015-11-04 | 2020-03-26 | ept Holding GmbH & Co. KG | Hole contour for press-fit technology in a lead frame |
DE202015008773U1 (en) | 2015-12-22 | 2016-01-28 | Continental Automotive Gmbh | Plug contact with organic coating and printed circuit board arrangement |
JP6711262B2 (en) * | 2016-12-26 | 2020-06-17 | 株式会社デンソー | Electronic device |
JP2018181735A (en) * | 2017-04-19 | 2018-11-15 | 株式会社デンソー | Press-fit terminal, electronic equipment, and connector |
DE112018003539A5 (en) | 2017-07-12 | 2020-03-26 | ept Holding GmbH & Co. KG | Press-in pin and method for its production |
DE102017116936A1 (en) * | 2017-07-26 | 2019-01-31 | Ledvance Gmbh | Connection of an electrical conducting element with a printed circuit board of a lighting means |
DE102018109059B4 (en) | 2018-01-15 | 2020-07-23 | Doduco Solutions Gmbh | Electrical press-in contact pin |
EP3544121B1 (en) * | 2018-03-19 | 2022-05-04 | Mahle International GmbH | Electrical heating device |
DE102018220773A1 (en) * | 2018-12-03 | 2020-06-04 | Robert Bosch Gmbh | Contact element |
US10756009B1 (en) * | 2019-09-18 | 2020-08-25 | International Business Machines Corporation | Efficient placement of grid array components |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3783433A (en) * | 1971-01-18 | 1974-01-01 | Litton Systems Inc | Solderless electrical connection system |
US3821692A (en) * | 1972-10-19 | 1974-06-28 | Bell Telephone Labor Inc | Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer |
US4116522A (en) * | 1976-07-09 | 1978-09-26 | Amp Incorporated | Slotted terminal |
US4220390A (en) * | 1978-07-25 | 1980-09-02 | Amp Incorporated | Terminating means for terminating more than one wire in a single slotted terminal |
US4381134A (en) * | 1981-03-13 | 1983-04-26 | Bell Telephone Laboratories, Incorporated | Electrical connector for plated-through holes |
US4395294A (en) * | 1981-08-17 | 1983-07-26 | Bell Telephone Laboratories, Incorporated | Copper corrosion inhibitor |
US4526429A (en) * | 1983-07-26 | 1985-07-02 | Augat Inc. | Compliant pin for solderless termination to a printed wiring board |
DE3837206C2 (en) * | 1988-11-02 | 1998-07-23 | Bosch Gmbh Robert | Electrical switching device |
JPH04280697A (en) * | 1991-03-08 | 1992-10-06 | Fujitsu Ltd | Printed wiring board and manufacture thereof |
TW270944B (en) | 1993-05-10 | 1996-02-21 | Shikoku Kakoki Co Ltd | |
JP3277025B2 (en) * | 1993-05-10 | 2002-04-22 | 四国化成工業株式会社 | Copper and copper alloy surface treatment agent |
JP3367743B2 (en) * | 1994-03-08 | 2003-01-20 | 四国化成工業株式会社 | Copper and copper alloy surface treatment agent |
CN2308972Y (en) * | 1997-05-05 | 1999-02-24 | 黄福庭 | Combined film-broken card connecting terminal of wire |
US6206735B1 (en) * | 1998-08-28 | 2001-03-27 | Teka Interconnection Systems, Inc. | Press fit print circuit board connector |
DE10045233A1 (en) * | 2000-09-13 | 2002-03-28 | Bosch Gmbh Robert | Terminal pin, sleeve and electrically conductive connection |
DE10256719A1 (en) * | 2002-12-04 | 2004-07-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electrical contact structure with a carrier of insulating thermoplastic that has contact slot coated with metal |
US7097462B2 (en) * | 2004-06-29 | 2006-08-29 | Intel Corporation | Patch substrate for external connection |
KR101071257B1 (en) * | 2004-09-17 | 2011-10-10 | 삼성전자주식회사 | Multi-domain thin film transistor array panel and liquid crystal display including the same |
DE102005005127A1 (en) | 2005-02-04 | 2006-08-10 | Robert Bosch Gmbh | Electrical contact and method for its production |
US20080173470A1 (en) * | 2005-10-03 | 2008-07-24 | Michael Barbetta | Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards |
DE102005062601A1 (en) | 2005-12-27 | 2007-07-05 | Robert Bosch Gmbh | Electrical appliance with lubricated joint has at least one joint position with first joint partner, especially sleeve, and second joint partner, especially pin, whereby joint position has joint between two joint partners |
JP2007311092A (en) * | 2006-05-17 | 2007-11-29 | Yazaki Corp | Printed circuit board assembly, and manufacturing method thereof |
DE102006027748A1 (en) * | 2006-06-16 | 2007-12-20 | Robert Bosch Gmbh | Printed circuit board for airbag control device of motor vehicle, has protection section that has passage openings for pressing pins, where passage openings of section lie over passage openings of pressing sockets |
US20080268267A1 (en) * | 2007-04-27 | 2008-10-30 | Michael Barbetta | Combined solderable multi-purpose surface finishes on circuit boards and method of manufacture of such boards |
KR101505698B1 (en) * | 2007-06-29 | 2015-03-30 | 후루카와 덴키 고교 가부시키가이샤 | Metal material, method for producing the same, and electrical electronic component using the same |
JP5041893B2 (en) * | 2007-07-02 | 2012-10-03 | アルファーデザイン株式会社 | Board and connector terminals for preventing corrosion of current-carrying parts and connector dropout, and mounting method thereof |
US20090239398A1 (en) * | 2008-03-20 | 2009-09-24 | Interplex Nas, Inc. | Press fit (compliant) terminal and other connectors with tin-silver compound |
DE202008006750U1 (en) * | 2008-05-19 | 2008-07-17 | Phoenix Contact Gmbh & Co. Kg | Contact unit |
-
2009
- 2009-11-24 DE DE102009047043A patent/DE102009047043A1/en not_active Withdrawn
-
2010
- 2010-10-04 WO PCT/EP2010/064726 patent/WO2011047953A1/en active Application Filing
- 2010-10-04 IN IN433DEN2012 patent/IN2012DN00433A/en unknown
- 2010-10-04 JP JP2012534611A patent/JP5599466B2/en not_active Expired - Fee Related
- 2010-10-04 EP EP10771044A patent/EP2491620A1/en not_active Withdrawn
- 2010-10-04 CN CN201080047001.1A patent/CN102668247B/en not_active Expired - Fee Related
- 2010-10-04 US US13/502,795 patent/US8932090B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102668247A (en) | 2012-09-12 |
EP2491620A1 (en) | 2012-08-29 |
US8932090B2 (en) | 2015-01-13 |
DE102009047043A1 (en) | 2011-04-21 |
JP2013508902A (en) | 2013-03-07 |
CN102668247B (en) | 2015-06-10 |
US20120270432A1 (en) | 2012-10-25 |
WO2011047953A1 (en) | 2011-04-28 |
JP5599466B2 (en) | 2014-10-01 |
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