JP2013229457A5 - - Google Patents
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- Publication number
- JP2013229457A5 JP2013229457A5 JP2012100634A JP2012100634A JP2013229457A5 JP 2013229457 A5 JP2013229457 A5 JP 2013229457A5 JP 2012100634 A JP2012100634 A JP 2012100634A JP 2012100634 A JP2012100634 A JP 2012100634A JP 2013229457 A5 JP2013229457 A5 JP 2013229457A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- base plate
- insulating substrate
- area
- joined body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 22
- 229910052709 silver Inorganic materials 0.000 claims 22
- 239000004332 silver Substances 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 17
- 239000010931 gold Substances 0.000 claims 17
- 229910052737 gold Inorganic materials 0.000 claims 17
- 229910000679 solder Inorganic materials 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 16
- 229910052751 metal Inorganic materials 0.000 claims 16
- 238000010438 heat treatment Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 5
- 239000000956 alloy Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 238000005245 sintering Methods 0.000 claims 4
- 229910002601 GaN Inorganic materials 0.000 claims 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 2
- 239000010432 diamond Substances 0.000 claims 2
- 229910003460 diamond Inorganic materials 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012100634A JP5968046B2 (ja) | 2012-04-26 | 2012-04-26 | 半導体装置および半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012100634A JP5968046B2 (ja) | 2012-04-26 | 2012-04-26 | 半導体装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013229457A JP2013229457A (ja) | 2013-11-07 |
| JP2013229457A5 true JP2013229457A5 (enrdf_load_stackoverflow) | 2014-12-25 |
| JP5968046B2 JP5968046B2 (ja) | 2016-08-10 |
Family
ID=49676805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012100634A Expired - Fee Related JP5968046B2 (ja) | 2012-04-26 | 2012-04-26 | 半導体装置および半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5968046B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6265693B2 (ja) * | 2013-11-12 | 2018-01-24 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP2015216160A (ja) * | 2014-05-08 | 2015-12-03 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| EP3144986A4 (en) * | 2014-05-16 | 2017-11-22 | National Institute of Advanced Industrial Science and Technology | Thermoelectric conversion element and thermoelectric conversion module |
| JP2018098219A (ja) * | 2015-03-18 | 2018-06-21 | 株式会社日立製作所 | 半導体装置及びその製造方法。 |
| JP6917127B2 (ja) * | 2016-08-23 | 2021-08-11 | ローム株式会社 | 半導体装置及びパワーモジュール |
| DE102016118784A1 (de) | 2016-10-04 | 2018-04-05 | Infineon Technologies Ag | Chipträger, konfiguriert zur delaminierungsfreien Kapselung und stabilen Sinterung |
| JP6991950B2 (ja) * | 2018-09-26 | 2022-01-13 | 日立Astemo株式会社 | パワーモジュール |
| CN114256162A (zh) * | 2020-09-23 | 2022-03-29 | 世界先进积体电路股份有限公司 | 芯片结构及电子装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4904767B2 (ja) * | 2005-10-17 | 2012-03-28 | 富士電機株式会社 | 半導体装置 |
| JP2011029472A (ja) * | 2009-07-28 | 2011-02-10 | Hitachi Metals Ltd | 接合材料及びこれを用いた半導体の実装方法並びに半導体装置 |
-
2012
- 2012-04-26 JP JP2012100634A patent/JP5968046B2/ja not_active Expired - Fee Related
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