JP2013239701A - キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板 - Google Patents
キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板 Download PDFInfo
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- JP2013239701A JP2013239701A JP2013057190A JP2013057190A JP2013239701A JP 2013239701 A JP2013239701 A JP 2013239701A JP 2013057190 A JP2013057190 A JP 2013057190A JP 2013057190 A JP2013057190 A JP 2013057190A JP 2013239701 A JP2013239701 A JP 2013239701A
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Abstract
【解決手段】本発明によれば、金属箔または樹脂フィルムからなるキャリア材料と、前記キャリア材料の一方の面に設けられた層間絶縁膜と、を備えるキャリア材料付き層間絶縁膜であって、前記層間絶縁膜は、樹脂が含浸された基材からなり、前記基材の厚さは、8μm以上、20μm以下であり、前記樹脂を170℃で1時間、30kgf/cm2の圧力で硬化したとき、TMA法を用いて測定した、前記層間絶縁膜の平面方向の伸び率が0.05%以下である、キャリア材料付き層間絶縁膜が提供される。
【選択図】図1
Description
本発明のキャリア材料付き層間絶縁膜は、厚さが8μm以上、20μm以下の基材を使用している。これにより、樹脂のみで構成された材料(RCC)に比べて剛性に優れ、部品実装時の信頼性を向上することが可能である。
また、200℃での貯蔵弾性率が、室温下における貯蔵弾性率に対して、30%以上、80%以下の保持率であってもよい。保持率がこの範囲内にあれば、薄型のプリント回路板であっても、部品実装時の260℃から300℃の熱履歴により、部品の重量のために回路板が変形することがなく、確実な実装を行うことができる。
このキャリア材料付き層間絶縁膜100は、キャリア材料が樹脂フィルムである場合、内層回路基板に積層する際に樹脂フィルムを剥離して使用する。この層間絶縁膜と内層回路基板とを積層し、これらを通常の真空プレスにより加熱加圧し、層間絶縁膜123の樹脂を硬化させて、多層プリント回路板を形成することができる。
臭素化フェノキシ樹脂(臭素化率25%、平均分子量25000〜30000)10重量部(以下、配合量は全て重量部を表す)、ビスフェノールF型エポキシ樹脂(エポキシ当量175、大日本インキ化学(株)製 エピクロン830)10部、ビスフェノールA型エポキシ樹脂(エポキシ当量190、ジャパンエポキシレジン(株)製 828)20部、オルソクレゾールノボラック型エポキシ樹脂(エポキシ当量220、大日本インキ化学(株)製 エピクロンN−690)25部、およびナフタレン型エポキシ樹脂(エポキシ当量170、大日本インキ化学(株)製 HP−4700)30部を、メチルエチルケトン(MEK)に溶解し、混合した。この混合物に、硬化剤としてのジシアンジアミド5重量部、エポキシシランカップリング剤(日本ユニカー(株)製 A−187)0.3重量部、および水酸化アルミニウム(HP−350 昭和電工(株)製)30部を添加して樹脂ワニスを作製した。
水酸化アルミニウに代えてシリカ(アドマテックス(株)製 SO−25R)を用いた以外は実施例1と同様にして多層プリント回路板を作製した。
ビスフェノールA型エポキシ樹脂(エポキシ当量190、ジャパンエポキシレジン(株)製 828)10部、オルソクレゾールノボラック型エポキシ樹脂(エポキシ当量220、大日本インキ化学(株)製 エピクロンN−690)30部、ナフタレン型エポキシ樹脂(エポキシ当量170、大日本インキ化学(株)製 HP−4700)35部を用いた以外は実施例1と同様にして多層プリント回路板を得た。
