JP2013243360A - 亜鉛金属及び過酸化亜鉛の反応接合により形成される層状の接合構造 - Google Patents
亜鉛金属及び過酸化亜鉛の反応接合により形成される層状の接合構造 Download PDFInfo
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- 239000011701 zinc Substances 0.000 title claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 43
- 239000002184 metal Substances 0.000 title claims abstract description 43
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052725 zinc Inorganic materials 0.000 title claims abstract description 41
- DLINORNFHVEIFE-UHFFFAOYSA-N hydrogen peroxide;zinc Chemical compound [Zn].OO DLINORNFHVEIFE-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229940105296 zinc peroxide Drugs 0.000 title claims abstract description 38
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 106
- 239000011787 zinc oxide Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 48
- 230000003647 oxidation Effects 0.000 claims description 15
- 238000007254 oxidation reaction Methods 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 6
- 229910001882 dioxygen Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 45
- 239000010410 layer Substances 0.000 description 38
- 239000000463 material Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 21
- 238000005304 joining Methods 0.000 description 12
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002238 carbon nanotube film Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31536—Including interfacial reaction product of adjacent layers
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- General Physics & Mathematics (AREA)
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Abstract
亜鉛金属及び過酸化亜鉛との反応接合から形成される層状の接合構造の方法、システム、及び装置を提供すること。
【解決手段】
亜鉛金属及び過酸化亜鉛との間の反応接合によって形成される層状接合構造のシステム、方法、及び装置が本明細書に開示されている。具体的には本発明は、2つの構造が酸化亜鉛を含む層と接合する層状接合構造を教示する。酸化亜鉛は、圧力下で構造を接触させ、構造を加熱して、2つの構造のうちの一方又は両方の過酸化亜鉛及び亜鉛金属の反応を促進することによって、2つの構造を処理することを含む方法を通して形成される。
【選択図】なし
Description
1)薄い金属の界面層、2)薄いポリマー膜、3)直接酸化物接合機構を有する透明導電酸化物、4)高濃度にドープされたIII−V界面層、及び5)透明カーボンナノチューブ膜等の材料を用いるこれらの材料を用いる方法にはしかしながら、様々な制限が生じる。例えば、層を高度に研磨しなければならない、又は処理に高レベルのエネルギーを要する。
(1) 2Zn + 2O → 2ZnO
(2) 2ZnO2 → 2ZnO + 2O
(3) Zn + ZnO2 → 2ZnO
20 第2構造
30 過酸化亜鉛
40 亜鉛金属
50 酸化亜鉛
60 層状構造
Claims (13)
- 接合層状構造(60)を形成する方法であって、
第1構造(10)及び第2構造(20)を供給し、
第1構造(10)及び第2構造(20)のうちの少なくとも一つに過酸化亜鉛(30)を含む第1層を形成し、
第1構造(10)及び第2構造(20)のうちの少なくとも一つに亜鉛金属(40)を含む第2層を形成し、
第1構造及び第2構造の間で第1層が第2層に接触するように第1構造(10)及び第2構造(20)を接触させ、
接触した第1構造及び第2構造を処理して、亜鉛金属(40)を酸化させ、
接触した第1構造及び第2構造の間に酸化亜鉛(50)を含む第3層を形成する
ことを含む方法。 - 前記接触した層を処理することは、前記接触した層を100〜400℃の範囲の温度で加熱することを含む、請求項1に記載の方法。
- 前記接触した層を処理することは、前記接触した層を5〜80psiの範囲で加圧することを含む、請求項1に記載の方法。
- 前記酸化亜鉛は、前記亜鉛金属の酸化、又は熱的に誘導された前記過酸化亜鉛の転換反応によって形成される、請求項1に記載の方法。
- 前記酸化は、前記過酸化亜鉛によって供給される酸素によって起こる、請求項4に記載の方法。
- 前記酸化は、前記接触した層に供給される酸素ガスによって起こる、請求項4に記載の方法。
- 前記第1構造及び第2構造のうちの少なくとも一つはウェハからなる、請求項1乃至6のいずれか1項に記載の方法。
- 接合層状構造(60)であって、
第1構造(10)及び第2構造(20)と、
前記第1構造(10)及び第2構造(20)との間で前記第1構造(10)及び第2構造(20)の両方と接触する酸化亜鉛(50)を含む層であって、前記酸化亜鉛(50)は、亜鉛金属(40)の酸化によって前記第1構造(10)及び第2構造(20)のうちの少なくとも一つに形成される層
を含む層状構造(60)。 - 前記酸化亜鉛(50)は、前記第1構造(10)及び第2構造(20)を100〜400℃の範囲の温度に晒すことによって形成される、請求項8に記載の層状構造。
- 前記酸化亜鉛(50)は、5〜80psiの範囲で加圧することによって、前記第1構造(10)及び第2構造(20)と接触させることにより形成される、請求項8に記載の層状構造。
- 前記酸化亜鉛(50)は、過酸化亜鉛(30)により前記第1構造(10)及び第2構造(20)のうちの少なくとも一つに形成される、請求項8乃至10のいずれか1項に記載の層状構造。
- 前記酸化亜鉛(50)は、前記第1構造(10)及び第2構造(20)に供給される酸素ガスによって形成される、請求項8に記載の層状構造。
- 前記第1構造(10)及び第2構造(20)のうちの少なくとも一つがウェハ、半導体、又は太陽電池を備える、請求項8乃至12のいずれか1項に記載の層状構造。
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US13/471,306 US9105561B2 (en) | 2012-05-14 | 2012-05-14 | Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide |
US13/471,306 | 2012-05-14 |
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JP2018031600A Division JP2018093222A (ja) | 2012-05-14 | 2018-02-26 | 亜鉛金属及び過酸化亜鉛の反応接合により形成される層状の接合構造 |
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JP2013243360A true JP2013243360A (ja) | 2013-12-05 |
JP2013243360A5 JP2013243360A5 (ja) | 2016-06-02 |
JP6351211B2 JP6351211B2 (ja) | 2018-07-04 |
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JP2018031600A Pending JP2018093222A (ja) | 2012-05-14 | 2018-02-26 | 亜鉛金属及び過酸化亜鉛の反応接合により形成される層状の接合構造 |
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US (2) | US9105561B2 (ja) |
EP (1) | EP2665088B1 (ja) |
JP (2) | JP6351211B2 (ja) |
KR (1) | KR102082009B1 (ja) |
CN (1) | CN103426725B (ja) |
Cited By (2)
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JPWO2020144992A1 (ja) * | 2019-01-07 | 2020-07-16 |
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FR3117666B1 (fr) * | 2020-12-15 | 2022-10-28 | Commissariat Energie Atomique | Procede de fabrication d’une structure semi-conductrice comprenant une zone d’interface incluant des agglomerats |
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Also Published As
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JP6351211B2 (ja) | 2018-07-04 |
EP2665088A3 (en) | 2014-06-04 |
US9978893B2 (en) | 2018-05-22 |
CN103426725A (zh) | 2013-12-04 |
CN103426725B (zh) | 2017-10-27 |
KR20130127361A (ko) | 2013-11-22 |
EP2665088A2 (en) | 2013-11-20 |
US20130302622A1 (en) | 2013-11-14 |
US9105561B2 (en) | 2015-08-11 |
EP2665088B1 (en) | 2021-06-02 |
JP2018093222A (ja) | 2018-06-14 |
US20150303316A1 (en) | 2015-10-22 |
KR102082009B1 (ko) | 2020-02-26 |
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