JP2013151396A5 - - Google Patents

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Publication number
JP2013151396A5
JP2013151396A5 JP2012013663A JP2012013663A JP2013151396A5 JP 2013151396 A5 JP2013151396 A5 JP 2013151396A5 JP 2012013663 A JP2012013663 A JP 2012013663A JP 2012013663 A JP2012013663 A JP 2012013663A JP 2013151396 A5 JP2013151396 A5 JP 2013151396A5
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JP
Japan
Prior art keywords
adhesive member
lead
free glass
mass
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012013663A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013151396A (ja
JP5732414B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012013663A external-priority patent/JP5732414B2/ja
Priority to JP2012013663A priority Critical patent/JP5732414B2/ja
Priority to CN201280060767.2A priority patent/CN104159872A/zh
Priority to PCT/JP2012/080121 priority patent/WO2013111434A1/ja
Priority to KR1020147018264A priority patent/KR101572774B1/ko
Priority to DE112012005758.9T priority patent/DE112012005758B4/de
Priority to US14/374,396 priority patent/US9196563B2/en
Priority to TW101148329A priority patent/TWI489594B/zh
Publication of JP2013151396A publication Critical patent/JP2013151396A/ja
Publication of JP2013151396A5 publication Critical patent/JP2013151396A5/ja
Publication of JP5732414B2 publication Critical patent/JP5732414B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012013663A 2012-01-26 2012-01-26 接合体および半導体モジュール Expired - Fee Related JP5732414B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012013663A JP5732414B2 (ja) 2012-01-26 2012-01-26 接合体および半導体モジュール
DE112012005758.9T DE112012005758B4 (de) 2012-01-26 2012-11-21 Gebondetes Bauelement und Halbleitermodul
PCT/JP2012/080121 WO2013111434A1 (ja) 2012-01-26 2012-11-21 接合体および半導体モジュール
KR1020147018264A KR101572774B1 (ko) 2012-01-26 2012-11-21 접합체 및 반도체 모듈
CN201280060767.2A CN104159872A (zh) 2012-01-26 2012-11-21 接合体及半导体模块
US14/374,396 US9196563B2 (en) 2012-01-26 2012-11-21 Bonded body and semiconductor module
TW101148329A TWI489594B (zh) 2012-01-26 2012-12-19 And the semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012013663A JP5732414B2 (ja) 2012-01-26 2012-01-26 接合体および半導体モジュール

Publications (3)

Publication Number Publication Date
JP2013151396A JP2013151396A (ja) 2013-08-08
JP2013151396A5 true JP2013151396A5 (enExample) 2013-10-17
JP5732414B2 JP5732414B2 (ja) 2015-06-10

Family

ID=48873175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012013663A Expired - Fee Related JP5732414B2 (ja) 2012-01-26 2012-01-26 接合体および半導体モジュール

Country Status (7)

Country Link
US (1) US9196563B2 (enExample)
JP (1) JP5732414B2 (enExample)
KR (1) KR101572774B1 (enExample)
CN (1) CN104159872A (enExample)
DE (1) DE112012005758B4 (enExample)
TW (1) TWI489594B (enExample)
WO (1) WO2013111434A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5726698B2 (ja) 2011-07-04 2015-06-03 株式会社日立製作所 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
JP5844299B2 (ja) 2013-03-25 2016-01-13 株式会社日立製作所 接合材、接合構造体
CN105683111B (zh) * 2013-12-04 2018-09-14 株式会社日立制作所 密封结构体、及密封结构体的制造方法
TWI642154B (zh) * 2013-12-25 2018-11-21 日商三菱綜合材料股份有限公司 電源模組用基板及其製造方法、電源模組
CN106536437B (zh) * 2014-09-19 2019-12-13 株式会社日立制作所 散热结构体及利用了散热结构体的半导体模块
US10014237B2 (en) * 2014-12-16 2018-07-03 Kyocera Corporation Circuit board having a heat dissipating sheet with varying metal grain size
DE102015104518B3 (de) * 2015-03-25 2016-03-10 Infineon Technologies Ag Verfahren zur Herstellung einer Schaltungsträgeranordnung mit einem Träger, der eine durch ein Aluminium-Siliziumkarbid-Metallmatrixkompositmaterial gebildete Oberfläche aufweist
JP6679025B2 (ja) * 2015-04-09 2020-04-15 ナミックス株式会社 接合体の製造方法
CN106025054A (zh) * 2016-06-29 2016-10-12 海宁市智慧光电有限公司 一种高可靠性超亮片式led光源
CN108257929B (zh) * 2016-12-29 2020-06-19 比亚迪股份有限公司 一种散热基板及其制备方法和应用以及电子元器件
US20190074416A1 (en) * 2017-09-06 2019-03-07 Coorstek Kk Silica glass member, process for producing the same, and process for bonding ceramic and silica glass
CN107683016A (zh) * 2017-11-21 2018-02-09 生益电子股份有限公司 一种快速散热pcb
KR102217222B1 (ko) * 2019-01-30 2021-02-19 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
DE102023108698A1 (de) * 2023-04-05 2024-10-10 Danfoss Silicon Power Gmbh Baugruppe zur Bereitstellung elektronischer Funktionalitäten und Mittel zur Qualitätssicherung einer Fixierschicht davon

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
US5188990A (en) * 1991-11-21 1993-02-23 Vlsi Packaging Materials Low temperature sealing glass compositions
JPH05175254A (ja) * 1991-12-20 1993-07-13 Nippon Electric Glass Co Ltd 低融点接着組成物
JPH08107166A (ja) * 1994-10-06 1996-04-23 Mitsubishi Materials Corp 放熱用フィン
JPH08259262A (ja) 1995-03-20 1996-10-08 Nippon Electric Glass Co Ltd 低融点封着用組成物
JPWO2003007370A1 (ja) * 2001-07-12 2004-11-04 株式会社日立製作所 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法
US6717276B2 (en) 2002-09-10 2004-04-06 Texas Instruments Incorporated Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
CN101164942A (zh) * 2006-10-19 2008-04-23 北京印刷学院 一种无铅碲酸盐低熔封接玻璃
JP5414409B2 (ja) * 2009-01-16 2014-02-12 日立粉末冶金株式会社 低融点ガラス組成物、それを用いた低温封着材料及び電子部品
WO2011013776A1 (ja) * 2009-07-31 2011-02-03 旭硝子株式会社 半導体デバイス用封着ガラス、封着材料、封着材料ペースト、および半導体デバイスとその製造方法
JP2011251329A (ja) 2010-06-04 2011-12-15 Sumitomo Metal Mining Co Ltd 高温鉛フリーはんだペースト
TWI448444B (zh) 2010-08-11 2014-08-11 Hitachi Ltd A glass composition for an electrode, a paste for an electrode for use, and an electronic component to which the electrode is used
JP5726698B2 (ja) 2011-07-04 2015-06-03 株式会社日立製作所 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
JP5519715B2 (ja) 2012-02-07 2014-06-11 株式会社日立製作所 接合用無鉛ガラスおよびこの接合用無鉛ガラスを用いた平板型ディスプレイ装置

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