ビスフェノールA型エポキシ樹脂(エポキシ当量190、ジャパンエポキシレジン(株)製 828)40部、オルソクレゾールノボラック型エポキシ樹脂(エポキシ当量220、大日本インキ化学(株)製 エピクロンN−690)10部、ナフタレン型エポキシ樹脂(エポキシ当量170、大日本インキ化学(株)製 HP−4700)5部を用いた以外は実施例1と同様にして多層プリント回路板を得た。
ビフェニル型エポキシ樹脂(エポキシ当量166、日本化薬(株)製 NC−3000H)20部を追加した以外は実施例1と同様にして多層プリント回路板を得た。
ホウ酸アルミニウム(YS−3A)を無機フィラーとして60部配合し、臭素化フェノキシ樹脂(臭素化率25%、平均分子量25000〜30000)30重量部(以下、配合量は全て重量部を表す)とビスフェノールF型エポキシ樹脂(エポキシ当量175、大日本インキ化学(株)製 エピクロン830)10部用い、硬化剤・硬化促進剤を用いた以外は実施例1と同様にして多層プリント回路板を得た。
通常の0.06mm厚のプリプレグ(基材厚0.05mm)、および12μm厚の銅箔を用いて、実施例1と同様にして、銅箔付プリプレグを得た。実施例1と同様にして、この銅箔付プリプレグと内層回路板を用いて、多層プリント回路板を作製した。
1.層間絶縁膜の調製:上記で得られるBステージ化された層間絶縁膜を備える銅箔付き層間絶縁膜を、350mm×350mm(X方向×Y方向)の寸法に切り出し、170℃で1時間、30kgf/cm2の圧力で加熱し、層間絶縁膜をCステージ化した。ここで、Cステージ化とは、樹脂ワニスに含まれるエポキシ樹脂の反応率が90%以上であることをいう。このCステージ化した層間絶縁膜を備える銅箔付き層間絶縁膜を、5mm×20mm(X方向×Y方向)に切り出した。次いで、この銅箔付き層間絶縁膜の銅箔を、エッチングにより除去して、厚さ30μmの層間絶縁膜試験片を得た。ここで、X方向とは、銅箔付き層間絶縁膜の長手軸方向をいい、Y方向とは銅箔付き層間絶縁膜の幅方向をいう。
110 キャリア材料
120 樹脂
121 樹脂ワニス
123 層間絶縁膜
130 基材
140 ロール
本発明のキャリア材料付き層間絶縁膜は、厚さが8μm以上、20μm以下の基材を使用し、当該基材に含浸される樹脂は、ビスフェノールA型エポキシ樹脂またはビスフェノールF型エポキシ樹脂と、ナフタレン型エポキシ樹脂と、を含む。これにより、樹脂のみで構成された材料(RCC)に比べて剛性に優れ、部品実装時の信頼性を向上することが可能である。
このキャリア材料付き層間絶縁膜100は、キャリア材料が樹脂フィルムである場合、内層回路基板に積層する際に樹脂フィルムを剥離して使用する。この層間絶縁膜と内層回路基板とを積層し、これらを通常の真空プレスにより加熱加圧し、層間絶縁膜123の樹脂を硬化させて、多層プリント回路板を形成することができる。
以下、参考形態の例を付記する。
1.金属箔または樹脂フィルムからなるキャリア材料と、
前記キャリア材料の一方の面に設けられた層間絶縁膜と、を備えるキャリア材料付き層間絶縁膜であって、
前記層間絶縁膜は、樹脂が含浸された基材からなり、
前記基材の厚さは、8μm以上、20μm以下であり、
前記樹脂を170℃で1時間、30kgf/cm 2 の圧力で硬化したとき、TMA法を用いて測定した、前記層間絶縁膜の平面方向の伸び率が0.05%以下である、キャリア材料付き層間絶縁膜。
2.前記基材がガラス織布である、1.に記載のキャリア材料付き層間絶縁膜。
3.前記樹脂を170℃で1時間、30kgf/cm 2 の圧力で硬化したとき、200℃における前記層間絶縁膜の貯蔵弾性率は、2MPa以上、20MPa以下である、2.に記載のキャリア材料付き層間絶縁膜。
4.前記層間絶縁膜の200℃での前記貯蔵弾性率は、前記層間絶縁膜の室温下における貯蔵弾性率に対して、30%以上、80%以下である、3.に記載のキャリア材料付き層間絶縁膜。
5.前記樹脂はエポキシ樹脂を含む、1.に記載のキャリア材料付き層間絶縁膜。
6.前記樹脂が無機フィラーを含む、1.に記載のキャリア材料付き層間絶縁膜。
7.前記樹脂がBステージ化された状態である、1.に記載のキャリア材料付き層間絶縁膜。
8.前記キャリア材料が金属箔からなる1.に記載のキャリア材料付き層間絶縁膜を積層して得られる多層プリント回路板。
9.前記キャリア材料が樹脂フィルムからなる1.に記載のキャリア材料付き層間絶縁膜の層間絶縁膜と内層回路板を積層して得られる多層プリント回路板。
