JP2013197531A5 - - Google Patents
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- Publication number
- JP2013197531A5 JP2013197531A5 JP2012066194A JP2012066194A JP2013197531A5 JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5 JP 2012066194 A JP2012066194 A JP 2012066194A JP 2012066194 A JP2012066194 A JP 2012066194A JP 2013197531 A5 JP2013197531 A5 JP 2013197531A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- protective resin
- bonding wire
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 242
- 229920005989 resin Polymers 0.000 claims description 241
- 239000011347 resin Substances 0.000 claims description 241
- 230000001681 protective effect Effects 0.000 claims description 152
- 238000007789 sealing Methods 0.000 claims description 72
- 229910052751 metal Inorganic materials 0.000 claims description 71
- 239000002184 metal Substances 0.000 claims description 71
- 238000000576 coating method Methods 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- -1 sulfide ions Chemical class 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 description 37
- 230000007797 corrosion Effects 0.000 description 37
- 238000000034 method Methods 0.000 description 37
- 239000002253 acid Substances 0.000 description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 16
- 238000012986 modification Methods 0.000 description 16
- 230000004048 modification Effects 0.000 description 16
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000007921 spray Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 235000019589 hardness Nutrition 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012066194A JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012066194A JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016165026A Division JP2016195292A (ja) | 2016-08-25 | 2016-08-25 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013197531A JP2013197531A (ja) | 2013-09-30 |
| JP2013197531A5 true JP2013197531A5 (enExample) | 2014-08-28 |
Family
ID=49396066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012066194A Pending JP2013197531A (ja) | 2012-03-22 | 2012-03-22 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013197531A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102063508B1 (ko) * | 2013-06-13 | 2020-01-08 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 조명 시스템 |
| US10037936B2 (en) | 2015-11-02 | 2018-07-31 | Mediatek Inc. | Semiconductor package with coated bonding wires and fabrication method thereof |
| US10847488B2 (en) | 2015-11-02 | 2020-11-24 | Mediatek Inc. | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires |
| DE102016109349A1 (de) | 2016-05-20 | 2017-11-23 | Infineon Technologies Ag | Chipgehäuse, verfahren zum bilden eines chipgehäuses und verfahren zum bilden eines elektrischen kontakts |
| FR3058260A1 (fr) * | 2016-11-03 | 2018-05-04 | Stmicroelectronics (Grenoble 2) Sas | Procede de realisation d'une connexion electrique entre une puce electronique et une plaque de support et dispositif electronique |
| US10224306B2 (en) | 2016-11-03 | 2019-03-05 | Stmicroelectronics (Grenoble 2) Sas | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device |
| JP7096649B2 (ja) * | 2017-06-21 | 2022-07-06 | スタンレー電気株式会社 | 半導体装置 |
| DE102018113190B4 (de) * | 2018-06-04 | 2020-03-12 | Epcos Ag | Vorrichtung mit einem elektrokeramischem Bauteil |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111569A (ja) * | 1984-11-06 | 1986-05-29 | Shin Etsu Chem Co Ltd | 樹脂封止半導体装置 |
| JPH0651407B2 (ja) * | 1985-05-23 | 1994-07-06 | 京セラ株式会社 | サ−マルプリントヘツド |
| JPS6224650A (ja) * | 1985-07-24 | 1987-02-02 | Hitachi Vlsi Eng Corp | 半導体装置 |
| JPS6297360A (ja) * | 1985-10-24 | 1987-05-06 | Mitsubishi Metal Corp | 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線 |
| JPH0582678A (ja) * | 1991-09-24 | 1993-04-02 | Sanyo Electric Co Ltd | 混成集積回路 |
| JP2001226565A (ja) * | 2000-12-25 | 2001-08-21 | Nitto Denko Corp | 半導体装置 |
| JP2003092379A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置 |
| JP2004064033A (ja) * | 2001-10-23 | 2004-02-26 | Sumitomo Electric Wintec Inc | ボンディングワイヤー |
| JP4189626B2 (ja) * | 2002-03-08 | 2008-12-03 | 信越化学工業株式会社 | 有機ケイ素化合物の精製方法及び硬化性シリコーン組成物 |
| JP2006241411A (ja) * | 2005-03-07 | 2006-09-14 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびその製法ならびにそれを用いた半導体装置 |
| JP2009263601A (ja) * | 2008-04-30 | 2009-11-12 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| US20100164083A1 (en) * | 2008-12-29 | 2010-07-01 | Numonyx B.V. | Protective thin film coating in chip packaging |
| EP2444999A4 (en) * | 2009-06-18 | 2012-11-14 | Rohm Co Ltd | SEMICONDUCTOR DEVICE |
| JPWO2011070739A1 (ja) * | 2009-12-07 | 2013-04-22 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置 |
-
2012
- 2012-03-22 JP JP2012066194A patent/JP2013197531A/ja active Pending
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