JP2013182942A5 - - Google Patents

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Publication number
JP2013182942A5
JP2013182942A5 JP2012044300A JP2012044300A JP2013182942A5 JP 2013182942 A5 JP2013182942 A5 JP 2013182942A5 JP 2012044300 A JP2012044300 A JP 2012044300A JP 2012044300 A JP2012044300 A JP 2012044300A JP 2013182942 A5 JP2013182942 A5 JP 2013182942A5
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JP
Japan
Prior art keywords
line
semiconductor device
portions
boundary line
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012044300A
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English (en)
Japanese (ja)
Other versions
JP5986399B2 (ja
JP2013182942A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012044300A priority Critical patent/JP5986399B2/ja
Priority claimed from JP2012044300A external-priority patent/JP5986399B2/ja
Priority to US13/772,440 priority patent/US9081284B2/en
Publication of JP2013182942A publication Critical patent/JP2013182942A/ja
Publication of JP2013182942A5 publication Critical patent/JP2013182942A5/ja
Application granted granted Critical
Publication of JP5986399B2 publication Critical patent/JP5986399B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012044300A 2012-02-29 2012-02-29 半導体装置の製造方法 Expired - Fee Related JP5986399B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012044300A JP5986399B2 (ja) 2012-02-29 2012-02-29 半導体装置の製造方法
US13/772,440 US9081284B2 (en) 2012-02-29 2013-02-21 Method of manufacturing forming conductive line pattern in boundary region

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012044300A JP5986399B2 (ja) 2012-02-29 2012-02-29 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013182942A JP2013182942A (ja) 2013-09-12
JP2013182942A5 true JP2013182942A5 (enExample) 2015-04-16
JP5986399B2 JP5986399B2 (ja) 2016-09-06

Family

ID=49001948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012044300A Expired - Fee Related JP5986399B2 (ja) 2012-02-29 2012-02-29 半導体装置の製造方法

Country Status (2)

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US (1) US9081284B2 (enExample)
JP (1) JP5986399B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6497056B2 (ja) * 2014-12-12 2019-04-10 三菱電機株式会社 液晶表示装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595843A (en) * 1995-03-30 1997-01-21 Intel Corporation Layout methodology, mask set, and patterning method for phase-shifting lithography
JP3375828B2 (ja) * 1996-06-19 2003-02-10 三菱電機株式会社 半導体装置の製法および該製法に用いられるフォトマスク
KR100502797B1 (ko) * 1997-12-01 2005-10-19 삼성전자주식회사 액정 표시 장치 및 그의 제조 방법
US7256873B2 (en) * 2004-01-28 2007-08-14 Asml Netherlands B.V. Enhanced lithographic resolution through double exposure
JP5106747B2 (ja) * 2004-10-27 2012-12-26 ルネサスエレクトロニクス株式会社 パターン形成方法、半導体装置の製造方法及び露光用マスクセット
KR100763227B1 (ko) * 2006-04-04 2007-10-04 삼성전자주식회사 분리 노광 방법을 이용한 포토마스크와 그 제조 방법 및 제조 장치
JP5214904B2 (ja) * 2007-04-12 2013-06-19 ルネサスエレクトロニクス株式会社 固体撮像素子の製造方法
JP2009049161A (ja) * 2007-08-20 2009-03-05 Fujitsu Microelectronics Ltd ショット分割繋ぎ位置選択方法及びショット分割露光システム
JP2009145681A (ja) 2007-12-14 2009-07-02 Hitachi Displays Ltd 表示装置の製造方法
JP2013033870A (ja) 2011-08-02 2013-02-14 Canon Inc 半導体デバイスおよびその製造方法

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