Claims (9)
- 金属箔または樹脂フィルムからなるキャリア材料と、
前記キャリア材料の一方の面に設けられた層間絶縁膜と、を備えるキャリア材料付き層間絶縁膜であって、
前記層間絶縁膜は、樹脂が含浸された基材からなり、
前記基材の厚さは、8μm以上、20μm以下であり、
前記樹脂を170℃で1時間、30kgf/cm2の圧力で硬化したとき、TMA法を用いて測定した、前記層間絶縁膜の平面方向の伸び率が0.05%以下である、キャリア材料付き層間絶縁膜。 - 前記基材がガラス織布である、請求項1に記載のキャリア材料付き層間絶縁膜。
- 前記樹脂を170℃で1時間、30kgf/cm2の圧力で硬化したとき、200℃における前記層間絶縁膜の貯蔵弾性率は、2MPa以上、20MPa以下である、請求項2に記載のキャリア材料付き層間絶縁膜。
- 前記層間絶縁膜の200℃での前記貯蔵弾性率は、前記層間絶縁膜の室温下における貯蔵弾性率に対して、30%以上、80%以下である請求項3に記載のキャリア材料付き層間絶縁膜。
- 前記樹脂はエポキシ樹脂を含む、請求項1に記載のキャリア材料付き層間絶縁膜。
- 前記樹脂が無機フィラーを含む、請求項1に記載のキャリア材料付き層間絶縁膜。
- 前記樹脂がBステージ化された状態である、請求項1に記載のキャリア材料付き層間絶縁膜。
- 前記キャリア材料が金属箔からなる請求項1に記載のキャリア材料付き層間絶縁膜を積層して得られる多層プリント回路板。
- 前記キャリア材料が樹脂フィルムからなる請求項1に記載のキャリア材料付き層間絶縁膜の層間絶縁膜と内層回路板を積層して得られる多層プリント回路板。
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JP2001214147A (ja) * | 2000-01-31 | 2001-08-07 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用層間絶縁接着剤 |
JP2002226816A (ja) * | 2001-01-30 | 2002-08-14 | Nippon Chem Ind Co Ltd | 難燃性接着剤組成物、及びそれを用いる難燃性接着剤フィルム、難燃性接着剤付金属箔並びにプリント配線板 |
JP2003082066A (ja) * | 2001-09-12 | 2003-03-19 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物、プリプレグ及び積層板 |
JP2003283142A (ja) * | 2002-03-27 | 2003-10-03 | Sumitomo Bakelite Co Ltd | 樹脂組成物および樹脂組成物の製造方法 |
JP2003340952A (ja) * | 2002-05-28 | 2003-12-02 | Mitsubishi Gas Chem Co Inc | アディティブ用繊維布基材入りbステージ樹脂組成物シートの製造方法。 |
JP2006176795A (ja) * | 2006-02-16 | 2006-07-06 | Sumitomo Bakelite Co Ltd | 多層プリント配線板用層間絶縁樹脂組成物 |
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KR20090109114A (ko) | 2009-10-19 |
TW200842137A (en) | 2008-11-01 |
TWI496805B (zh) | 2015-08-21 |
JPWO2008099596A1 (ja) | 2010-05-27 |
CN101611660A (zh) | 2009-12-23 |
US8637151B2 (en) | 2014-01-28 |
CN101611660B (zh) | 2012-01-25 |
EP2129200A1 (en) | 2009-12-02 |
US20100032192A1 (en) | 2010-02-11 |
WO2008099596A1 (ja) | 2008-08-21 |
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